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Alkaline plating baths and electroplating process

Assignee: Electrochemical Products Inc
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Filing: 1982-09-28
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Granted: 1983-06-21
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Expires: 2002-09-28
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Abstract

Abstract Cyanide-free plating baths for the electrodeposition of copper alloys comprise aqueous alkaline mixtures which contain copper and either lead or tin ions and a chelating agent selected from glucoheptonic acid and its salts. Processes for electroplating using the bath and for removing the metal ions from the spent baths by pH adjustment are also disclosed.

Inventors

  • 👤 Ewald H. McCoy

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 22:40
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/56; C25D3/58

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 50 words
A cyanide-free plating bath for the electrodeposition of copper containing alloys consists of an aqueous solution containing copper ions and ions selected from tin and lead ions, a chelating agent selected from glucoheptonic acid and salts thereof, and sufficient caustic to have a pH of about 10 to about 13.5.
Claim 2
Dependent Claim 50 words
A cyanide-free plating bath for the electrodeposition of copper containing alloys consists of an aqueous solution containing copper ions and ions selected from tin and lead ions, a chelating agent selected from glucoheptonic acid and salts thereof, and sufficient caustic to have a pH of about 10 to about 13.5.
Claim 3
Dependent Claim 11 words
A bath of claim 1 which contains copper and tin ions.
Claim 4
Dependent Claim 11 words
A bath of claim 1 which contains copper and lead ions.
Claim 5
Dependent Claim 20 words
A bath of claim 2, which contains 20 to 30 grams/liter of copper and 1.25 to 6.0 grams/liter of tin.
Claim 6
Dependent Claim 20 words
A bath of claim 3 which contains 20 to 30 grams/liter of copper and 0.05 to 1.5 grams/liter of lead.
Claim 7
Dependent Claim 17 words
A bath of claim 1 in which the chelating agent is the sodium salt of glucoheptonic acid.
Claim 8
Dependent Claim 15 words
A bath concentrate which upon dilution with water yields a plating bath of claim 1.
Claim 9
Dependent Claim 90 words
The method of electrodepositing a copper alloy selected from copper/tin and copper/lead alloys upon a conductive surface of an object which comprises connecting the conductive surface to the negative end of a source of electricity, placing the conducting surface in a plating bath of claim 1, placing into the same plating bath an anode which is connected to a positive end of a source of electricity and then passing an electrical current through the plating bath so that a plate of the desired alloy is deposited upon the conductive surface.

References Cited (Backward Citations)

US2700646A Cited
US3111465A Cited
US3219560A Cited
US3642591A Cited
US3616291A Cited
DE2635560C3 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-06-20 1986-12-20 1987-06-21 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-06-20 1990-12-20 1991-06-21 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-06-20 1994-12-20 1995-06-21 $7700.00 Window Closed / Lapsed

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