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US4387192A Expired / Lapsed US ⏱️ 0.0 years remaining

Heat resistant polyamide-imide resin from polycarboxylic acid-polyisocyanate modified with unsaturated monomer

Assignee: Kanegafuchi Chemical Industry Co Ltd
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Filing: 1980-07-09
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Granted: 1983-06-07
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Expires: 2000-07-09
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Abstract

Abstract A heat resistant resin composition comprising a polyamide imide resin having carboxyl groups and modified with an N-methylolated methacryl- or acryl-amide compound and, when desired, further with a bismaleimide compound. The composition has improved properties over conventional polyamide imide resins. When the composition is used, for example, in the form of a film for printed circuit boards, the film has improved heat resistance and enhanced flexural strength and is capable of withstanding soldering baths at high temperatures.

Inventors

  • 👤 Kazuya Yonezawa
  • 👤 Kazuaki Kira
  • 👤 Hiroshi Wakabayashi
  • 👤 Hirosaku Nagano

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 16:05
CPC Classifications
C; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/14; H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/303; H01B3/305; H01B3/306; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0346

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 86 words
A heat resistant resin composition comprising the reaction product of (1) a polyamide imide resin having carboxyl groups produced from at least one aromatic polycarboxylic acid anhydride having at least three functional carboxyl groups and at least one organic diisocyanate and (2) a compound selected from the group consisting of N-methylolated acryalamide, N-methoxymethylacrylamide, N-butoxymethylacrylamide, N-methylolated methacrylamide and N-butoxymethylmethacrylamide, said compound (2) being used in an amount of 1.0 to 5.0 mole equivalent weights per mole equivalent weight of the carboxyl groups in the polyamide imide resin.
Claim 2
Dependent Claim 86 words
A heat resistant resin composition comprising the reaction product of (1) a polyamide imide resin having carboxyl groups produced from at least one aromatic polycarboxylic acid anhydride having at least three functional carboxyl groups and at least one organic diisocyanate and (2) a compound selected from the group consisting of N-methylolated acryalamide, N-methoxymethylacrylamide, N-butoxymethylacrylamide, N-methylolated methacrylamide and N-butoxymethylmethacrylamide, said compound (2) being used in an amount of 1.0 to 5.0 mole equivalent weights per mole equivalent weight of the carboxyl groups in the polyamide imide resin.
Claim 3
Dependent Claim 24 words
The heat resistant resin composition of claim 1 wherein said polyamide imide resin having carboxyl groups contains at least 4 carboxyl groups per molecule.

References Cited (Backward Citations)

US3541038A Cited
US3658773A Cited
US3764501A Cited
GB1342518A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-06-06 1986-12-06 1987-06-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-06-06 1990-12-06 1991-06-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-06-06 1994-12-06 1995-06-07 $7700.00 Window Closed / Lapsed

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