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Reactive sputter etching of aluminum

Assignee: Intersil Corp
•
Filing: 1981-08-24
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Granted: 1983-06-07
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Expires: 2001-08-24
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Abstract

Abstract An improved sputter etching apparatus for etching a substrate with a reactive gas. The improvement in the apparatus comprises utilizing a cryogenic pump as the vacuum means to evacuate the plasma chamber. The improved apparatus of the invention is particularly useful for the reactive sputter etching of aluminum substrates utilizing a highly reactive gas such as boron trichloride.

Inventors

  • 👤 Hans W. Lehmann
  • 👤 Klaus Frick
  • 👤 Roland W. Widmer

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 22:05
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/32431; H01J37/32798; H01J37/32816; H01J37/32834; C; C23; C23F; C23F4/00; H01J37/02; H01J37/18; H01J37/34

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 89 words
In a process for the reactive sputter etching of a substrate with a reactive gas comprising: placing said substrate in a suitable plasma chamber; introducing said reactive gas into said chamber under reduced pressure; generating a plasma discharge in said chamber thereby etching the substrate; and maintaining a high vacuum in said chamber with vacuum pump means thereby continuously removing volatile products of the etching process, the improvement comprising utilizing a cryogenic pump to maintain the high vacuum, thereby improving the reproducibility of the etch being a cryogenic pump.
Claim 2
Dependent Claim 89 words
In a process for the reactive sputter etching of a substrate with a reactive gas comprising: placing said substrate in a suitable plasma chamber; introducing said reactive gas into said chamber under reduced pressure; generating a plasma discharge in said chamber thereby etching the substrate; and maintaining a high vacuum in said chamber with vacuum pump means thereby continuously removing volatile products of the etching process, the improvement comprising utilizing a cryogenic pump to maintain the high vacuum, thereby improving the reproducibility of the etch being a cryogenic pump.
Claim 3
Dependent Claim 17 words
A process according to claim 1, wherein the substrate to be etched comprises a layer of aluminum.
Claim 4
Dependent Claim 15 words
A process according to claims 1 or 2, wherein said reactive gas is boron trichloride.

References Cited (Backward Citations)

US3719052A Cited
US3788096A Cited
US3994793A Cited
US4263730A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-06-06 1986-12-06 1987-06-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-06-06 1990-12-06 1991-06-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-06-06 1994-12-06 1995-06-07 $7700.00 Window Closed / Lapsed

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