Solvent-free polyurethane resin mixture

Claim 2

A solvent-free, curable thermosetting resin mixture useful for the insulation of electrical conductors and windings, which comprises: (a) at least one reactive liquid polyepoxide compound, (b) at least one reactive liquid polyisocyanate, (c) from 0.01 percent to 5 percent by wt based on the total weight of the mixture of at least one latent hardener for said components (a) and (b), (d) an effective cross-linking amount of triallyl cyanurate, said mixture containing from 2 to 5.5 equivalents of said polyisocyanate per equivalent of polyepoxide compound.

Claim 3

The mixture of claim 1, wherein the amount of said triallyl cyanurate in the total mixture ranges from 0.1% to 30% by weight.

Claim 4

The mixture of claim 1 or 2, wherein said polyisocyanate is a low viscosity aliphatic, cycloaliphatic or aromatic, monomeric or oligomeric compound, a carbodiimide of said monomeric compound, or mixtures thereof.

Claim 5

The mixture of claim 3, wherein said polyisocyanate is a mixture of diphenylmethane 4,4'-diisocyanate and 2,4'-diisocyanate, isophorone diisocyanate and mixtures thereof.

Claim 6

The mixture of claim 3, wherein said polyisocyanate is butane 1,1- or 1,2- or 1,4-diisocyanate, propane 1,3-diisocyanate, 2-methylbutane 1,4-diisocyanate, pentane 1,5-diisocyanate, 2,2-dimethylpentane 1,5-diisocyanate, hexane 1,6-diisocyanate, heptane 1,7-diisocyanate, octane 1,8-diisocyanate, nonane 1,9-diisocyanate or decane, 1,10-diisocyanate.

Claim 7

The mixture of claim 1, wherein said polyepoxy compound is bisphenol A diglycidyl ether.

Claim 8

The mixture of claim 1, wherein said latent hardener is an amine complex of BCl 3 or BF 3 .

Claim 9

The mixture of claim 7, wherein said amine is a tertiary amine.

Claim 10

The mixture of claim 1, wherein said polyepoxide comound is butadiene diepoxide, 3,4-epoxycyclohexylmethyl-(3,4-epoxy)-cyclohexanecarboxylate, vinylcyclohexene dioxide, 4,4'-di-(1,2-epoxyethyl)diphenylether, 4,4'-di-(1,2-epoxyethyl)-biphenyl, 2,2-bis-(3,4-epoxycyclohexyl)propane, the diglycidyl ether of resorcinol, of phloroglucinol or a methylphloroglucinol, bis(2,3-epoxycyclopentyl)ether, 2-(3,4-epoxy)cyclohexane-5,5-spiro-(3,4-epoxy)-cyclohexane-m-dioxane, bis(3,4-epoxy-6-methylcyclohexyl) adipate, N,N'-m-phenylene bis-(4,5-epoxy-1,2-cyclohexandicarboximide), the triglycidylether of p-aminophenol, polyallyl glycidyl ether, 1,3,5-tri-(1,2-epoxyethyl)-benzene, 2,2',4,4'-tetraglycidoxy benzophenone, tetraglycidoxytetraphenylethane, the polyglycidyl ether of a phenol/formaldehyde novolac, the triglycidyl ether of glycerol or the triglycidyl ether of trimethylolpropane.

Claim 11

A method for the insulation of electrical machinery, which comprises: applying the resin mixture of claim 1 to an electrical component.