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US4379318A Expired / Lapsed US ⏱️ 0.0 years remaining

Overcurrent safety construction for a printed circuit board

Assignee: Nissan Motor Co Ltd
•
Filing: 1980-09-16
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Granted: 1983-04-05
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Expires: 2000-09-16
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Abstract

Abstract In a printed circuit board, a safety means is provided to prevent the circuit elements such as semiconductor devices, resistors, and the like from suffering damage due to overcurrent flow. The safety means thus improved has a narrow gap provided within a metal foil pattern on the surface of the printed circuit board and a low-melting point metal such as solder bridges this gap to connect the metal foil.

Inventors

  • 👤 Tetsuo Ootsuka

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 08:10
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; H05K1/00; H05K1/02; H05K1/0286; H05K1/0293; H05K1/11; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0305; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09381; H05K2201/10; H05K2201/10007; H05K2201/10181; H05K2203/00; H05K2203/17; H05K2203/173; H05K2203/175; H05K3/3447; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49107; Y10T29/49117; Y10T29/49124; Y10T29/49155

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 123 words
A method of manufacturing a printed circuit board having an overcurrent safety construction for protecting electrical components of the printed circuit board against overcurrent damage, which comprises the steps of: (a) forming a metal foil pattern on the board and simultaneously forming a narrow gap in said metal foil between the position at which said pattern is to be connected to a power source and the position at which said components to be protected are to be mounted on said board; (b) mounting said circuit components on said board; and (c) dipping the printed circuit board in a reservoir of molten solder so as to form simultaneously a bridge across the gap and connections to said components in circuit mounted on the board.
Claim 2
Independent Claim 123 words
A method of manufacturing a printed circuit board having an overcurrent safety construction for protecting electrical components of the printed circuit board against overcurrent damage, which comprises the steps of: (a) forming a metal foil pattern on the board and simultaneously forming a narrow gap in said metal foil between the position at which said pattern is to be connected to a power source and the position at which said components to be protected are to be mounted on said board; (b) mounting said circuit components on said board; and (c) dipping the printed circuit board in a reservoir of molten solder so as to form simultaneously a bridge across the gap and connections to said components in circuit mounted on the board.
Claim 3
Dependent Claim 28 words
The method as set forth in claim 1 wherein the step of forming a narrow gap comprises forming said narrow gap in the form of non-aligned line segments.

References Cited (Backward Citations)

CA752985A Cited
GB867090A Cited
GB1152246A Cited
GB1228599A Cited
US3646666A Cited
GB1336938A Cited
US3699403A Cited
US3967161A Cited
US4140988A Cited
US4272753A Cited
US4296398A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-04-04 1986-10-04 1987-04-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-04-04 1990-10-04 1991-04-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-04-04 1994-10-04 1995-04-05 $7700.00 Window Closed / Lapsed

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