Method for producing mixed crystal wafer using special temperature control for preliminary gradient and constant layer deposition suitable for fabricating light-emitting diode

Claim 1

A method of manufacturing a mixed crystal compound semiconductor wafer for light emitting diodes which is constituted of III and V elements in the periodic table comprising the steps of: providing a monocrystalline substrate of III-V semiconductor material; epitaxially growing a base layer of the same material as that of said substrate on said substrate; epitaxially growing on said base layer an initial gradient sublayer having a mixed crystal ratio varying continuously from that of said base layer to a first intermediate value at a constant temperature; and epitaxially growing on said initial gradient sublayer at least one combination sublayer including a constant sublayer having a constant mixed crystal ratio corresponding to said first value and a gradient sublayer formed on said constant sublayer and having a mixed crystal ratio continuously varying from said first intermediate value to that of a subsequent constant layer to be formed thereon, the epitaxial growth of said constant sublayer being performed at a varying temperature and the epitaxial growth of said gradient sublayer being performed at a constant temperature.

Claim 2

A method of manufacturing a mixed crystal compound semiconductor wafer for light emitting diodes which is constituted of III and V elements in the periodic table comprising the steps of: providing a monocrystalline substrate of III-V semiconductor material; epitaxially growing a base layer of the same material as that of said substrate on said substrate; epitaxially growing on said base layer an initial gradient sublayer having a mixed crystal ratio varying continuously from that of said base layer to a first intermediate value at a constant temperature; and epitaxially growing on said initial gradient sublayer at least one combination sublayer including a constant sublayer having a constant mixed crystal ratio corresponding to said first value and a gradient sublayer formed on said constant sublayer and having a mixed crystal ratio continuously varying from said first intermediate value to that of a subsequent constant layer to be formed thereon, the epitaxial growth of said constant sublayer being performed at a varying temperature and the epitaxial growth of said gradient sublayer being performed at a constant temperature.

Claim 7

A method of manufacturing a mixed crystal compound semiconductor wafer for light emitting diodes comprising the steps of: providing a wafer of a semiconductor material selected from the group consisting of GaAs, GaP and InP; epitaxially growing a layer of the same semiconductor material as that of said substrate on said substrate; epitaxially growing a first gradient layer having a varying mixed crystal ratio at a constant substrate temperature with said mixed crystal ratio varying to an intermediate value from the mixed crystal ratio of said first-mentioned layer; epitaxially growing a first constant layer having a constant mixed crystal ratio on said first gradient layer; epitaxially growing a second gradient layer on said first constant layer while holding the substrate temperature constant; epitaxially growing a second constant layer having a mixed crystal ratio on said second gradient layer; epitaxially growing a third gradient layer on said second constant layer at a constant substrate temperature; and growing a third constant layer on said third gradient layer, a PN junction being formed in said third constant layer, said first and second constant layers being grown at a varying temperature and said third constant layer being epitaxially grown at a constant substrate temperature.

Claim 8

A method of manufacturing a mixed crystal compound semiconductor wafer for light emitting diodes comprising the steps of: providing a wafer of a semiconductor material selected from the group consisting of GaAs, GaP and InP; epitaxially growing a layer of the same semiconductor material as that of said substrate on said substrate; epitaxially growing a first gradient layer having a varying mixed crystal ratio at a constant substrate temperature with said mixed crystal ratio varying to an intermediate value from the mixed crystal ratio of said first-mentioned layer; epitaxially growing a first constant layer having a constant mixed crystal ratio on said first gradient layer; epitaxially growing a second gradient layer on said first constant layer while holding the substrate temperature constant; epitaxially growing a second constant layer having a mixed crystal ratio on said second gradient layer; epitaxially growing a third gradient layer on said second constant layer at a constant substrate temperature; and growing a third constant layer on said third gradient layer, a PN junction being formed in said third constant layer, said first and second constant layers being grown at a varying temperature and said third constant layer being epitaxially grown at a constant substrate temperature.

Claim 12

A method of manufacturing a mixed crystal compound semiconductor wafers for light emitting diodes comprising the steps of: providing a GaP monocrystalline substrate doped with 2×10 17 atoms/cm 3 of sulfur and having a plane oriented 6° from the (100) plane toward the <110> direction; cleansing and mechanically-chemically polishing said substrate; disposing said substrate and high purity metallic Ga in a quartz boat in a horizontal-type quartz epitaxial reaction chamber; purging said reaction chamber of air; introducing high purity hydrogen gas into said reaction chamber at a flow rate of 650 ml/l/min relative to the volume of said reaction chamber; heating said high purity metallic Ga to a temperature of 760° C. and said substrate to a temperature 950° C.; introducing H 2 S gas diluted with nitrogen gas to a concentration of 30 ppm into said reaction chamber at a rate of 2.6 ml/l/min; simultaneously introducing high purity HCl gas into said reaction chamber at a rate 10.4 ml/l/min; introducing PH 3 gas into said reaction chamber diluted with hydrogen gas to a concentration of 12% at a flow rate of 57 ml/l/min; maintaining said temperature of said substrate at 950° C. for 10 minutes to form a GaP epitaxial layer on said substrate; lowering said temperature of said substrate to 930° C. over a 10 minute period to form a first constant layer; maintaining said temperature of said substrate at 930° C. for 20 minutes while introducing AsH 3 gas diluted with hydrogen gas to a concentration of 12% gradually at an increasing rate from 0 ml/l/min to 10.4 ml/l/min; gradually lowering said temperature of said substrate during a 10 minute period from 930° C. to 910° C. while maintaining constant the introduction rates of said hydrogen, said H 2 S, HCl, PH 3 and AsH 3 gases; maintaining said temperature of said substrate at 910° C. for 20 minutes while maintaining said introduction rates of said hydrogen, H 2 S, HCl and PH 3 gases while gradually increasing said introduction rate of AsH 3 gas to 20.8 ml/l/min; maintaining said introduction rates of said hydrogen, H 2 S, HCl, PH 3 and AsH 3 gases while lowering said temperature of said substrate from 910° C. to 890° C. during a 10 minute period; maintaining said introduction rates of said hydrogen, H 2 S, HCl and PH 3 gases and said temperature at 890° C. for 20 minutes while increasing said introduction rate of said AsH 3 gas to 31.2 ml/l/min; maintaining said introduction rates of said hydrogen, H 2 S, HCl, PH 3 and A s H 3 gases and said temperature of said substrate at 890° C. for 40 minutes; maintaining said introduction rates of said hydrogen, H 2 S, HCl, PH 3 and AsH 3 gases and said temperature of said substrate at 890° C. for 40 minutes while introducing high purity NH 3 gas at a rate of 52 ml/l/min; placing said wafer thus formed in a vacuum-sealed chamber with ZnAs 2 in a boat of high purity quartz; heating said substrate to a temperature of 720° C. to form a PN junction; and dividing said wafer into diode chips.

Claim 13

A method of manufacturing a mixed crystal compound semiconductor wafers for light emitting diodes comprising the steps of: providing a GaP monocrystalline substrate doped with 2×10 17 atoms/cm 3 of sulfur and having a plane oriented 6° from the (100) plane toward the <110> direction; cleansing and mechanically-chemically polishing said substrate; disposing said substrate and high purity metallic Ga in a quartz boat in a horizontal-type quartz epitaxial reaction chamber; purging said reaction chamber of air; introducing high purity hydrogen gas into said reaction chamber at a flow rate of 650 ml/l/min relative to the volume of said reaction chamber; heating said high purity metallic Ga to a temperature of 760° C. and said substrate to a temperature 950° C.; introducing H 2 S gas diluted with nitrogen gas to a concentration of 30 ppm into said reaction chamber at a rate of 2.6 ml/l/min; simultaneously introducing high purity HCl gas into said reaction chamber at a rate 10.4 ml/l/min; introducing PH 3 gas into said reaction chamber diluted with hydrogen gas to a concentration of 12% at a flow rate of 57 ml/l/min; maintaining said temperature of said substrate at 950° C. for 10 minutes to form a GaP epitaxial layer on said substrate; lowering said temperature of said substrate to 930° C. over a 10 minute period to form a first constant layer; maintaining said temperature of said substrate at 930° C. for 20 minutes while introducing AsH 3 gas diluted with hydrogen gas to a concentration of 12% gradually at an increasing rate from 0 ml/l/min to 10.4 ml/l/min; gradually lowering said temperature of said substrate during a 10 minute period from 930° C. to 910° C. while maintaining constant the introduction rates of said hydrogen, said H 2 S, HCl, PH 3 and AsH 3 gases; maintaining said temperature of said substrate at 910° C. for 20 minutes while maintaining said introduction rates of said hydrogen, H 2 S, HCl and PH 3 gases while gradually increasing said introduction rate of AsH 3 gas to 20.8 ml/l/min; maintaining said introduction rates of said hydrogen, H 2 S, HCl, PH 3 and AsH 3 gases while lowering said temperature of said substrate from 910° C. to 890° C. during a 10 minute period; maintaining said introduction rates of said hydrogen, H 2 S, HCl and PH 3 gases and said temperature at 890° C. for 20 minutes while increasing said introduction rate of said AsH 3 gas to 31.2 ml/l/min; maintaining said introduction rates of said hydrogen, H 2 S, HCl, PH 3 and A s H 3 gases and said temperature of said substrate at 890° C. for 40 minutes; maintaining said introduction rates of said hydrogen, H 2 S, HCl, PH 3 and AsH 3 gases and said temperature of said substrate at 890° C. for 40 minutes while introducing high purity NH 3 gas at a rate of 52 ml/l/min; placing said wafer thus formed in a vacuum-sealed chamber with ZnAs 2 in a boat of high purity quartz; heating said substrate to a temperature of 720° C. to form a PN junction; and dividing said wafer into diode chips.

Claim 14

A method of manufacturing a mixed crystal compound semiconductor wafers for light emitting diodes comprising the steps of: providing a GaP monocrystalline substrate doped with 2×10 -17 atoms/cm 3 of sulfur and having a plane oriented 6° from the (100) plane toward the <110> direction; cleansing and mechanically-chemically polishing said substrate; disposing said substrate and high purity Ga in a quartz boat in a horizontal-type quartz epitaxial reaction chamber; purging said reaction chamber of air; introducing high purity hydrogen gas into said reaction chamber at a flow rate of 700 ml/l/min relative to the volume of said reaction chamber; heating said substrate to a temperature 955° C.; introducing H 2 S diluted with nitrogen gas to a concentration of 30 ppm into said reaction chamber at a rate of 3.4 ml/l/min, simultaneously introducing high purity HCl gas into said reaction chamber at a rate 11.4 ml/l/min, and introducing PH 3 gas into said reaction chamber diluted with hydrogen gas to a concentration of 12% at a flow rate of 64 ml/l/min, while gradually lowering said temperature of said substrate to 930° during a 7 minute period to form a GaP epitaxial layer on said substrate; maintaining said temperature of said substrate at 930° C. for 14 minutes while introducing AsH 3 gas diluted with hydrogen gas to a concentration of 12% gradually at an increasing rate from 0 ml/l/min to 12.2 ml/l/min; gradually lowering said temperature of said substrate during a 7 minute period from 930° to 905° C. while maintaining constant the introduction rates of said hydrogen, said H 2 S, HCl, PH 3 and AsH 3 gases; maintaining said temperature of said substrate at 905° C. for 14 minutes while maintaining said introduction rates of said hydrogen, H 2 S, HCl and PH 3 gases while gradually increasing said introduction rate of AsH 3 gas to 24.4 ml/l/min; maintaining said introduction rates of said hydrogen, H 2 S, HCl, PH 3 and AsH 3 gases while lowering said temperature of said substrate from 905° C. to 880° C. during a 7 minute period; maintaining said introduction rates of said hydrogen, H 2 S, HCl and PH 3 gases and said temperature at 880° C. for 14 minutes while increasing said introduction rate of said AsH 3 gas to 36.6 ml/l/min; maintaining said introduction rates of said hydrogen, H 2 S, HCl, PH 3 and AsH 3 gases and said temperature of said substrate at 880° C. for 30 minutes while introducing high purity NH 3 gas at a rate of 52 ml/l/min; placing said wafer thus formed in a vacuum-sealed chamber with ZnAs 2 in a boat of high purity quartz; heating said substrate to a temperature of 720° C. to form a PN junction; and dividing said wafer into diode chips.

Claim 15

A method of manufacturing a mixed crystal compound semiconductor wafers for light emitting diodes comprising the steps of: providing a GaP monocrystalline substrate doped with 2×10 -17 atoms/cm 3 of sulfur and having a plane oriented 6° from the (100) plane toward the <110> direction; cleansing and mechanically-chemically polishing said substrate; disposing said substrate and high purity Ga in a quartz boat in a horizontal-type quartz epitaxial reaction chamber; purging said reaction chamber of air; introducing high purity hydrogen gas into said reaction chamber at a flow rate of 700 ml/l/min relative to the volume of said reaction chamber; heating said substrate to a temperature 955° C.; introducing H 2 S diluted with nitrogen gas to a concentration of 30 ppm into said reaction chamber at a rate of 3.4 ml/l/min, simultaneously introducing high purity HCl gas into said reaction chamber at a rate 11.4 ml/l/min, and introducing PH 3 gas into said reaction chamber diluted with hydrogen gas to a concentration of 12% at a flow rate of 64 ml/l/min, while gradually lowering said temperature of said substrate to 930° during a 7 minute period to form a GaP epitaxial layer on said substrate; maintaining said temperature of said substrate at 930° C. for 14 minutes while introducing AsH 3 gas diluted with hydrogen gas to a concentration of 12% gradually at an increasing rate from 0 ml/l/min to 12.2 ml/l/min; gradually lowering said temperature of said substrate during a 7 minute period from 930° to 905° C. while maintaining constant the introduction rates of said hydrogen, said H 2 S, HCl, PH 3 and AsH 3 gases; maintaining said temperature of said substrate at 905° C. for 14 minutes while maintaining said introduction rates of said hydrogen, H 2 S, HCl and PH 3 gases while gradually increasing said introduction rate of AsH 3 gas to 24.4 ml/l/min; maintaining said introduction rates of said hydrogen, H 2 S, HCl, PH 3 and AsH 3 gases while lowering said temperature of said substrate from 905° C. to 880° C. during a 7 minute period; maintaining said introduction rates of said hydrogen, H 2 S, HCl and PH 3 gases and said temperature at 880° C. for 14 minutes while increasing said introduction rate of said AsH 3 gas to 36.6 ml/l/min; maintaining said introduction rates of said hydrogen, H 2 S, HCl, PH 3 and AsH 3 gases and said temperature of said substrate at 880° C. for 30 minutes while introducing high purity NH 3 gas at a rate of 52 ml/l/min; placing said wafer thus formed in a vacuum-sealed chamber with ZnAs 2 in a boat of high purity quartz; heating said substrate to a temperature of 720° C. to form a PN junction; and dividing said wafer into diode chips.