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US4369220A
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Crossover dielectric inks used in forming a multilayer electrical circuit
Assignee: Intersil Corp
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Filing: 1982-05-05
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Granted: 1983-01-18
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Expires: 2002-05-05
Abstract
Abstract Novel thick-film crossover dielectric inks useful in constructing multilayer circuits on suitable substrates are provided. The subject inks comprise a barium magnesium borosilicate glass powder, a pinhole reducing component comprising silicon dioxide, an alkaline earth aluminum borosilicate glass having a high softening point or mixtures thereof and a suitable organic vehicle.
Inventors
- 👤 Ashok N. Prabhu
- 👤 Kenneth W. Hang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 15:48
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; C; C03; C03C; C03C8/00; C03C8/24; H05K3/4685; H10; H10D; H10D86/00; H10D86/80; H10D86/85; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926; Y10T428/25; Y10T428/252; Y10T428/258
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
169 words
A process of forming a multilayer electrical circuit on a circuit board comprising: (a) applying and firing on said board a conductor ink thereby forming a first conductor film; (b) forming a crossover dielectric film on the portion of said conductor film with will intersect a second conductor film in said circuit by applying and firing on said portion a crossover dielectric ink comprising: (1) from about 30 to about 70 percent by weight of a partially devitrifying barium magnesium borosilicate glass powder; (2) from about 10 to about 30 percent by weight of a pinhole reducing component selected from the group consisting of silicon dioxide, an alkaline earth aluminum borosilicate glass having a softening point above about 700° C., and mixtures thereof; and (3) from about 20 to about 50 percent by weight of a suitable organic vehicle; and (c) applying and firing a conductor ink on said board thereby forming a second conductor film having said crossover dielectric film interposed between said first and second conductor films.
Claim 2
Dependent Claim
169 words
A process of forming a multilayer electrical circuit on a circuit board comprising: (a) applying and firing on said board a conductor ink thereby forming a first conductor film; (b) forming a crossover dielectric film on the portion of said conductor film with will intersect a second conductor film in said circuit by applying and firing on said portion a crossover dielectric ink comprising: (1) from about 30 to about 70 percent by weight of a partially devitrifying barium magnesium borosilicate glass powder; (2) from about 10 to about 30 percent by weight of a pinhole reducing component selected from the group consisting of silicon dioxide, an alkaline earth aluminum borosilicate glass having a softening point above about 700° C., and mixtures thereof; and (3) from about 20 to about 50 percent by weight of a suitable organic vehicle; and (c) applying and firing a conductor ink on said board thereby forming a second conductor film having said crossover dielectric film interposed between said first and second conductor films.
Claim 3
Dependent Claim
17 words
A process in accordance with claim 1 wherein said circuit board is a porcelain-coated metal circuit board.
Claim 4
Dependent Claim
105 words
A circuit board having on a portion of the surface thereof a conductor film, said conductor film having on a predetermined portion a coating of a crossover dielectric ink comprising: (a) from about 30 to about 70 percent by weight of a partially devitrifying barium magnesium borosilicate glass powder; (b) from about 10 to about 30 percent by weight of a pinhole reducing component selected from the group consisting of silicon dioxide, an alkaline earth aluminum borosilicate glass having a softening point above about 700° C., and mixtures thereof; and (c) from about 20 to about 50 percent by weight of a suitable organic vehicle.
Claim 5
Dependent Claim
105 words
A circuit board having on a portion of the surface thereof a conductor film, said conductor film having on a predetermined portion a coating of a crossover dielectric ink comprising: (a) from about 30 to about 70 percent by weight of a partially devitrifying barium magnesium borosilicate glass powder; (b) from about 10 to about 30 percent by weight of a pinhole reducing component selected from the group consisting of silicon dioxide, an alkaline earth aluminum borosilicate glass having a softening point above about 700° C., and mixtures thereof; and (c) from about 20 to about 50 percent by weight of a suitable organic vehicle.
Claim 6
Dependent Claim
14 words
A circuit board in accordance with claim 3, wherein said board is porcelain-coated metal.
Claim 7
Dependent Claim
13 words
A circuit board in accordance with claim 4, wherein said metal is steel.
Claim 8
Dependent Claim
128 words
An electronic assembly comprising a circuit board having a multilayer circuit thereon, said circuit containing two or more layers of conductor film, each pair of layers of conductor film having interposed between them at their intersecting portion a layer of crossover dielectric film formed by applying and firing a crossover dielectric ink comprising: (a) from about 30 to about 70 percent by weight of a partially devitrifying barium magnesium borosilicate glass powder; (b) from about 10 to about 30 percent by weight of a pinhole reducing component selected from the group consisting of silicon dioxide, an alkaline earth aluminum borosilicate glass having a softening point above about 700° C., and mixtures thereof; and (c) from about 20 to about 50 percent by weight of a suitable organic vehicle.
Claim 9
Dependent Claim
128 words
An electronic assembly comprising a circuit board having a multilayer circuit thereon, said circuit containing two or more layers of conductor film, each pair of layers of conductor film having interposed between them at their intersecting portion a layer of crossover dielectric film formed by applying and firing a crossover dielectric ink comprising: (a) from about 30 to about 70 percent by weight of a partially devitrifying barium magnesium borosilicate glass powder; (b) from about 10 to about 30 percent by weight of a pinhole reducing component selected from the group consisting of silicon dioxide, an alkaline earth aluminum borosilicate glass having a softening point above about 700° C., and mixtures thereof; and (c) from about 20 to about 50 percent by weight of a suitable organic vehicle.
Claim 10
Dependent Claim
17 words
An assembly in accordance with claim 6, wherein said circuit board is a porcelain-coated metal circuit board.
Claim 11
Dependent Claim
12 words
An assembly in accordance with claim 7, wherein said metal is steel.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-01-17 | 1986-07-19 | 1987-01-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-01-17 | 1990-07-19 | 1991-01-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-01-17 | 1994-07-19 | 1995-01-18 | $7700.00 | Window Closed / Lapsed |