Method for the preparation of highly heat-resistant relief structures and the use thereof

Claim 1

In a method for the preparation of a highly heat-resistant relief structure having a polymer base of heterocyclic structure wherein a radiation-sensitive soluble polymer precursor is applied in the form of a film or a foil to a substrate, the film or foil is irradiated through negative patterns with actinic light or by deflecting a light, electron or ion beam, and the non-irradiated film or foil portions are removed, the improvement comprising using as said polymer precursor a polymeric compound consisting of the addition product of (a) a cyclic carboxylic acid anhydride and (b) a hydroxyl group-containing compound, said hydroxyl group-containing compound itself being an addition product of (a) an olefinically unsaturated monoepoxide and (b) a member selected from the group consisting of: (1) a carboxyl group-containing polyaddition product of (i) an aromatic and/or heterocyclic tetracarboxylic acid dianhydride and (ii) a diamino compound or a diamino compound with at least one ortho-position amido group; (2) a carboxyl group-containing polyaddition product of (i) a member selected from an aromatic and/or heterocyclic dihydroxydicarboxylic acid or an aromatic and/or heterocyclic diaminodicarboxylic acid and (ii) a diisocyanate; (3) an amino group-containing polycondensation product of (i) an aromatic and/or heterocyclic tetraamino compound and (ii) a dicarboxylic acid chloride or ester; (4) an amino group-containing polyaddition product of (i) an aromatic and/or heterocyclic tetraamino compound and (ii) a tetracarboxylic acid dianhydride; and (5) a hydroxyl group-containing polycondensation product of (i) an aromatic and/or heterocyclic dihydroxydiamino compound and (ii) a dicarboxylic acid chloride or ester.