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US4365274A
Expired / Lapsed
US
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One-dimensional image sensor
Assignee: Fujifilm Business Innovation Corp
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Filing: 1980-04-16
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Granted: 1982-12-21
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Expires: 2000-04-16
Abstract
Abstract A one-dimensional image sensor such as may be used in scanning an original document for use in a copying system and a method for producing the sensor. Integrated drive circuit elements are formed in a relatively small region of a monocrystalline semiconductor substrate. Lead electrodes are formed on the surface of the substrate diverging outwardly from the drive circuit elements. The lead electrodes have at end portions picture element size belt-shaped electrodes. A photoconductive non-crystalline film is formed over the belt-shaped electrodes with a wide transmissive electrode layer provided over the photoconductive non-crystalline film layer.
Inventors
- 👤 Mutsuo Takenouchi
- 👤 Shigeru Sadamatsu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 19:18
CPC Classifications
H; H10; H10F; H10F39/00; H10F39/10; H10F39/12; H10F39/15; H10F39/159; H10F39/011; H10F39/151; H10F39/152
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
85 words
A one-dimensional image sensor comprising: integrated drive circuit elements formed in a relatively small region of a semiconductor monocrystalline substrate; lead electrodes extending in a divergent manner from said drive circuit elements in a surface of said substrate, said lead electrodes each having a picture element size belt-shaped electrode at an end portion thereof; a photoconductive non-crystalline film formed on said substrate in a predetermined region so as to cover said belt-shaped electrodes; and a light transmissive electrode layer provided on said photoconductive non-crystalline film.
Claim 2
Dependent Claim
85 words
A one-dimensional image sensor comprising: integrated drive circuit elements formed in a relatively small region of a semiconductor monocrystalline substrate; lead electrodes extending in a divergent manner from said drive circuit elements in a surface of said substrate, said lead electrodes each having a picture element size belt-shaped electrode at an end portion thereof; a photoconductive non-crystalline film formed on said substrate in a predetermined region so as to cover said belt-shaped electrodes; and a light transmissive electrode layer provided on said photoconductive non-crystalline film.
Claim 3
Dependent Claim
29 words
The one-dimensional image sensor as claimed in claim 1 wherein said lead electrodes and said belt-shaped electrodes comprise a high impurity density layer formed in said semiconductor monocrystalline substrate.
Claim 4
Dependent Claim
31 words
The one-dimensional image sensor as claimed in claim 1 wherein said light transmissive electrode layer comprises a layer of semiconductor material having a sheet resistance lower than several hundreds of ohms.
Claim 5
Dependent Claim
20 words
The one-dimensional image sensor as claimed in claim 1 wherein said integrated drive circuit elements comprise a charge coupled device.
Claim 6
Dependent Claim
20 words
The one-dimensional image sensor as claimed in claim 1 wherein said integrated drive circuit elements comprise a shift register device.
Claim 7
Dependent Claim
21 words
The one-dimensional image sensor as claimed in claim 1 wherein said semiconductor monocrystalline substrate comprises a substrate of N semiconductor material.
Claim 8
Dependent Claim
18 words
The one-dimensional image sensor as claimed in claim 6 wherein said belt-shaped electrodes comprise p + semiconductor material.
Claim 9
Independent Claim
95 words
A method for producing a one-dimensional image sensor comprising the steps of: providing a monocrystalline semiconductor substrate; forming integrated drive circuit elements in a relatively small region of said semiconductor monocrystalline substrate; forming lead electrodes extending from said drive circuit elements in a divergent manner upon a surface of said substrate, said lead electrodes having picture element size belt-shaped electrodes at end portions thereof; forming a photoconductive non-crystalline film on said substrate in a predetermined region so as to cover said belt-shaped electrodes; and forming a light transmissive electrode layer on said photoconductive non-crystalline film.
Claim 10
Independent Claim
95 words
A method for producing a one-dimensional image sensor comprising the steps of: providing a monocrystalline semiconductor substrate; forming integrated drive circuit elements in a relatively small region of said semiconductor monocrystalline substrate; forming lead electrodes extending from said drive circuit elements in a divergent manner upon a surface of said substrate, said lead electrodes having picture element size belt-shaped electrodes at end portions thereof; forming a photoconductive non-crystalline film on said substrate in a predetermined region so as to cover said belt-shaped electrodes; and forming a light transmissive electrode layer on said photoconductive non-crystalline film.
Claim 11
Dependent Claim
30 words
The method of claim 8 wherein said step of forming said lead electrodes comprises forming regions of a conductivity opposite that of said substrate on said surface of said substrate.
Claim 12
Independent Claim
139 words
A method for producing a one-dimensional image sensor comprising the steps of: providing a monocrystalline semiconductor substrate; forming integrated drive circuit elements in a relatively small region of said semiconductor monocrystalline substrate; forming lead electrodes extending from said drive circuit elements in a divergent manner upon a surface of said substrate, said lead electrodes having picture element size belt-shaped electrodes at end portions thereof; forming a photoconductive non-crystalline film on said substrate in a predetermined region so as to cover said belt-shaped electrodes by depositing by vacuum evaporation a non-crystalline film consisting of 95% Se and 5% As, depositing by vacuum evaporation a film consisting of 75% Se, 20% Te and 5% As, and depositing by vacuum evaporation a film consisting of 95% Se and 5% As; and, forming a light transmissive electrode layer on said photoconductive non-crystalline film.
Claim 13
Independent Claim
139 words
A method for producing a one-dimensional image sensor comprising the steps of: providing a monocrystalline semiconductor substrate; forming integrated drive circuit elements in a relatively small region of said semiconductor monocrystalline substrate; forming lead electrodes extending from said drive circuit elements in a divergent manner upon a surface of said substrate, said lead electrodes having picture element size belt-shaped electrodes at end portions thereof; forming a photoconductive non-crystalline film on said substrate in a predetermined region so as to cover said belt-shaped electrodes by depositing by vacuum evaporation a non-crystalline film consisting of 95% Se and 5% As, depositing by vacuum evaporation a film consisting of 75% Se, 20% Te and 5% As, and depositing by vacuum evaporation a film consisting of 95% Se and 5% As; and, forming a light transmissive electrode layer on said photoconductive non-crystalline film.
Claim 14
Independent Claim
101 words
A method for producing a one-dimensional image sensor comprising the steps of: providing a monocrystalline semiconductor substrate; forming integrated drive circuit elements in a relatively small region of said semiconductor monocrystalline substrate; forming lead electrodes extending from said drive circuit elements in a divergent manner upon a surface of said substrate, said lead electrodes having picture element size belt-shaped electrodes at end portions thereof; forming a photoconductive non-crystalline film on said substrate in a predetermined region so as to cover said belt-shaped electrodes; and forming a light transmissive electrode layer on said photoconductive non-crystalline film by sputter depositing an ITO film.
Claim 15
Independent Claim
101 words
A method for producing a one-dimensional image sensor comprising the steps of: providing a monocrystalline semiconductor substrate; forming integrated drive circuit elements in a relatively small region of said semiconductor monocrystalline substrate; forming lead electrodes extending from said drive circuit elements in a divergent manner upon a surface of said substrate, said lead electrodes having picture element size belt-shaped electrodes at end portions thereof; forming a photoconductive non-crystalline film on said substrate in a predetermined region so as to cover said belt-shaped electrodes; and forming a light transmissive electrode layer on said photoconductive non-crystalline film by sputter depositing an ITO film.
References Cited (Backward Citations)
US4064533A
Cited
US4271435A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-12-20 | 1986-06-21 | 1986-12-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-12-20 | 1990-06-21 | 1990-12-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-12-20 | 1994-06-21 | 1994-12-21 | $7700.00 | Window Closed / Lapsed |