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US4362827A Expired / Lapsed US ⏱️ 0.0 years remaining

Manufacture of chipboard

Assignee: Methanol Chemie Nederland VOF
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Filing: 1980-09-03
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Granted: 1982-12-07
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Expires: 2000-09-03
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Abstract

Abstract The invention concerns the production of particle board with a very substantially lowered formaldehyde emission as well as suitable binding agents. According to the invention the binding agent used in the production of the board is a combination of a polyisocyanate with a aminoplast resin containing 0.25 to 0.625 moles of formaldehyde per mole equivalent of aminogroups. The particle boards thus obtained possess satisfactory mechanical properties and a strongly reduced formaldehyde emission.

Inventors

  • 👤 Arie Tinkelenberg
  • 👤 Henricus W. L. M. Vaessen
  • 👤 Kwai W. Suen

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 12:55
CPC Classifications
C; C08; C08G; C08G18/00; C08G18/06; C08G18/28; C08G18/40; C08G18/54; C08G18/544; C08L; C08L97/00; C08L97/02

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 83 words
A method for manufacturing chipboard or shaped objects by hardening at elevated temperatures and pressures lignocellulose-containing chip material with a polyisocyanate and aminoplast resin bonding agents, wherein an aminoplast resin having between 0.25 to 0.625 mole of formaldehyde per mole equivalent of amino groups is used in a quantity between 3% and 14% by weight relative to said chip material in combination with a polyisocyanate, which polyisocyanate is used in a quantity between 0.5% and 3.0% by weight relative to said chip material.
Claim 2
Independent Claim 83 words
A method for manufacturing chipboard or shaped objects by hardening at elevated temperatures and pressures lignocellulose-containing chip material with a polyisocyanate and aminoplast resin bonding agents, wherein an aminoplast resin having between 0.25 to 0.625 mole of formaldehyde per mole equivalent of amino groups is used in a quantity between 3% and 14% by weight relative to said chip material in combination with a polyisocyanate, which polyisocyanate is used in a quantity between 0.5% and 3.0% by weight relative to said chip material.
Claim 3
Dependent Claim 48 words
A method according to claim 1, wherein an aminoplast resin based on formaldehyde, urea and melamine having an F/NH 2 molar ratio of between 0.40 and 0.60 is employed in a quantity between 0.0% to 25% by weight of melamine relative to the quantity of melamine plus urea.
Claim 4
Dependent Claim 20 words
A method according to claim 2, wherein said aminoplast resin has an F/NH 2 molar ratio between 0.45 and 0.55.
Claim 5
Dependent Claim 56 words
A method according to claim 1, wherein an aminoplast resin based on formaldehyde, urea and melamine having an F/NH 2 molar ratio between 0.25 and 0.625 and containing 25% to 70% by weight of melamine relative to melamine plus urea is employed in a quantity between 7% and 12% by weight relative to said chip material.
Claim 6
Dependent Claim 20 words
A method according to claim 4, wherein said aminoplast resin has an F/NH 2 molar ratio between 0.35 and 0.55.
Claim 7
Dependent Claim 26 words
A method according to claim 4 or 5, wherein said aminoplast resin contains between 40% and 60% by weight of melamine relative to melamine plus urea.
Claim 8
Dependent Claim 30 words
A method according to claim 1, 2, 3, 4 or 5 wherein said polyisocyanate is used in a quantity between 0.5% and 2.0% by weight relative to said chip material.
Claim 9
Dependent Claim 17 words
A chipboard manufactured by application of the method according to claim 1, 2, 3, 4 or 5.
Claim 10
Dependent Claim 40 words
Aminoplast adhesive solution based on formaldehyde, urea and 0% to 70% by weight of melamine, relative to the quantity of melamine plus urea, wherein said adhesive contains between 0.25 and 0.625 mole of formaldehyde per mole equivalent of amino group.
Claim 11
Dependent Claim 40 words
Aminoplast adhesive solution based on formaldehyde, urea and 0% to 70% by weight of melamine, relative to the quantity of melamine plus urea, wherein said adhesive contains between 0.25 and 0.625 mole of formaldehyde per mole equivalent of amino group.
Claim 12
Dependent Claim 45 words
Aminoplast adhesive solution according to claim 9, wherein the melamine content is between 40% and 60% by weight relative to the quantity of melamine plus urea such that between 0.40 and 0.50 mole of formaldehyde has been taken up per mole equivalent of amino group.

References Cited (Backward Citations)

US2349756A Cited
US3268467A Cited
US3870665A Cited
US4282119A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1985-12-06 1986-06-07 1986-12-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1989-12-06 1990-06-07 1990-12-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1993-12-06 1994-06-07 1994-12-07 $7700.00 Window Closed / Lapsed

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