Patent US4347286A successfully refreshed from Google Patents.
US4347286A
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Heat fusible polyimide compound films and process for producing the same
Assignee: Nitto Denko Corp
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Filing: 1981-02-25
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Granted: 1982-08-31
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Expires: 2001-02-25
Abstract
Abstract A heat-fusible polyimide compound film which comprises a polyimide film and a heat-fusible layer composed of a polyimide precursor having a volatile material content of about 5 to about 50% by weight which is prepared by converting a part of a polyamide acid obtained by reacting a biphenyltetracarboxylic acid dianhydride represented by the general formula ##STR1## with an aromatic diamine into imide, provided on at least one surface of the polyimide film, and a process for producing the film.
Inventors
- 👤 Takashi Ishizuka
- 👤 Yasuhiro Moriyama
- 👤 Masao Nakamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 22:55
CPC Classifications
H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/303; H01B3/306; C; C09; C09J; C09J7/00; C09J7/20; C09J7/22; C09J7/30; C09J7/35; Y; Y10; Y10T; Y10T428/00; Y10T428/28; Y10T428/2813; Y10T428/2817; Y10T428/2826; Y10T428/29; Y10T428/2913; Y10T428/2933; Y10T428/294; Y10T428/2942; Y10T428/2947; Y10T428/31504; Y10T428/31721
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
72 words
A heat-fusible polyimide compound film which comprises a polyimide film and a heat-fusible layer composed of a polyimide precursor having a volatile material content of about 5 to about 50% by weight which is prepared by converting a part of a polyamide acid obtained by reacting a biphenyltetracarboxylic acid dianhydride represented by the general formula ##STR5## with an aromatic diamine into imide, provided on at least one surface of said polyimide film.
Claim 2
Dependent Claim
72 words
A heat-fusible polyimide compound film which comprises a polyimide film and a heat-fusible layer composed of a polyimide precursor having a volatile material content of about 5 to about 50% by weight which is prepared by converting a part of a polyamide acid obtained by reacting a biphenyltetracarboxylic acid dianhydride represented by the general formula ##STR5## with an aromatic diamine into imide, provided on at least one surface of said polyimide film.
Claim 3
Dependent Claim
18 words
The heat-fusible polyimide compound film according to claim 1, wherein the polyimide film is a heat-shrinkable polyimide film.
Claim 4
Dependent Claim
31 words
The heat-fusible polyimide compound film according to claim 1, wherein said polyimide film comprises a film produced from the reaction product of an aromatic tetracarboxylic acid dianhydride and an aromatic diamine.
Claim 5
Dependent Claim
60 words
The heat-fusible polyimide compound film according to claim 3, wherein said aromatic tetracarboxylic acid dianhydride is pyromellitic acid dianhydride, 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride, 3,3',4,4'-diphenyl ether tetracarboxylic acid dianhydride, 3,3',4,4'-diphenylpropanetetracarboxylic acid dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,3,3',4-biphenyltetracarboxylic acid dianhydride, or 2,3,2',3'-biphenyltetracarboxylic acid dianhydride and said aromatic diamine is m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 1,5-diaminonaphthalene, 2,6-diaminonaphthalene, or 3,4'-diaminobenzanilide.
Claim 6
Dependent Claim
46 words
The heat-fusible polyimide compound film according to claim 1, wherein said biphenyltetracarboxylic acid dianhydride is 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, 2,3,3',4-biphenyltetracarboxylic acid dianhydride or 2,3,2',3'-biphenyltetracarboxylic acid dianhydride and said aromatic diamine is m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 1,5-diaminonaphthalene, 2,6-diaminonaphthalene or 3,4'-diaminobenzanilide.
Claim 7
Dependent Claim
33 words
The heat-fusible polyimide compound film according to claim 2, wherein said heat-shrinkable polyimide film is a film stretched in at least one direction to a stretching ratio of about 1.05 to about 5.
Claim 8
Dependent Claim
32 words
The heat-fusible polyimide compound film according to claim 1, wherein the heat-shrinkable polyimide film is a film stretched biaxially with a stretching ratio in each direction of about 1.05 to about 5.
Claim 9
Dependent Claim
25 words
The heat-fusible polyimide compound film according to claim 1, wherein a solution of said polyamide acid has an inherent viscosity of about 0.5 or more.
Claim 10
Dependent Claim
92 words
A process for producing a heat-fusible polyimide compound film which comprises applying a solution of a polyamide acid obtained by reacting a biphenyltetracarboxylic acid dianhydride represented by the general formula ##STR6## with an aromatic diamine in an organic polar solvent to at least one surface of a polyimide film, and drying thereafter with heating to convert a part of said polyamide acid into the imide form while maintaining the volatile material content at about 5 to about 60% by weight, by which a heat-fusible layer composed of a polyimide precursor is formed.
Claim 11
Dependent Claim
92 words
A process for producing a heat-fusible polyimide compound film which comprises applying a solution of a polyamide acid obtained by reacting a biphenyltetracarboxylic acid dianhydride represented by the general formula ##STR6## with an aromatic diamine in an organic polar solvent to at least one surface of a polyimide film, and drying thereafter with heating to convert a part of said polyamide acid into the imide form while maintaining the volatile material content at about 5 to about 60% by weight, by which a heat-fusible layer composed of a polyimide precursor is formed.
Claim 12
Dependent Claim
22 words
The process for producing a heat-fusible polyimide compound film according to claim 9, wherein the polyimide film is a heat-shrinkable polyimide film.
Claim 13
Dependent Claim
35 words
The process for producing a heat-fusible polyimide compound film according to claim 9, wherein said polyimide film comprises a film produced from the reaction product of an aromatic tetracarboxylic acid dianhydride and an aromatic diamine.
Claim 14
Dependent Claim
64 words
The process for producing a heat-fusible polyimide compound film according to claim 11, wherein said aromatic tetracarboxylic acid dianhydride is pyromellitic acid dianhydride, 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride, 3,3',4,4'-diphenyl ether tetracarboxylic acid dianhydride, 3,3',4,4'-diphenylpropanetetracarboxylic acid dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,3,3',4-biphenyltetracarboxylic acid dianhydride or 2,3,2',3'-biphenyltetracarboxylic acid dianhydride and said aromatic diamine is m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 1,5-diaminonaphthalene, 2,6-diaminonaphthalene, or 3,4'-diaminobenzanilide.
Claim 15
Dependent Claim
50 words
The process for producing a heat-fusible polyimide compound film according to claim 11, wherein said biphenyltetracarboxylic acid dianhydride is 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, 2,3,3',4-biphenyltetracarboxylic acid dianhydride or 2,3,2',3'-biphenyltetracarboxylic acid dianhydride and said aromatic diamine is m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 1,5-diaminonaphthalene, 2,6-diaminonaphthalene, or 3,4'-diaminobenzanilide.
Claim 16
Dependent Claim
37 words
The process for producing a heat-fusible polyimide compound film according to claim 11, wherein said heat-shrinkable polyimide film is a film stretched in at least one direction to a stretching ratio of about 1.05 to about 5.
Claim 17
Dependent Claim
36 words
The process for producing a heat-fusible polyimide compound film according to claim 11, wherein the heat-shrinkable polyimide film is a film stretched biaxially with a stretching ratio in each direction of about 1.05 to about 5.
Claim 18
Dependent Claim
29 words
The process for producing a heat-fusible polyimide compound film according to claim 11, wherein a solution of said polyamide acid has an inherent viscosity of about 0.5 or more.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-08-30 | 1986-03-01 | 1986-08-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-08-30 | 1990-03-01 | 1990-08-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-08-30 | 1994-03-01 | 1994-08-31 | $7700.00 | Window Closed / Lapsed |