US4340167A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Coated printed circuit wiring board and method of soldering
Assignee: RCA Corp
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Filing: 1979-10-26
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Granted: 1982-07-20
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Expires: 1999-10-26
Abstract
Abstract Components can be held down on printed circuit boards by applying compositions comprising a water soluble polymeric compound or mixture of compounds which can be dissolved in water to give a greater than 45% solids content with a viscosity range of about 8 to about 12 poises at about 25° C., a water soluble mono- or polyhydric alcohol, water, a wetting agent, and a water soluble organic acid having a keto oxygen group within 4 carbon atoms of the carboxylic acid group, to the printed circuit board prior to insertion of the components to keep them in place during soldering operations. The mixture can be completely removed after soldering by a water rinse.
Inventors
- 👤 Marvin Packer
- 👤 Otis D. Black
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 20:16
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; B; B23; B23K; B23K37/00; B23K37/04; H05K3/306; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0769; H05K2203/0779; H05K2203/0786; H05K3/22; H05K3/28; H05K3/282; H05K3/32; H05K3/34; H05K3/3447; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
242 words
A method of soldering components to printed circuit boards which comprises the ordered steps of: (a) coating a first side of a printed circuit board with a mixture comprised of 100 parts by weight of a water soluble polymeric compound or mixture of compounds which can be dissolved in water to give greater than about a 45% by weight solids content and a viscosity range of about 8 to about 12 poises at about 25° C., about 10 to about 40 parts by weight of isopropyl alcohol, about 10 to about 40 parts by weight of water, about 1 to about 4 parts by weight of a nonionic wetting agent, and about 0.1 to about 6 parts by weight of a water soluble organic acid having a keto-oxygen group within 4 carbon atoms of the carboxylic acid group, (b) drying the coated printed circuit board to remove a sufficient amount of the water and isopropyl alcohol to convert the applied mixture into a dry transparent, non-flowing, water soluble film on the first surface, (c) activating the film with a blend of alcohol and water so as to make the film tacky, (d) adhering the components to the tacky film on the first side of said printed circuit board, (e) fluxing the opposite side of the printed circuit board, (f) soldering the fluxed side of the printed circuit board, and (g) rinsing the film from the first surface of the printed circuit board.
Claim 2
Independent Claim
242 words
A method of soldering components to printed circuit boards which comprises the ordered steps of: (a) coating a first side of a printed circuit board with a mixture comprised of 100 parts by weight of a water soluble polymeric compound or mixture of compounds which can be dissolved in water to give greater than about a 45% by weight solids content and a viscosity range of about 8 to about 12 poises at about 25° C., about 10 to about 40 parts by weight of isopropyl alcohol, about 10 to about 40 parts by weight of water, about 1 to about 4 parts by weight of a nonionic wetting agent, and about 0.1 to about 6 parts by weight of a water soluble organic acid having a keto-oxygen group within 4 carbon atoms of the carboxylic acid group, (b) drying the coated printed circuit board to remove a sufficient amount of the water and isopropyl alcohol to convert the applied mixture into a dry transparent, non-flowing, water soluble film on the first surface, (c) activating the film with a blend of alcohol and water so as to make the film tacky, (d) adhering the components to the tacky film on the first side of said printed circuit board, (e) fluxing the opposite side of the printed circuit board, (f) soldering the fluxed side of the printed circuit board, and (g) rinsing the film from the first surface of the printed circuit board.
Claim 3
Dependent Claim
60 words
A method according to claim 1 wherein the mixture is comprised of 100 parts by weight of a 75% by weight solution of dimethyl hydantoin formaldehyde resin, 16.5 parts by weight of isopropyl alcohol, about 16.5 parts by weight of water, about 1.5 parts by weight of a nonionic wetting agent, and about 3 parts by weight of levulinic acid.
Claim 4
Dependent Claim
26 words
A method according to claim 1 wherein the polymeric compound is selected from the group consisting of polyethylene glycol, polyvinyl pyrrolidone, and dimethyl hydantoin formaldehyde resin.
Claim 5
Dependent Claim
26 words
The method according to claim 1 wherein the carboxylic acid is selected from the group consisting of pyruvic acid, homolevulinic acid, acetoacetic acid, and levulinic acid.
Claim 6
Dependent Claim
64 words
The method according to claim 1 wherein the mixture is comprised of 100 parts by weight of a polyethylene glycol with an average molecular weight range of about 3000 to about 3700, about 35 parts by weight of glycerol, about 40 parts by weight of water, about 4 parts by weight of a wetting agent, and about 1 part by weight of levulinic acid.
Claim 7
Dependent Claim
185 words
A printed circuit board capable of having electronic components adhered thereto during soldering operations comprising a printed circuit board, and a transparent non-flowing water soluble film on a side of said printed circuit board upon which said components are to be adhered said film being obtained by coating said side with a mixture comprised of 100 parts by weight of a water soluble polymeric compound or mixtures of compounds which can be dissolved in water to give a greater than about 45% by weight solids content, and a viscosity range of about 8 to about 12 poises at about 25° C., about 10 to about 40 parts by weight of isopropyl alcohol, about 10 to about 40 parts by weight of water, about 1 to about 4 parts by weight of a wetting agent, and about 0.1 to about 6 parts by weight of a water soluble organic acid having a keto oxygen group within 4 carbon atoms of the carboxylic acid group and thereafter drying said coating to remove sufficient water and alcohol to form said transparent non-flowing water soluble film on said side.
Claim 8
Dependent Claim
185 words
A printed circuit board capable of having electronic components adhered thereto during soldering operations comprising a printed circuit board, and a transparent non-flowing water soluble film on a side of said printed circuit board upon which said components are to be adhered said film being obtained by coating said side with a mixture comprised of 100 parts by weight of a water soluble polymeric compound or mixtures of compounds which can be dissolved in water to give a greater than about 45% by weight solids content, and a viscosity range of about 8 to about 12 poises at about 25° C., about 10 to about 40 parts by weight of isopropyl alcohol, about 10 to about 40 parts by weight of water, about 1 to about 4 parts by weight of a wetting agent, and about 0.1 to about 6 parts by weight of a water soluble organic acid having a keto oxygen group within 4 carbon atoms of the carboxylic acid group and thereafter drying said coating to remove sufficient water and alcohol to form said transparent non-flowing water soluble film on said side.
Claim 9
Dependent Claim
31 words
The coated printed circuit board according to claim 6 wherein the mixture contains a polymeric compound selected from the group consisting of polyethylene glycol, polyvinyl pyrrolidone, and dimethyl hydantoin formaldehyde resin.
Claim 10
Dependent Claim
28 words
The printed circuit board according to claim 7 wherein the carboxylic acid is selected from the group consisting of pyruvic acid, homolevulinic acid, acetoacetic acid, and levulinic acid.
Claim 11
Dependent Claim
23 words
The printed circuit board according to claim 8 further incorporating electronic components inserted into said circuit board on said side having said film.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-07-19 | 1986-01-18 | 1986-07-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-07-19 | 1990-01-18 | 1990-07-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-07-19 | 1994-01-18 | 1994-07-20 | $7700.00 | Window Closed / Lapsed |