Extrudable, non-flowing and non-aqueous solvent soluble hold down compound for printed wiring board assembly

Claim 1

In a method of soldering components to printed circuit boards comprising the steps of mounting the components leads into holes in the board, applying a coating to the components to maintain them in place, soldering the components to the board and removing said coating with a solvent rinse wherein the improvement comprises the step of applying as said coating a composition comprising an extrudable, non-flowable, solvent soluble coating containing a mixture of a carboxylic acid, a cellulose material, a solid hydrocarbon resin, a thickening agent and a non-aqueous diluent-solvent wherein each component of the composition is compatible with the other components and soluble in the solvent rinse.

Claim 13

A method of soldering components to printed circuit boards which comprises: (a) mounting said components on a printed circuit board; (b) applying an extrudable, non-flowing, non-aqueous diluent-solvent soluble composition over said mounted components which comprises about 20-24 parts by weight of oleic acid, about 7-11 parts by weight of ethyl cellulose, about 35-45 parts by weight of 1,1,1-trichloroethane, about 16-25 parts by weight of a hydrocarbon resin with a viscosity of at least 27 centistokes as measured by the Gardner Holt Method of a solution of 75% of said hydrocarbon resin and 25% toluene, and about 6.5-10.5 parts by weight of a glyceryl tris 1,2-hydroxy stearate, all parts by weight being based on 100 parts by weight of the total composition; (c) fluxing the other side of the printed circuit board on which the composition of step (b) is extruded; (d) soldering the fluxed side of the printed circuit board of step (c); (e) removing the composition of step (b) with a solvent rinse.

Claim 14

A method of soldering components to printed circuit boards which comprises: (a) mounting said components on a printed circuit board; (b) applying an extrudable, non-flowing, non-aqueous diluent-solvent soluble composition over said mounted components which comprises about 20-24 parts by weight of oleic acid, about 7-11 parts by weight of ethyl cellulose, about 35-45 parts by weight of 1,1,1-trichloroethane, about 16-25 parts by weight of a hydrocarbon resin with a viscosity of at least 27 centistokes as measured by the Gardner Holt Method of a solution of 75% of said hydrocarbon resin and 25% toluene, and about 6.5-10.5 parts by weight of a glyceryl tris 1,2-hydroxy stearate, all parts by weight being based on 100 parts by weight of the total composition; (c) fluxing the other side of the printed circuit board on which the composition of step (b) is extruded; (d) soldering the fluxed side of the printed circuit board of step (c); (e) removing the composition of step (b) with a solvent rinse.