Wax-flux composition containing a diester of sulfomalic acid for soldering

Claim 2

A wax-flux composition for use in a low-temperature soldering process, comprising: A. a major amount of a wax having an average melting point between 40°C and 100°C, and B. an amount effective to cause fluxing, at or below the soldering temperature, of the piece to be soldered in said process of a wax-soluble alkyl ester of sulfomalic acid.

Claim 3

A wax-flux composition of claim 1 wherein said wax-soluble ester has the following formula: ##EQU2## wherein each R independently contains from 1 to 22 carbon atoms such that the sum of the carbon atoms contained in both R groups is at least 12.

Claim 4

A wax-soluble composition of claim 2 wherein said R groups contain from 4 to 22 carbon atoms.

Claim 5

A wax-flux composition of claim 2 wherein said R groups contain from 8 to 22 carbon atoms.

Claim 6

A wax-flux composition of claim 4 wherein said ester comprises 1 to 20 weight percent of said composition.

Claim 7

A wax-flux composition of claim 4 wherein said ester comprises 3 to 12 weight percent of said composition.

Claim 8

A wax-flux composition of claim 5 wherein R represents octyl and said wax has an average melting point of from 50°C to 75°C.

Claim 9

A wax-flux composition of claim 5 wherein R represents undecyl and said wax has an average melting point of from 50°C to 75°C.

Claim 10

A wax-flux composition of claim 5 wherein R represents dodecyl and said wax has an average melting point of from 50°C to 75°C.

Claim 11

A process for soldering an electrical component to a printed circuit board, said board comprising a non-conducting substrate and a pattern of an electrically conductive metal laminated to said substrate, said metal being solderable with a low-melting-point alloy solder, said board having component lead receiving holes through both said substrate and said metal pattern, said component having electrical leads, and said component being mounted on said board by having at least one of said leads inserted through a said lead receiving hole, said process comprising: a. applying a molten wax-flux composition of claim 1 to the metal pattern side of said board and to said component lead; b. allowing said wax-flux composition to solidify; c. trimming said component lead; and d. soldering said component to said printed circuit board with a low-melting-point alloy solder.

Claim 12

The process of claim 10 wherein: a. said wax-flux composition is applied to said board by contacting the metal pattern side of said board with the crest of a standing wave of said molten wax-flux composition; and b. said component is soldered to said board by contacting the metal pattern side of said board with the crest of a standing wave of said low-melting-point alloy solder.

Claim 13

The process of claim 11 wherein said component lead is trimmed by a circular saw.