Apparatus and method for producing uniform fired resistors

Claim 2

A process for producing uniform resistors, comprising the steps of supplying substrates to a means for screening a resistive mixture thereon, said screening means comprising a means for mixing at least two resistive materials and supplying said mixture to a squeegee attached thereto, mixing said resistive materials and screening the mixture onto said substrates, firing said screened mixture to form resistors, detecting the resistance values of said fired resistors, comparing each of said resistance values to a standard resistance value and determining the deviation therefrom, adjusting the amount of each of said resistive materials supplied to said means for mixing to correct the ratio of the resistive materials in said mixture, and continuously monitoring and controlling the mixture ratio of said resistance materials by continuous comparison of the resistance values of said fired resistors with said standard resistance value.

Claim 3

The process in accordance with claim 1, further comprising the step of varying the volumetric flow rate of said resistive mixture supplied to said squeegee.

Claim 4

The process in accordance with claim 1, further comprising the step of varying the combined volume of said resistive materials supplied to said mixing means.

Claim 5

The process in accordance with claim 1, further comprising the step of maintaining said resistive mixture within the interior of said squeegee, the interior defined by the area between parallel longitudinal wipers having dams disposed transversely at the ends thereof.

Claim 6

The process in accordance with claim 4, wherein each of said wipers has an inner and an outer surface, said inner surface disposed at an angle with a plane parallel to the longitudinal axes of said wipers that is at least twice the angle between the outer surface and said plane.

Claim 7

The process in accordance with claim 1, further comprising the steps of measuring the thickness of the screened mixtures, comparing each thickness value to a standard thickness value and determining the deviation therefrom, adjusting the screening means to maintain a predetermined thickness for the screened mixture, and continuously monitoring and controlling the thickness of said screened mixture by continuous comparison of the thickness values of said screened mixture with said standard thickness value.

Claim 8

A process for manufacturing resistor networks, comprising the steps of supplying substrates to a first means for applying a resistive mixture thereon, said first applying means comprising a means for mixing at least two resistive materials and supplying said mixture to a squeegee for applying said mixture onto said substrates, mixing said resistive materials and applying said mixture onto said substrates, drying said resistive mixture, supplying at least two resistance materials to a second means for applying a second resistive mixture onto said substrates, said second applying means comprising a means for mixing said resistance materials and supplying said second mixture to a second squeegee, mixing said resistance materials and applying said second mixture onto said substrates, firing said applied mixtures to form resistors on said substrates, detecting the resistance values of said resistors, comparing said resistance values with standard resistance values and determining the deviations therefrom, adjusting the respective amounts of each of the materials supplied to the first and second applying means to correct the ratios of the respective materials in said mixtures, and continuously controlling the mixture ratios of the materials supplied to the first and second applying means through a closed-loop feedback network.

Claim 9

A process for manufacturing resistor networks, comprising the steps of supplying substrates to a first means for applying a resistive mixture thereon, said first applying means comprising a means for mixing at least two resistive materials and supplying said mixture to a squeegee for applying said mixture onto said substrates, mixing said resistive materials and applying said mixture onto said substrates, drying said resistive mixture, supplying at least two resistance materials to a second means for applying a second resistive mixture onto said substrates, said second applying means comprising a means for mixing said resistance materials and supplying said second mixture to a second squeegee, mixing said resistance materials and applying said second mixture onto said substrates, firing said applied mixtures to form resistors on said substrates, detecting the resistance values of said resistors, comparing said resistance values with standard resistance values and determining the deviations therefrom, adjusting the respective amounts of each of the materials supplied to the first and second applying means to correct the ratios of the respective materials in said mixtures, and continuously controlling the mixture ratios of the materials supplied to the first and second applying means through a closed-loop feedback network.

Claim 10

The process in accordance with claim 7, further comprising the step of varying the flow rate of the respective mixtures being supplied to the squeegees.

Claim 11

The process in accordance with claim 7, including the step of varying the respective combined amounts of resistive materials and resistance materials being supplied to the respective mixing means.

Claim 12

The process in accordance with claim 7, further comprising the steps of measuring the thickness of said applied resistive mixture, measuring the thickness of the applied second mixture, comparing the respective thickness values to respective standard thickness values and determining the deviations therefrom, and continuously adjusting each respective means for applying a mixture to maintain a predetermined thickness for the respectively applied mixture.

Claim 13

A process for blending resistive materials and applying said blend onto substrates, comprising the steps of continuously supplying substrates to a means for applying said blend of resistive materials to said substrates, said applying means including a means for mixing at least two resistive materials, supplying at least two resistive materials to the means for mixing said resistive materials, mixing said resistive materials to disperse one material in another, and applying the mixture onto each of said substrates.

Claim 14

A process for blending resistive materials and applying said blend onto substrates, comprising the steps of continuously supplying substrates to a means for applying said blend of resistive materials to said substrates, said applying means including a means for mixing at least two resistive materials, supplying at least two resistive materials to the means for mixing said resistive materials, mixing said resistive materials to disperse one material in another, and applying the mixture onto each of said substrates.

Claim 15

The process in accordance with claim 11, further comprising the step of metering each resistive material at predetermined flow rates to said mixing means.

Claim 16

The process in accordance with claim 11, further comprising the step of operating said means for mixing said resistive materials at variable speeds.

Claim 17

The process in accordance with claim 11, wherein the means for mixing said resistive materials comprises a blending head having an opening and a rotating shaft disposed in said opening, whereby said resistive materials are blended between said shaft and the surface of said opening.

Claim 18

The process in accordance with claim 11, wherein the applying means includes a squeegee having two longitudinal wipers and dams disposed at the ends of said wipers, each wiper having an inner surface and an outer surface.

Claim 19

The process in accordance with claim 13, wherein said inner surface is disposed at an angle with a plane parallel to the longitudinal axes of said wipers that is at least twice the angle between said outer surface and said plane.

Claim 20

The process in accordance with claim 15, including the step of transmitting said mixed resistive materials through an opening passing through said squeegee.

Claim 21

A process for producing a fired resistor, comprising the steps of: continuously supplying substrates to a means for applying a resistance mixture to said substrates, said applying means including a means for mixing at least two substantially variant resistance materials, supplying from independent sources at least two substantially variant resistance materials, mixing such materials to effect a substantially homogenous resistance mixture for providing a resistance value of a predetermined amount, applying said mixture to a substrate, firing said applied mixture, measuring the resistance value derived from the fired resistance mixture and determining the deviation from said predetermined value, and continuously adjusting the relative proportions of said materials to maintain the predetermined value.

Claim 22

A process for producing a fired resistor, comprising the steps of: continuously supplying substrates to a means for applying a resistance mixture to said substrates, said applying means including a means for mixing at least two substantially variant resistance materials, supplying from independent sources at least two substantially variant resistance materials, mixing such materials to effect a substantially homogenous resistance mixture for providing a resistance value of a predetermined amount, applying said mixture to a substrate, firing said applied mixture, measuring the resistance value derived from the fired resistance mixture and determining the deviation from said predetermined value, and continuously adjusting the relative proportions of said materials to maintain the predetermined value.

Claim 23

The process in accordance with claim 11 or 18, further comprising the steps of measuring the thickness of an applied mixture, comparing the thickness value to a standard thickness value and determining the deviation therefrom, and adjusting the applying means to maintain a predetermined thickness for subsequently applied mixtures.

Claim 24

A process for producing resistor networks, comprising the steps of: supplying a substrate to first and second means for applying resistance mixtures to said substrate, said first and second applying means including respective means for mixing at least two variant resistance materials, supplying from separate first sources at least two variant resistance materials, mixing the first materials to effect a first resistance mixture for providing a first resistance value of predetermined amount, said first applying means applying said first mixture of said substrate, supplying from separate second sources at least two variant resistance materials, mixing the second materials to effect a second resistance mixture for providing a second resistance value of a predetermined amount, said second applying means applying said second mixture to said substrate, firing said applied mixtures, measuring the first and second resistance values derived from the respective fired mixtures and determining the deviations from the respective predetermined values, and continuously adjusting the proportions of said respective resistive mixtures to maintain predetermined resistance values of the first and second fired mixtures.

Claim 25

A process for producing resistor networks, comprising the steps of: supplying a substrate to first and second means for applying resistance mixtures to said substrate, said first and second applying means including respective means for mixing at least two variant resistance materials, supplying from separate first sources at least two variant resistance materials, mixing the first materials to effect a first resistance mixture for providing a first resistance value of predetermined amount, said first applying means applying said first mixture of said substrate, supplying from separate second sources at least two variant resistance materials, mixing the second materials to effect a second resistance mixture for providing a second resistance value of a predetermined amount, said second applying means applying said second mixture to said substrate, firing said applied mixtures, measuring the first and second resistance values derived from the respective fired mixtures and determining the deviations from the respective predetermined values, and continuously adjusting the proportions of said respective resistive mixtures to maintain predetermined resistance values of the first and second fired mixtures.

Claim 26

The process in accordance with claim 20, further comprising the steps of measuring the thickness of the respective first and second applied mixtures, comparing the respective thickness values to respective standard thickness values and determining the deviations therefrom, and continuously adjusting the respective applying means to maintain a predetermined thickness for the respectively applied mixture.