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US4333808A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for manufacture of ultra-thin film capacitor

Assignee: International Business Machines Corp
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Filing: 1981-02-13
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Granted: 1982-06-08
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Expires: 2001-02-13
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Abstract

Abstract A suitable substrate is provided to which is applied a metal electrically conductive film electrode. The substrate and electrically conductive electrode film are then exposed to ion beam implantation of O+ or N+ ions to impregnate the surface of the metal electrode with O+ or N+ ions. Thereafter, the substrate and electrically conductive film having implanted O+ or N+ ions is annealed so as to stabilize the oxide structure which has been implanted into the surface of the electrically conductive film to provide an ultra-thin dielectric film.

Inventors

  • 👤 Arup Bhattacharyya
  • 👤 Wei-Kan Chu
  • 👤 James K. Howard
  • 👤 Francis W. Wiedman

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 16:51
CPC Classifications
H; H01; H01G; H01G4/00; H01G4/002; H01G4/018; H01G4/06; H01G4/08; H01G4/10; C; C23; C23C; C23C14/00; C23C14/22; C23C14/48

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 150 words
A method for manufacture of an ultra-thin film capacitor comprising: providing a substrate, applying to said substrate a metal electrically conductive film to form a composite having a first capacitor electrode, applying by sputtering a film selected from the group consisting of metal oxide films and metal nitride films to the surface of said first electrode; the metal of said metal oxide and metal nitride films is selected from the group consisting of tantalum, niobium, titanium, vanadium, hafnium and zirconium; subjecting the surface of said metal oxide and metal nitride films to ion implantation treatment to implant ions selected from the group consisting of O+ and N+ ions in the surface of said first electrode; subjecting said composite to annealing heat treatment to provide an ultra-thin dielectric film adjacent the surface of said first electrode; and applying an electrically conductive film to said composite to form a counter capacitor electrode.
Claim 2
Independent Claim 150 words
A method for manufacture of an ultra-thin film capacitor comprising: providing a substrate, applying to said substrate a metal electrically conductive film to form a composite having a first capacitor electrode, applying by sputtering a film selected from the group consisting of metal oxide films and metal nitride films to the surface of said first electrode; the metal of said metal oxide and metal nitride films is selected from the group consisting of tantalum, niobium, titanium, vanadium, hafnium and zirconium; subjecting the surface of said metal oxide and metal nitride films to ion implantation treatment to implant ions selected from the group consisting of O+ and N+ ions in the surface of said first electrode; subjecting said composite to annealing heat treatment to provide an ultra-thin dielectric film adjacent the surface of said first electrode; and applying an electrically conductive film to said composite to form a counter capacitor electrode.
Claim 3
Independent Claim 219 words
A method for manufacture of an ultra-thin film capacitor comprising: providing a substrate, applying to said substrate a metal electrically conductive film to form a composite having a first capacitor electrode, applying by sputtering a film selected from the group consisting of metal oxide films and metal nitride films to the surface of said first electrode, the metal of said metal oxide or metal nitride films is selected from the group consisting of tantalum, niobium, titanium, vanadium, hafnium and zirconium; subjecting the surface of said metal oxide or metal nitride film to ion implantation treatment to implant ions selected from the group consisting of O+ and N+ ions in the surface of said metal oxide or metal nitride film to form a metal oxide or metal nitride layer having a dielectric constant of from about 15 to about 60; subjecting said composite to annealing heat treatment of from about 150° C. to about 400° C. for a period of from about 1 to about 5 hours in an ambient atmosphere selected from oxygen and nitrogen to provide an ultra-thin dielectric film having a dielectric constant to film thickness (expressed in Angstroms) ratio of greater than 0.04, adjacent the surface of said first electrode; and applying a metal electrically conductive film to said composite to form a counter capacitor electrode.
Claim 4
Independent Claim 219 words
A method for manufacture of an ultra-thin film capacitor comprising: providing a substrate, applying to said substrate a metal electrically conductive film to form a composite having a first capacitor electrode, applying by sputtering a film selected from the group consisting of metal oxide films and metal nitride films to the surface of said first electrode, the metal of said metal oxide or metal nitride films is selected from the group consisting of tantalum, niobium, titanium, vanadium, hafnium and zirconium; subjecting the surface of said metal oxide or metal nitride film to ion implantation treatment to implant ions selected from the group consisting of O+ and N+ ions in the surface of said metal oxide or metal nitride film to form a metal oxide or metal nitride layer having a dielectric constant of from about 15 to about 60; subjecting said composite to annealing heat treatment of from about 150° C. to about 400° C. for a period of from about 1 to about 5 hours in an ambient atmosphere selected from oxygen and nitrogen to provide an ultra-thin dielectric film having a dielectric constant to film thickness (expressed in Angstroms) ratio of greater than 0.04, adjacent the surface of said first electrode; and applying a metal electrically conductive film to said composite to form a counter capacitor electrode.
Claim 5
Dependent Claim 42 words
A method in accordance with claim 2 wherein said metal oxide or metal nitride layer formed by ion implantation is selected from the group consisting of rare earth and transition metal oxides and nitrides having a dielectric constant in excess of 15.
Claim 6
Dependent Claim 31 words
A method in accordance with claim 2 wherein said ion implantation treatment is sufficient to implant ions at a level of from about 10 14 to 10 16 ions/cm 2 .
Claim 7
Dependent Claim 20 words
The method of claim 1 or claim 2 wherein said applying by sputtering is in an oxygen containing vacuum environment.
Claim 8
Dependent Claim 29 words
The method of claim 5 wherein said oxygen containing environment is about 2 to 50 percent by volume with the remaining gaseous volume being composed of an inert gas.

References Cited (Backward Citations)

US3245895A Cited
GB1086350A Cited
GB1258259A Cited
US3988824A Cited
US4038167A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1985-06-07 1985-12-07 1986-06-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1989-06-07 1989-12-07 1990-06-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1993-06-07 1993-12-07 1994-06-08 $7700.00 Window Closed / Lapsed

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