← Back to Patent Explorer
US4330849A Expired / Lapsed US ⏱️ 0.0 years remaining

Complementary semiconductor memory device

Assignee: Fujitsu Ltd
•
Filing: 1980-08-27
•
Granted: 1982-05-18
•
Expires: 2000-08-27
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract Disclosed herein is a semiconductor memory device comprising a semiconductor substrate having a first conductivity type, first and second regions of a second conductivity type opposite to said first type formed in the surface of the semiconductor substrate and separated with a certain space therebetween, a third region of the first conductivity type formed in the second region, and a gate electrode formed on an insulating film on the semiconductor substrate between the first and the third regions. By applying a gate voltage to the gate electrode, charge carriers are transferred between the first and second regions in accordance with the data to be stored. The stored data is read out by applying a prescribed gate voltage to the gate electrode and by detecting the value of the current between the third region and the semiconductor substrate.

Inventors

  • 👤 Ryoiku Togei
  • 👤 Yoshihiko Hika

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 18:40
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/80; H10D84/82; H10D84/83; H10D84/85; H10D84/856; G; G11; G11C; G11C11/00; G11C11/21; G11C11/34; G11C11/40; G11C11/401; G11C11/403; H10B; H10B12/00; H10D84/8312

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 378 words
A memory cell consisting essentially of two complementary metal-insulator-semiconductor (MIS) transistors integrated into a single semiconductor substrate with a single area portion of a single insulated gate serving entirely as the gates of said two MIS transistors, each said cell further consisting of: a semiconductor substrate having a first conductivity type, said substrate comprising the channel region of the first of said two MIS transistors, first and second spaced regions of conductivity type opposite to that of said substrate, said first and second spaced regions and the intervening portion of said substrate corresponding to the first of said two MIS transistors, a third region of the conductivity type of said substrate formed in said second region, said substrate and said second and third regions corresponding to the second of said two MIS transistors, a gate insulating layer and a gate electrode forming said single gate, and extending between said first and third regions, a field oxide layer extending into said substrate and having a configuration surrounding said third region except on the side of said third region on which said single gate is formed, said second and third regions both abutting at least in part horizontally with said first oxide along respective portions of the border of said field oxide around said cell, and no other portion of said field oxide being in contact with said third region, said single gate electrode with said single gate area portion extending in a single solid pattern on the gate insulating layer from said first region to said third region, said gate electrode having a configuration corresponding to self-alignment with respect to said first and second regions to extend at least to some extent over said first and third regions, said third region having a configuration corresponding to self-alignment with said respective portion of the border of said field oxide and said gate insulating layer, and said third size being of a minimum region for accommodating a single electrode contact thereto, necessary corresponding electrodes for activating each of said first and third regions and for grounding said substrate, said second region being floating electrically, for changing the threshold voltage of said second MIS transistor as a result of charges transferred by said first MIS transistor and stored in said second region.
Claim 2
Dependent Claim 378 words
A memory cell consisting essentially of two complementary metal-insulator-semiconductor (MIS) transistors integrated into a single semiconductor substrate with a single area portion of a single insulated gate serving entirely as the gates of said two MIS transistors, each said cell further consisting of: a semiconductor substrate having a first conductivity type, said substrate comprising the channel region of the first of said two MIS transistors, first and second spaced regions of conductivity type opposite to that of said substrate, said first and second spaced regions and the intervening portion of said substrate corresponding to the first of said two MIS transistors, a third region of the conductivity type of said substrate formed in said second region, said substrate and said second and third regions corresponding to the second of said two MIS transistors, a gate insulating layer and a gate electrode forming said single gate, and extending between said first and third regions, a field oxide layer extending into said substrate and having a configuration surrounding said third region except on the side of said third region on which said single gate is formed, said second and third regions both abutting at least in part horizontally with said first oxide along respective portions of the border of said field oxide around said cell, and no other portion of said field oxide being in contact with said third region, said single gate electrode with said single gate area portion extending in a single solid pattern on the gate insulating layer from said first region to said third region, said gate electrode having a configuration corresponding to self-alignment with respect to said first and second regions to extend at least to some extent over said first and third regions, said third region having a configuration corresponding to self-alignment with said respective portion of the border of said field oxide and said gate insulating layer, and said third size being of a minimum region for accommodating a single electrode contact thereto, necessary corresponding electrodes for activating each of said first and third regions and for grounding said substrate, said second region being floating electrically, for changing the threshold voltage of said second MIS transistor as a result of charges transferred by said first MIS transistor and stored in said second region.
Claim 3
Dependent Claim 67 words
The memory cell of claim 1, said field oxide having thickness in the range from 8000 to 10,000 A, said first and second regions having a thickness in the range from 2 to 3 microns and an impurity concentration of said opposite conductivity type in the range from 5×10 18 to 1×10 19 /cm 3 , and said third region having a thickness of approximately 1 micron.

References Cited (Backward Citations)

US3919569A Cited
US3841926A Cited
US3971055A Cited
US3968479A Cited
US3974486A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1985-05-17 1985-11-16 1986-05-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1989-05-17 1989-11-16 1990-05-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1993-05-17 1993-11-16 1994-05-18 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag