US4323726A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrical bus bar assembly
Assignee: PPG Industries Ohio Inc
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Filing: 1980-07-24
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Granted: 1982-04-06
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Expires: 2000-07-24
Abstract
Abstract An electroconductive laminated window having an electroconductive coating applied to one interior substrate surface with a pair of bus bars electrically connecting a source of electrical potential thereto. The bus bars include an electroconductive layer having volume resistivity less than about 10 -2 ohm-cm interposed between and conformable to the surface configurations of the electroconductive coating and a flexible metallic current carrying member. The metallic current carrying member is preferably a mesh of thin copper foil which is substantially bendable in its own plane, and the electroconductive layer is preferably a metallic layer substantially free of non-metallic components, consisting of a mixture of finely divided electroconductive particles and finely divided metal alloy particles having a fusion temperature between about 70° C. and about 150° C.
Inventors
- 👤 Russell C. Criss
- 👤 Edward J. Stofka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 16:35
CPC Classifications
H; H05; H05B; H05B3/00; H05B3/84; H05B3/86; B; B32; B32B; B32B17/00; B32B17/06; B32B17/10; B32B17/10005; B32B17/10009; B32B17/10036; B32B17/10165; B32B17/10376; B32B17/1055; B32B17/10761; H02; H02G; H02G5/00; H02G5/005; H05B2203/00; H05B2203/013; H05B2203/016; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0263
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
130 words
A bus bar assembly for electrically connecting a source of electrical potential to an electroconductive pattern on a nonelectroconductive substrate at a plurality of points, comprising: at least one elongated metallic current carrying member positioned adjacent said pattern at said plurality of points; and an electroconductive layer between and in contact with adjacent surfaces of said current carrying member and said electroconductive pattern to maintain same in spaced relation, said layer conforming to the surface configurations of both the contacted adjacent surfaces of said member and said pattern to minimize localized high current densities therebetween and having a volume resistivity less than about 10 -2 ohm-cm., wherein said layer comprises a mixture of finely divided metallic electroconductive particles bound together by fused metal alloy particles substantially free of non-metallic components.
Claim 2
Dependent Claim
130 words
A bus bar assembly for electrically connecting a source of electrical potential to an electroconductive pattern on a nonelectroconductive substrate at a plurality of points, comprising: at least one elongated metallic current carrying member positioned adjacent said pattern at said plurality of points; and an electroconductive layer between and in contact with adjacent surfaces of said current carrying member and said electroconductive pattern to maintain same in spaced relation, said layer conforming to the surface configurations of both the contacted adjacent surfaces of said member and said pattern to minimize localized high current densities therebetween and having a volume resistivity less than about 10 -2 ohm-cm., wherein said layer comprises a mixture of finely divided metallic electroconductive particles bound together by fused metal alloy particles substantially free of non-metallic components.
Claim 3
Dependent Claim
47 words
The bus bar assembly as set forth in claim 1 wherein said substrate has a deformation temperature, said pattern has a decomposition temperature, and wherein said metal alloy particles have a fusion temperature below the deformation temperature of said substrate and the decomposition temperature of said pattern.
Claim 4
Dependent Claim
61 words
The bus bar assembly as set forth in claim 2 wherein said electroconductive layer is formed of a mixture of: finely divided metallic electroconductive particles having a melting temperature; and finely divided metal alloy particles having a fusion temperature below the deformation temperature of said substrate, the decomposition temperature of said pattern, and the melting temperature of said metallic electroconductive particles.
Claim 5
Dependent Claim
33 words
The bus bar assembly as set forth in claim 3 wherein said mixture comprises: 85 to 97 percent of said metallic electroconductive particles; and 15 to 3 percent of said metal alloy particles.
Claim 6
Dependent Claim
52 words
The bus bar assembly as set forth in claim 4 wherein said metallic electroconductive particles are selected from the group consisting of silver, gold, platinum, copper, aluminum, and high melting point electroconductive alloys thereof and wherein said fusion temperature of said fusible material is between about 70° C. and about 150° C.
Claim 7
Dependent Claim
46 words
The bus bar assembly as set forth in claim 5 wherein said metallic electroconductive particles are silver and said metal alloy particles comprise by weight: 42 to 52 parts bismuth; 31 to 39 parts lead; 1 to 8.5 parts cadmium; and 3 to 15 parts tin.
Claim 8
Dependent Claim
44 words
The bus bar assembly as set forth in claim 1 or claim 6 wherein said current carrying member comprises: a flexible strip capable of bending in the plane containing its major surface about an inside radius of less than one half inch (1.3 cm).
Claim 9
Dependent Claim
17 words
The bus bar assembly as set forth in claim 7 wherein said flexible strip comprises a mesh.
Claim 10
Dependent Claim
60 words
The bus bar assembly as set forth in claim 8 wherein said mesh is selected from the group consisting of copper, silver, gold, aluminum, or platinum, and is formed of a foil 3 to 8 mils (0.08 to 0.2 mm) thick and has strands 7 to 10 mils (0.18 to 0.25 mm) wide in a 2/0 to 4/0 gauge mesh.
Claim 11
Dependent Claim
24 words
The bus bar assembly as set forth in claim 1 wherein said non-electroconductive substrate is selected from the group consisting of glass and plastic.
Claim 12
Dependent Claim
23 words
The bus bar assembly as set forth in claim 1 wherein said pattern comprises an electroconductive film on a surface of said substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-04-05 | 1985-10-05 | 1986-04-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-04-05 | 1989-10-05 | 1990-04-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-04-05 | 1993-10-05 | 1994-04-06 | $7700.00 | Window Closed / Lapsed |