Photosensitive block copolymer composition and elements

Claim 2

A compatible photosensitive, elastomeric composition comprising: (1) at least 30% by weight of at least one solvent-soluble, thermoplastic, elastomeric block copolymer containing at least two thermoplastic, nonelastomeric polymer blocks having a glass transition temperature above 25° C. and an average molecular weight of 2000-100,000, and between said thermoplastic, nonelastomeric polymer blocks an elastomeric polymer block having a glass transition temperature below 10° C. and an average molecular weight of about 25,000 to 1,000,000, the thermoplastic, nonelastomeric polymer blocks being the terminal blocks of said copolymer and being connected by said elastomeric polymer block, (2) at least 1% by weight of at least one addition-polymerizable, ethylenically unsaturated compound having a boiling point at normal pressure over 100° C. taken from the group consisting of t-butyl acrylate, N,N-diethylaminoethyl acrylate, 1,4-butanediol diacrylate, hexamethylene glycol diacrylate, decamethylene glycol diacrylate, 2,2-dimethylolpropane diacrylate, tripropylene glycol diacrylate, 2,2-di(p-hydroxyphenyl)-propane diacrylate, 2,2-di(p-hydroxyphenyl)-propane dimethacrylate, polyoxyethyl-2,2-di(p-hydroxyphenyl)-propane dimethacrylate, butylene glycol dimethacrylate, hexamethylene glycol dimethacrylate, 2,2,4-trimethyl-1,3-pentanediol dimethacrylate, 1-phenylethylene-1,2-dimethacrylate, and triethyleneglycol diacrylate said addition-polymerizable, ethylenically unsaturated compound being compatible with the thermoplastic-elastomeric block copolymer component which is soluble in or which forms a solution with the ethylenically unsaturated compound; and (3) a polymerization-effective amount of polymerization initiator activatable by actinic radiation.

Claim 3

A composition according to claim 1 wherein said copolymer is polystyrene-polyisoprene-polystyrene.

Claim 4

A composition according to claim 1 wherein said copolymer is polystyrene-polybutadiene-polystyrene.

Claim 5

A photosensitive composition according to claim 1, said polymerization initiator being present in an amount of from 0.001 to 10%, by weight, and being inactive thermally below 85° C.

Claim 6

A composition according to claim 1 wherein said addition-polymerizable, ethylenically unsaturated compound contains two terminal ethylenic groups

Claim 7

A composition according to claim 1 wherein said addition-polymerizable, ethylenically unsaturated compound contains one terminal ethylenic group.

Claim 8

A compatible photosensitive, elastomeric composition in the absence of solvent comprising: (1) at least 30% by weight of at least one solvent-soluble, thermoplastic, elastomeric block copolymer containing at least two thermoplastic, nonelastomeric polymer blocks having a glass transition temperature above 25° C. and an average molecular weight of 2000-100,000, and between said thermoplastic, nonelastomeric polymer blocks an elastomeric polymer block having a glass transition temperature below 10° C. and an average molecular weight of about 25,000 to 1,000,000, the thermoplastic, nonelastomeric polymer blocks being the terminal blocks of said copolymer and being connected by said elastomeric polymer block, (2) at least 1% by weight of at least one addition-polymerizable, ethylenically unsaturated compound having a boiling point at normal pressure over 100° C. taken from the group consisting of t-butyl acrylate, N,N-diethylaminoethyl acrylate, 1,4-butanediol diacrylate, hexamethylene glycol diacrylate, decamethylene glycol diacrylate, 2,2-dimethylolpropane diacrylate, tripropylene glycol diacrylate, 2,2-di(p-hydroxyphenyl)-propane diacrylate, 2,2-di(p-hydroxyphenyl)-propane dimethacrylate, polyoxyethyl-2,2-di(p-hydroxyphenyl)-propane dimethacrylate, butylene glycol dimethacrylate, hexamethylene glycol dimethacrylate, 2,2,4-trimethyl-1,3-pentanediol dimethacrylate, 1-phenylethylene-1,2-dimethacrylate, and triethyleneglycol diacrylate said addition-polymerizable, ethylenically unsaturated compound being compatible with the thermoplastic-elastomeric block copolymer component which is soluble in or which forms a solution with the ethylenically unsaturated compound; and (3) a polymerization-effective amount of polymerization initiator activatable by actinic radiation.

Claim 9

A compatible photosensitive, elastomeric composition in the absence of solvent comprising: (1) at least 30% by weight of at least one solvent-soluble, thermoplastic, elastomeric block copolymer containing at least two thermoplastic, nonelastomeric polymer blocks having a glass transition temperature above 25° C. and an average molecular weight of 2000-100,000, and between said thermoplastic, nonelastomeric polymer blocks an elastomeric polymer block having a glass transition temperature below 10° C. and an average molecular weight of about 25,000 to 1,000,000, the thermoplastic, nonelastomeric polymer blocks being the terminal blocks of said copolymer and being connected by said elastomeric polymer block, (2) at least 1% by weight of at least one addition-polymerizable, ethylenically unsaturated compound having a boiling point at normal pressure over 100° C. taken from the group consisting of t-butyl acrylate, N,N-diethylaminoethyl acrylate, 1,4-butanediol diacrylate, hexamethylene glycol diacrylate, decamethylene glycol diacrylate, 2,2-dimethylolpropane diacrylate, tripropylene glycol diacrylate, 2,2-di(p-hydroxyphenyl)-propane diacrylate, 2,2-di(p-hydroxyphenyl)-propane dimethacrylate, polyoxyethyl-2,2-di(p-hydroxyphenyl)-propane dimethacrylate, butylene glycol dimethacrylate, hexamethylene glycol dimethacrylate, 2,2,4-trimethyl-1,3-pentanediol dimethacrylate, 1-phenylethylene-1,2-dimethacrylate, and triethyleneglycol diacrylate said addition-polymerizable, ethylenically unsaturated compound being compatible with the thermoplastic-elastomeric block copolymer component which is soluble in or which forms a solution with the ethylenically unsaturated compound; and (3) a polymerization-effective amount of polymerization initiator activatable by actinic radiation.

Claim 10

A photosensitive element comprising a layer of a composition according to claim 1 on a support, said layer having a thickness of from about 0.0005 to about 0.250 inch.

Claim 11

A photosensitive element according to claim 8, said support being a sheet support.

Claim 12

A photosensitive element comprising a layer of a composition according to claim 7 on a support, said layer having a thickness of from about 0.0005 to about 0.250 inch.