Soldering apparatus

Claim 1

An apparatus for soldering printed circuit board, comprising: a carrier adapted to support a printed circuit board; means for moving said carrier along a predetermined transfer path; a moveable plate mounted for vertical movement on a support means provided adjacent a predetermined position along said transfer path; means for moving said moveable plate up and down by a predetermined distance; a pair of transversely spaced parallel rails defining part of said transfer path and adapted for supporting engagement with said carrier, said rails each rotatably attached at the center to said moveable plate; a link member bridged between and operatively connecting said paired rails and said moveable plate; a molten solder vessel located beneath the space between said rails; a vertically moveable element provided on and moveable with said moveable plate for engagement with one of said rails at a position distant from the center thereof; means for moving said moveable element up and down by a desired distance to rotate said one rail relative to the attachment point of said one rail to said moveable plate; and means for holding said carrier at a predetermined position on said rails, whereby said carrier moving means moves said carrier onto said spaced rails, over said solder vessel, and is held in position by said carrier holding means, the circuit board and said carrier being lowered into and out of said solder vessel by the paired rails being lowered and raised by movement of said moveable plate, with the angular attitude of the circuit board relative to the solder vessel being changed by movement of said vertically moveable element.

Claim 2

An apparatus for soldering printed circuit board, comprising: a carrier adapted to support a printed circuit board; means for moving said carrier along a predetermined transfer path; a moveable plate mounted for vertical movement on a support means provided adjacent a predetermined position along said transfer path; means for moving said moveable plate up and down by a predetermined distance; a pair of transversely spaced parallel rails defining part of said transfer path and adapted for supporting engagement with said carrier, said rails each rotatably attached at the center to said moveable plate; a link member bridged between and operatively connecting said paired rails and said moveable plate; a molten solder vessel located beneath the space between said rails; a vertically moveable element provided on and moveable with said moveable plate for engagement with one of said rails at a position distant from the center thereof; means for moving said moveable element up and down by a desired distance to rotate said one rail relative to the attachment point of said one rail to said moveable plate; and means for holding said carrier at a predetermined position on said rails, whereby said carrier moving means moves said carrier onto said spaced rails, over said solder vessel, and is held in position by said carrier holding means, the circuit board and said carrier being lowered into and out of said solder vessel by the paired rails being lowered and raised by movement of said moveable plate, with the angular attitude of the circuit board relative to the solder vessel being changed by movement of said vertically moveable element.

Claim 3

An apparatus for soldering a printed circuit board, comprising: a carrier adapted to suport a printed circuit board and to be moved along a predetermined transfer path; first front and rear wheel members mounted at one side of said carrier and second front and rear wheel members mounted at the other side of said carrier; a pair of laterally spaced and vertically moveable parallel first and second track members located to define part of said transfer path, said first track member being engageable with said first front and rear wheel members of said carrier and said second track member being engageable with said second front and rear wheel members thereby to support said carrier; a molten solder vessel provided beneath the space between said first and second track members; means for moving said carrier along said transfer path and supportingly engageable with a part of said carrier at said other side; and drive means for moving said first and second track members vertically between uppermost and lowermost positions, dipping the underside of said board on said carrier in the molten solder in said vessel at said lowermost position, said drive means including cam members supportingly engaging opposite end portions on the underside of said first and second track members, and means for rotatingly driving said cam members.

Claim 4

An apparatus for soldering a printed circuit board, comprising: a carrier adapted to suport a printed circuit board and to be moved along a predetermined transfer path; first front and rear wheel members mounted at one side of said carrier and second front and rear wheel members mounted at the other side of said carrier; a pair of laterally spaced and vertically moveable parallel first and second track members located to define part of said transfer path, said first track member being engageable with said first front and rear wheel members of said carrier and said second track member being engageable with said second front and rear wheel members thereby to support said carrier; a molten solder vessel provided beneath the space between said first and second track members; means for moving said carrier along said transfer path and supportingly engageable with a part of said carrier at said other side; and drive means for moving said first and second track members vertically between uppermost and lowermost positions, dipping the underside of said board on said carrier in the molten solder in said vessel at said lowermost position, said drive means including cam members supportingly engaging opposite end portions on the underside of said first and second track members, and means for rotatingly driving said cam members.

Claim 8

An apparatus for soldering a printed circuit board, comprising: a carrier adapted to support a printed circuit board and to be moved along a predetermined transfer path; first front and rear wheel members mounted at one side of said carrier and second front and rear wheel members mounted at the other side of said carrier; a pair of laterally spaced and vertically moveable parallel first and second track members located to define part of said transfer path, said first track member being engageable with said first front and rear wheel members of said carrier and said second track member being engageable with said second front and rear wheel members thereby to support said carrier; said first track member includes first front and rear sub-tracks each having one end hinged to a vertically moveable first support member, and said second track member includes second front and rear sub-tracks each having one end hinged to a vertically moveable second support member; a molten solder vessel provided beneath the space between said first and second track members; means for moving said carrier along said transfer path and supportingly engageable with a part of said carrier at said other side; drive means coupled to said first and second support members for moving said first and second track members vertically between uppermost and lowermost positions, dipping the underside of said board on said carrier in the molten solder in said vessel at said lowermost position; and means for rocking said first and second sub-tracks about the respective hinged ends.

Claim 9

An apparatus for soldering a printed circuit board, comprising: a carrier adapted to support a printed circuit board and to be moved along a predetermined transfer path; first front and rear wheel members mounted at one side of said carrier and second front and rear wheel members mounted at the other side of said carrier; a pair of laterally spaced and vertically moveable parallel first and second track members located to define part of said transfer path, said first track member being engageable with said first front and rear wheel members of said carrier and said second track member being engageable with said second front and rear wheel members thereby to support said carrier; said first track member includes first front and rear sub-tracks each having one end hinged to a vertically moveable first support member, and said second track member includes second front and rear sub-tracks each having one end hinged to a vertically moveable second support member; a molten solder vessel provided beneath the space between said first and second track members; means for moving said carrier along said transfer path and supportingly engageable with a part of said carrier at said other side; drive means coupled to said first and second support members for moving said first and second track members vertically between uppermost and lowermost positions, dipping the underside of said board on said carrier in the molten solder in said vessel at said lowermost position; and means for rocking said first and second sub-tracks about the respective hinged ends.