Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
186 words
That method of fabricating a multi-layered structure, which contains patterns of electrical circuitry extending in the planes of the structure layers and which provides a focal plane constituted by the contiguous edges of the layers forming one end of the multi-layered structure, which method comprises: forming a first layer of supporting substrate material having the desired thickness; depositing on one surface thereof a thin film of electrical circuitry terminating at the focal plane egde of such surface in a multiplicity of equally-spaced electrical contact points having a predetermined center-to-center spacing therebetween which is not substantially greater than 0.004 inch; securing a second layer of supporting substrate material to the first layer, with the electrical circuitry therebetween; and thereafter depositing on the exposed surface of the second layer a thin film of electrical circuitry terminating at the focal plane edge of such surface in a multiplicity of equally-spaced electrical contact points having said predetermined center-to-center spacing therebetween, and each electrical contact point on the edge of the second layer having said predetermined center-to-center spacing from the nearest electrical contact point on the edge of the first layer.
Claim 2
Dependent Claim
186 words
That method of fabricating a multi-layered structure, which contains patterns of electrical circuitry extending in the planes of the structure layers and which provides a focal plane constituted by the contiguous edges of the layers forming one end of the multi-layered structure, which method comprises: forming a first layer of supporting substrate material having the desired thickness; depositing on one surface thereof a thin film of electrical circuitry terminating at the focal plane egde of such surface in a multiplicity of equally-spaced electrical contact points having a predetermined center-to-center spacing therebetween which is not substantially greater than 0.004 inch; securing a second layer of supporting substrate material to the first layer, with the electrical circuitry therebetween; and thereafter depositing on the exposed surface of the second layer a thin film of electrical circuitry terminating at the focal plane edge of such surface in a multiplicity of equally-spaced electrical contact points having said predetermined center-to-center spacing therebetween, and each electrical contact point on the edge of the second layer having said predetermined center-to-center spacing from the nearest electrical contact point on the edge of the first layer.
Claim 3
Dependent Claim
28 words
The layered structure fabricating method of claim 1 wherein the circuitry-forming and next-layer-adding steps are continued until the desired number of layers have been included in the structure.
Claim 4
Dependent Claim
36 words
The layered structure fabricating method of claim 1 wherein: the respective locations of the electrical circuitry on the two layers are optically aligned with one another during formation of the electrical circuitry on the second layer.
Claim 5
Dependent Claim
28 words
The layered structure fabricating method of claim 3 wherein the circuitry-forming and next-layer-adding steps are continued until the desired number of layers have been included in the structure.
Claim 6
Dependent Claim
27 words
The layered structure fabricating method of claim 3 wherein the electrical circuitry patterns on the layers are thin film conductors formed by photo-delineation of the desired pattern.
Claim 7
Dependent Claim
23 words
The layered structure fabricating method of claim 5 wherein the optical alignment step is performed during the photo-delineation of the desired circuitry pattern.
Claim 8
Dependent Claim
57 words
The layered structure fabricating method of claim 6 wherein: the underlying layer has one or more alignment marks thereon; a mask is used for photo-delineation purposes which has one or more alignment marks thereon; and the alignment marks on the underlying layer and on the mask are microscopically aligned prior to photo-delineation on the layer being added.
Claim 9
Dependent Claim
26 words
The layered structure fabricating method of claim 7 wherein the alignment mark on the underlying layer is located on a projecting tab which is subsequently removed.