Patent US4302268A successfully refreshed from Google Patents.
US4302268A
Expired / Lapsed
US
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Process for preparing flexible printed-circuit board
Assignee: Resonac Corp
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Filing: 1980-05-21
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Granted: 1981-11-24
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Expires: 2000-05-21
Abstract
Abstract A flexible printed-circuit board is covered imagewise with a polymer film as a cover layer to improve the flexibility of the board. The cover layer is formed by laminating a photoprintable, photosensitive layer supported on a flexible support to the surface of a flexible printed-circuit board, exposing the photosensitive layer imagewise to light to form a polymer image in the layer and removing the unexposed areas of the layer to leave an imaged polymer film on the surface of the board. The formation of the cover layer can be easily conducted by a continuous operation.
Inventors
- 👤 Shigeo Tachiki
- 👤 Toshiaki Ishimaru
- 👤 Nobuyuki Hayashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 16:03
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/281; G; G03; G03F; G03F7/00; G03F7/004; G03F7/09; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2203/00; H05K2203/06; H05K2203/066; H05K3/0011; H05K3/0017; H05K3/0023
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
86 words
A process for preparing a flexible printed-circuit board which comprises the steps of: (1) laminating a photoprintable, photosensitive layer which is supported on a polymer film support, to the surface of a flexible printed-circuit board with a conductor pattern, (2) exposing the photoprintable, photosensitive layer imagewise to light either before or after removing the support from the layer, (3) removing the unexposed areas of the photoprintable, photosensitive layer to leave an imaged polymer film as a cover layer on the surface of the flexible printed-circuit board.
Claim 2
Dependent Claim
86 words
A process for preparing a flexible printed-circuit board which comprises the steps of: (1) laminating a photoprintable, photosensitive layer which is supported on a polymer film support, to the surface of a flexible printed-circuit board with a conductor pattern, (2) exposing the photoprintable, photosensitive layer imagewise to light either before or after removing the support from the layer, (3) removing the unexposed areas of the photoprintable, photosensitive layer to leave an imaged polymer film as a cover layer on the surface of the flexible printed-circuit board.
Claim 3
Dependent Claim
20 words
A process according to claim 1, wherein the photosensitive layer has a thickness that varies from 15 to 120 μm.
Claim 4
Dependent Claim
47 words
A process according to claim 1, wherein lamination of the photoprintable photosensitive layer supported on a polymer film support is effected by a roll to roll operation in a continuous manner to provide the cover layer which protects and increases the flexibility of the flexible printed-circuit board.
References Cited (Backward Citations)
US4127436A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-11-23 | 1985-05-25 | 1985-11-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-11-23 | 1989-05-25 | 1989-11-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-11-23 | 1993-05-25 | 1993-11-24 | $7700.00 | Window Closed / Lapsed |