Method of soldering a lead to a sintered lead pad

Claim 1

The method of soldering a lead to a lead pad on a substrate comprising the steps of: printing a conductor pattern including at least one lead pad on the substrate using a gold composition, said gold composition being composed of finely divided gold particles and finely divided inorganic binder particles dispersed in an inert liquid vehicle, by weight 98 to 99 percent gold particles and complementally 2.0 to 1.0 percent inorganic binder particles, the binder consisting essentially by total weight of gold and binder of: 0.6 to 0.2 percent copper 0.2 percent lead 0.2 percent cadmium and the balance glass; firing the substrate to sinter the inorganic materials of the gold composition; presoldering the lead pad with a lead indium solder using a noncorrosive solder flux; presoldering a lead with a lead indium solder using a noncorrosive solder flux; and soldering the presoldered lead to the presoldered lead pad using a noncorrosive solder.

Claim 2

The method of soldering a lead to a lead pad on a substrate comprising the steps of: printing a conductor pattern including at least one lead pad on the substrate using a gold composition, said gold composition being composed of finely divided gold particles and finely divided inorganic binder particles dispersed in an inert liquid vehicle, by weight 98 to 99 percent gold particles and complementally 2.0 to 1.0 percent inorganic binder particles, the binder consisting essentially by total weight of gold and binder of: 0.6 to 0.2 percent copper 0.2 percent lead 0.2 percent cadmium and the balance glass; firing the substrate to sinter the inorganic materials of the gold composition; presoldering the lead pad with a lead indium solder using a noncorrosive solder flux; presoldering a lead with a lead indium solder using a noncorrosive solder flux; and soldering the presoldered lead to the presoldered lead pad using a noncorrosive solder.

Claim 3

The method of soldering a lead to a lead pad on a substrate comprising the steps of: printing a conductor pattern including at least one lead pad on the substrate using a gold composition, said gold composition being composed of finely divided gold particles and finely divided inorganic binder particles dispersed in an inert liquid vehicle, by weight 98 to 99% gold particles and complementally 2.0 to 1.0% inorganic binder particles, the binder consisting essentially by total weight of gold and binder of: 0.6 to 0.2 percent copper 0.2 percent lead 0.2 percent cadmium and the balance glass: allowing the print to level at room temperature: heating the substrate to a temperature substantially not exceeding 130° C. until substantially dry; firing the substrate to sinter the inorganic materials; vapor degreasing the fired substrate; applying a noncorrosive solder flux to the lead pad; placing a solder preform on the lead pad; heating the substrate to allow the solder on the lead pad to liquify: cooling the substrate to solidify the solder; presoldering a lead; cleaning the flux off of the lead; applying a noncorrosive solder flux to the solder on the lead pad; heating the substrate to a temperature at which the solder begins to reflow: placing the presoldered wire on the lead pad; maintaining the solder in a liquid state for a predetermined period of time; cooling the substrate to ambient temperature, and cleaning the substrate and the lead soldered to the lead pad.

Claim 4

The method of soldering a lead to a lead pad on a substrate comprising the steps of: printing a conductor pattern including at least one lead pad on the substrate using a gold composition, said gold composition being composed of finely divided gold particles and finely divided inorganic binder particles dispersed in an inert liquid vehicle, by weight 98 to 99% gold particles and complementally 2.0 to 1.0% inorganic binder particles, the binder consisting essentially by total weight of gold and binder of: 0.6 to 0.2 percent copper 0.2 percent lead 0.2 percent cadmium and the balance glass: allowing the print to level at room temperature: heating the substrate to a temperature substantially not exceeding 130° C. until substantially dry; firing the substrate to sinter the inorganic materials; vapor degreasing the fired substrate; applying a noncorrosive solder flux to the lead pad; placing a solder preform on the lead pad; heating the substrate to allow the solder on the lead pad to liquify: cooling the substrate to solidify the solder; presoldering a lead; cleaning the flux off of the lead; applying a noncorrosive solder flux to the solder on the lead pad; heating the substrate to a temperature at which the solder begins to reflow: placing the presoldered wire on the lead pad; maintaining the solder in a liquid state for a predetermined period of time; cooling the substrate to ambient temperature, and cleaning the substrate and the lead soldered to the lead pad.

Claim 5

The method of soldering a copper lead to a lead pad on an alumina substrate having a thin dielectric layer of alumina mixed with glass on one surface of the substrate comprising the steps of: printing a conductor pattern including a lead pad on the dielectric layer of the substrate using a gold composition, said gold composition being composed of finely divided gold particles and finely divided inorganic binder particles dispersed in an inert liquid vehicle, by weight 98.5% gold particles and complementally 1.5% inorganic binder particles, the binder consisting essentially by total weight of gold and binder of: 0.5 percent copper 0.2 percent lead 0.2 percent cadmium, and the balance glass; allowing the print to level at room temperature, drying the print for twenty minutes in air at a temperature of from 110° to 130° C.; firing the substrate at a temperature of 125°±5° C. for seven minutes minimum, the rise and fall rate being from 60° to 100° C. per minute, the total cycle time being of the order of 40-45 minutes in air; vapor degreasing the fired substrate with trichloroethane; drying the substrate with nitrogen gas; placing the substrate in a preheat stage and raising the temperature to 135° C.±5° for three minutes; applying a non-activated liquid rosin solder flux to the lead pad at a temperature of about 240°±5° C.; placing a solder preform 50% indium, 50% lead on the lead pad; allowing the solder to flow for two seconds; cooling the substrate for approximately two minutes; presoldering a copper lead with 50% indium, 50% lead; dipping the presoldered lead into pure trichloroethylene at plus 80°±5° C. to clean off the flux; applying a non-activated liquid rosin solder flux to the solder on the lead pad; heating the substrate to a temperature at which the solder on the lead pad begins to reflow; placing the presoldered wire in the liquid solder on the lead pad; continuing to heat the substrate to maintain the solder in a liquid state for approximately two minutes; and cooling the substrate, the lead pad and the lead; and cleaning the substrate and lead soldered to the lead pad with trichloroethylene at plus 80°±5° C.

Claim 6

The method of soldering a copper lead to a lead pad on an alumina substrate having a thin dielectric layer of alumina mixed with glass on one surface of the substrate comprising the steps of: printing a conductor pattern including a lead pad on the dielectric layer of the substrate using a gold composition, said gold composition being composed of finely divided gold particles and finely divided inorganic binder particles dispersed in an inert liquid vehicle, by weight 98.5% gold particles and complementally 1.5% inorganic binder particles, the binder consisting essentially by total weight of gold and binder of: 0.5 percent copper 0.2 percent lead 0.2 percent cadmium, and the balance glass; allowing the print to level at room temperature, drying the print for twenty minutes in air at a temperature of from 110° to 130° C.; firing the substrate at a temperature of 125°±5° C. for seven minutes minimum, the rise and fall rate being from 60° to 100° C. per minute, the total cycle time being of the order of 40-45 minutes in air; vapor degreasing the fired substrate with trichloroethane; drying the substrate with nitrogen gas; placing the substrate in a preheat stage and raising the temperature to 135° C.±5° for three minutes; applying a non-activated liquid rosin solder flux to the lead pad at a temperature of about 240°±5° C.; placing a solder preform 50% indium, 50% lead on the lead pad; allowing the solder to flow for two seconds; cooling the substrate for approximately two minutes; presoldering a copper lead with 50% indium, 50% lead; dipping the presoldered lead into pure trichloroethylene at plus 80°±5° C. to clean off the flux; applying a non-activated liquid rosin solder flux to the solder on the lead pad; heating the substrate to a temperature at which the solder on the lead pad begins to reflow; placing the presoldered wire in the liquid solder on the lead pad; continuing to heat the substrate to maintain the solder in a liquid state for approximately two minutes; and cooling the substrate, the lead pad and the lead; and cleaning the substrate and lead soldered to the lead pad with trichloroethylene at plus 80°±5° C.