Patent DE503581C successfully refreshed from Google Patents.
Patent US4293451A successfully refreshed from Google Patents.
US4293451A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Screenable contact structure and method for semiconductor devices
Assignee: Individual
•
Filing: 1979-12-27
•
Granted: 1981-10-06
•
Expires: 1999-12-27
Abstract
Abstract An ink composition for deposition upon the surface of a semiconductor device to provide a contact area for connection to external circuitry is disclosed, the composition comprising an ink system containing a metal powder, a binder and vehicle, a metal frit, and a fluxing agent. The ink is screened onto the semiconductor surface in the desired pattern and is heated to a temperature sufficient to cause the metal frit to become liquid. The metal frit dissolves some of the metal powder and densifies the structure by transporting the dissolved metal powder in a liquid sintering process. A two-step heating process may be used, the first step serving to activate the fluxing agent to prepare the semiconductor surface. The sintering process may be carried out in various types of atmospheres depending upon the metal powder utilized. A small amount of dopant, semiconductor material or a semiconductor-dopant eutectic alloy powder may be added to the ink system.
Inventors
- 👤 Bernd Ross
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 20:16
CPC Classifications
B; B22; B22F; B22F1/00; B22F1/12; H; H10; H10F; H10F77/00; H10F77/20; H10F77/206; H10F77/211; H10P; H10P14/00; H10P14/40; H10P95/00; H10P95/50; H10W; H10W20/00; H10W20/40; H10W72/00; H10W72/90; H10W72/01; H10W72/019; H10W72/01961; H10W72/071; H10W72/073; H10W72/07331; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; Y; Y02; Y02E; Y02E10/00; Y02E10/50
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
93 words
A method of fabricating an electrical contact upon a substrate, comprising the steps of screening a metal frit ink comprising a metal powder and a metal frit in a predetermined pattern upon said substrate, said ink containing a fluxing agent capable of dissolving insulating substances on said substrate, dissolving any insulating substances present on said substrate by activating said fluxing agent, and sintering said ink by firing to a temperature above the melting point of the metal frit and below the melting point of the metal powder to create a coherent metal contact.
Claim 2
Independent Claim
93 words
A method of fabricating an electrical contact upon a substrate, comprising the steps of screening a metal frit ink comprising a metal powder and a metal frit in a predetermined pattern upon said substrate, said ink containing a fluxing agent capable of dissolving insulating substances on said substrate, dissolving any insulating substances present on said substrate by activating said fluxing agent, and sintering said ink by firing to a temperature above the melting point of the metal frit and below the melting point of the metal powder to create a coherent metal contact.
Claim 3
Dependent Claim
30 words
The method of claim 1 wherein said fluxing agent is a metal fluoride and said step of dissolving comprises heating said ink to a temperature sufficient to decompose said fluoride.
Claim 4
Dependent Claim
60 words
A metal powder composition for deposition and firing upon a substrate, comprising a screenable metal powder, a binder, a vehicle, a metal frit for use as a liquid medium to transport the metal powder in a liquid sintering process and thereby create a coherent metal structure, and a fluxing agent comprising silver fluoride for dissolving insulating substances from said substrate.
Claim 5
Dependent Claim
60 words
A metal powder composition for deposition and firing upon a substrate, comprising a screenable metal powder, a binder, a vehicle, a metal frit for use as a liquid medium to transport the metal powder in a liquid sintering process and thereby create a coherent metal structure, and a fluxing agent comprising silver fluoride for dissolving insulating substances from said substrate.
Claim 6
Dependent Claim
51 words
A metal powder composition for deposition and firing upon a substrate, comprising a screenable powder of a metal having an electrical resistivity of 7.0 ohm-cm or less at 0° C., a binder, a vehicle, a metal frit, and a fluxing agent comprising silver fluoride for dissolving insulating substances from said substrate.
Claim 7
Dependent Claim
51 words
A metal powder composition for deposition and firing upon a substrate, comprising a screenable powder of a metal having an electrical resistivity of 7.0 ohm-cm or less at 0° C., a binder, a vehicle, a metal frit, and a fluxing agent comprising silver fluoride for dissolving insulating substances from said substrate.
Claim 8
Dependent Claim
65 words
A metal powder composition for deposition and firing upon a substrate, comprising a screenable powder of a metal having an electrical resistivity of 7.0 ohm-cm or less at 0° C., a binder, a vehicle, a metal frit having a melting point approximately in the range of 200° C. to 750° C., and a fluxing agent comprising silver fluoride for dissolving insulating substances from said substrate.
Claim 9
Dependent Claim
65 words
A metal powder composition for deposition and firing upon a substrate, comprising a screenable powder of a metal having an electrical resistivity of 7.0 ohm-cm or less at 0° C., a binder, a vehicle, a metal frit having a melting point approximately in the range of 200° C. to 750° C., and a fluxing agent comprising silver fluoride for dissolving insulating substances from said substrate.
Claim 10
Dependent Claim
14 words
A composition according to claim 3, 4, or 5 further including a semiconductor powder.
Claim 11
Dependent Claim
24 words
A composition according to claim 3, 4, or 5 further including a dopant selected from the group consisting of N and P type dopants.
Claim 12
Dependent Claim
30 words
A composition according to claim 3, 4, or 5 wherein the amount of the metal frit is in the range of one to twenty percent by weight of the composition.
Claim 13
Dependent Claim
31 words
A composition according to claim 3, 4, or 5 wherein the metal powder is selected from the group consisting of copper, nickel, aluminum, silver, and gold, and alloys and combinations thereof.
Claim 14
Dependent Claim
33 words
A composition according to claim 3, 4, or 5 wherein the metal frit is selected from the group consisting of lead, tin, zinc, cadmium, indium, bismuth, antimony, aluminum, and alloys and combinations thereof.
Claim 15
Dependent Claim
88 words
A metal powder composition for deposition and firing upon a substrate, comprising a screenable metal powder selected from the group consisting of copper, nickel, aluminum, silver, gold, and combinations and alloys thereof, a binder, a vehicle, a metal frit selected from the group consisting of lead, tin, zinc, cadmium, indium, bismuth, antimony, aluminum, and combinations and alloys thereof, a semiconductor powder, a dopant selected from the group consisting of N and P type dopants, and a fluxing agent comprising silver fluoride for dissolving insulating substances from said substrate.
Claim 16
Dependent Claim
88 words
A metal powder composition for deposition and firing upon a substrate, comprising a screenable metal powder selected from the group consisting of copper, nickel, aluminum, silver, gold, and combinations and alloys thereof, a binder, a vehicle, a metal frit selected from the group consisting of lead, tin, zinc, cadmium, indium, bismuth, antimony, aluminum, and combinations and alloys thereof, a semiconductor powder, a dopant selected from the group consisting of N and P type dopants, and a fluxing agent comprising silver fluoride for dissolving insulating substances from said substrate.
Claim 17
Dependent Claim
55 words
A metal powder composition for deposition and firing upon a semiconductor substrate, comprising a screenable metal powder, a binder, a vehicle, a metal frit for use as a liquid medium to transport the metal powder in a liquid sintering process and thereby create a coherent metal structure, and a powder comprising a semiconductor-dopant eutectic alloy.
Claim 18
Dependent Claim
55 words
A metal powder composition for deposition and firing upon a semiconductor substrate, comprising a screenable metal powder, a binder, a vehicle, a metal frit for use as a liquid medium to transport the metal powder in a liquid sintering process and thereby create a coherent metal structure, and a powder comprising a semiconductor-dopant eutectic alloy.
Claim 19
Dependent Claim
46 words
A metal powder composition for deposition and firing upon a semiconductor substrate, comprising a screenable powder of a metal having an electrical resistivity of 7.0 ohm-cm or less at 0° C., a binder, a vehicle, a metal frit, and a powder comprising a semiconductor-dopant eutectic alloy.
Claim 20
Dependent Claim
46 words
A metal powder composition for deposition and firing upon a semiconductor substrate, comprising a screenable powder of a metal having an electrical resistivity of 7.0 ohm-cm or less at 0° C., a binder, a vehicle, a metal frit, and a powder comprising a semiconductor-dopant eutectic alloy.
Claim 21
Dependent Claim
60 words
A metal powder composition for deposition and firing upon a semiconductor substrate, comprising a screenable powder of a metal having an electrical resistivity of 7.0 ohm-cm or less at 0° C., a binder, a vehicle, a metal frit having a melting point approximately in the range of 200° C. to 750° C., and a powder comprising a semiconductor-dopant eutectic alloy.
Claim 22
Dependent Claim
60 words
A metal powder composition for deposition and firing upon a semiconductor substrate, comprising a screenable powder of a metal having an electrical resistivity of 7.0 ohm-cm or less at 0° C., a binder, a vehicle, a metal frit having a melting point approximately in the range of 200° C. to 750° C., and a powder comprising a semiconductor-dopant eutectic alloy.
Claim 23
Dependent Claim
14 words
A composition according to claim 12, 13, or 14 further including a semiconductor powder.
Claim 24
Dependent Claim
24 words
A composition according to claim 12, 13, or 14 further including a dopant selected from the group consisting of N and P type dopants.
Claim 25
Dependent Claim
14 words
A composition according to claim 12, 13, or 14 further comprising a fluxing agent.
Claim 26
Dependent Claim
30 words
A composition according to claim 12, 13, or 14 wherein the amount of the metal frit is in the range of one to twenty percent by weight of the composition.
Claim 27
Dependent Claim
31 words
A composition according to claim 12, 13, or 14 wherein the metal powder is selected from the group consisting of copper, nickel aluminum, silver, and gold, and alloys and combinations thereof.
Claim 28
Dependent Claim
33 words
A composition according to claim 12, 13, or 14 wherein the metal frit is selected from the group consisting of lead, tin, zinc, cadmium, indium, bismuth, antimony, aluminum, and alloys and combinations thereof.
Claim 29
Dependent Claim
85 words
A metal powder composition for deposition and firing upon a substrate, comprising a screenable metal powder selected from the group consisting of copper, nickel, aluminum, silver, gold, and combinations and alloys thereof, a binder, a vehicle, a metal frit selected from the group consisting of lead, tin, zinc, cadmium, indium, bismuth, antimony, aluminum, and combinations and alloys thereof, a semiconductor powder, a dopant selected from the group consisting of N and P type dopants, a fluxing agent, and a powder comprising a semiconductor-dopant eutectic alloy.
Claim 30
Dependent Claim
85 words
A metal powder composition for deposition and firing upon a substrate, comprising a screenable metal powder selected from the group consisting of copper, nickel, aluminum, silver, gold, and combinations and alloys thereof, a binder, a vehicle, a metal frit selected from the group consisting of lead, tin, zinc, cadmium, indium, bismuth, antimony, aluminum, and combinations and alloys thereof, a semiconductor powder, a dopant selected from the group consisting of N and P type dopants, a fluxing agent, and a powder comprising a semiconductor-dopant eutectic alloy.
Claim 31
Dependent Claim
21 words
A composition according to claim 12, 13, or 14 further comprising a fluxing agent selected from the group consisting of fluorides.
Claim 32
Dependent Claim
17 words
A composition according to claim 12, 13, or 14 further comprising a fluxing agent comprising silver fluoride.
Claim 33
Dependent Claim
18 words
A composition according to claim 21 wherein the fluxing agent is selected from the group consisting of fluorides.
Claim 34
Dependent Claim
13 words
A composition according to claim 21 wherein the fluxing agent comprises silver fluoride.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-10-05 | 1985-04-06 | 1985-10-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-10-05 | 1989-04-06 | 1989-10-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-10-05 | 1993-04-06 | 1993-10-06 | $7700.00 | Window Closed / Lapsed |