Connector for integrated circuit packages

Claim 2

A connector for removably mounting an integrated circuit package on a backpanel having at least one hole formed therethrough and for electrically coupling the integrated circuit package to the terminal pads of the backpanel, said connector comprising: (a) a carrier member of planar configuration for positioning adjacent one of the planar surfaces of the backpanel and movable toward the backpanel, said carrier member having at least one boss extending normally from one planar surface thereof for slidable positioning in the hole formed in the backpanel when said carrier member is positioned adjacent thereto; (b) at least one integrated circuit package mounted on the other planar surface of said carrier member and having electrical contact means thereon; (c) electrical interconnecting means on said carrier member in conductive contact with the electrical contact means of said integrated circuit package and for pressurized conductive contact with the terminal pads of the backpanel when said carrier member is positioned adjacent thereto; (d) stud means extending axially from the boss of said carrier member so as to extend through the hole of the backpanel when said carrier member is positioned adjacent thereto; and (e) a mounting plate positionable in contiguous contact with the opposite planar surface of the backpanel and laterally movable relative thereto, said mounting plate having at least one aperture means formed therethrough for receiving said stud means when said carrier member and said mounting plate are positioned adjacent the opposite planar surfaces of the backpanel, said stud means interacting with the aperture means of said mounting plate upon lateral movement thereof to pull said carrier member toward the backpanel to provide the pressurized conductive contact between said electrical interconnecting means and the terminal pads of the backpanel.

Claim 3

A connector as claimed in claim 1 wherein said electrical interconnecting means comprises: (a) a plurality of terminal pads arranged on the other planar surface of said carrier member in an array which matches the arrangement of the electrical contact means of said integrated circuit package; (b) a plurality of conductive runs each leading from a different one of said terminal pads to the edges of said carrier member; and (c) a plurality of edge contacts mounted on the edges of said carrier member, each of said edge contacts in conductive contact with a different one of said conductive runs and each having a spring contact portion which extends beyond the one planar surface of said carrier member.

Claim 4

A connector as claimed in claim 1 wherein the aperture means formed in said mounting plate comprises: (a) a lower surface formed on said mounting plate; (b) an upper surface formed on said mounting plate and laterally spaced from said lower surface; (c) an inclined plane surface extending angularly between said lower surface and said upper surface; and (d) said mounting plate having a keyhold shaped aperture formed therethrough, said aperture having an enlarged portion which opens downwardly onto said upper surface and having a narrowed slot which opens downwardly onto said inclined plane surface and onto said lower surface.

Claim 5

A connector as claimed in claim 1 wherein the aperture means formed in said mounting plate comprises: (a) an upper surface forming the top of a recessed cavity provided in the lower planar surface of said mounting plate; (b) an inclined plane surface formed in said mounting plate so as to extend laterally angularly and downwardly from said upper surface to the lower planar surface of said mounting plate; and (c) said mounting plate having a keyhole shaped aperture formed therethrough, said aperture having an enlarged portion which opens downwardly onto said upper surface and having a narrowed slot which opens downwardly onto said inclined plane surface and onto the lower planar surface of said mounting plate.

Claim 6

A connector as claimed in claim 1 wherein the aperture means formed in said mounting plate comprises: (a) a depending pedestal formed on said mounting plate and having a lower surface; (b) an inclined plane surface extending laterally angularly and upwardly from the lower surface of said pedestal to the lower planar surface of said mounting plate; and (c) said mounting plate having a keyhole shaped aperture formed therethrough, said aperture having an enlarged portion which opens downwardly onto the lower planar surface of said mounting plate adjacent said inclined plane surface and having a narrowed slot which opens downwardly onto said inclined plane surface and onto the lower surface of said pedestal.

Claim 7

A connector as claimed in claim 1 wherein said stud means comprises:

Claim 8

(a) a shank portion extending axially from the boss of said carrier member; and (b) an enlarged head on the extending end of said shank.

Claim 9

(a) a shank portion extending axially from the boss of said carrier member; and (b) an enlarged head on the extending end of said shank.

Claim 10

A connector as claimed in claim 1 and further comprising: (a) said stud means including, I. a shank portion extending axially from the boss of said carrier member, II. an enlarged head on the extending end of said shank; and (b) said aperture means formed in said mounting plate being of keyhole shaped configuration and extending between the opposite planar surfaces thereof, said keyhole shaped aperture having an enlarged portion for receiving said enlarged head of said stud means and having a narrowed slot which straddles said shank when said mounting plate is positioned in contiguous engagement with the opposite planar surface of the backpanel and moved laterally thereon.

Claim 11

A connector as claimed in claim 1 and further comprising: (a) said carrier member being of elongated rectangular configuration and having a plurality of the bosses extending normally therefrom; (b) a plurality of said integrated circuit packages mounted on the other planar surface of said carrier member in side-by-side positions along the length thereof; and (c) a plurality of said stud means each extending axially from a different one of the plurality of bosses of said carrier member.

Claim 12

A connector for removably mounting an integrated circuit package on a backpanel having at least one hole formed therethrough and for electrically connecting the integrated circuit package to the terminal pads of the backpanel, said connector comprising: (a) a carrier member of planar configuration for positioning adjacent one of the planar surfaces of the backpanel and movable toward the backpanel, said carrier member having at least one boss extending normally from one planar surface thereof for slidable positioning in the hole formed in the backpanel when said carrier member is positioned adjacent thereto; (b) at least one integrated circuit package positioned on the opposite planar surface of said carrier member and having leads extending from at least two of the opposed sides of a planar substrate; (c) means formed in said carrier member for receiving the leads of said integrated circuit package and allowing those leads to be positioned so that the extending ends thereof are disposed to lay on the one planar surface of said carrier member; (d) stud means extending axially from the boss of said carrier member so as to extend through the hole of the backpanel when said carrier is positioned adjacent thereto; and (e) a mounting plate positionable in contiguous contact with the opposite planar surface of the backpanel and laterally movable relative thereto, said mounting plate having at least one aperture means formed therethrough for receiving said stud means when said carrier member and said mounting plate are positioned adjacent the opposite planar surfaces of the backpanel, said stud means interacting with the aperture means upon lateral movement of said mounting plate to pull said carrier member toward the backpanel and move the extending ends of the leads of the integrated circuit package into pressurized conductive contact with the terminal pads of the backpanel.

Claim 13

A connector for removably mounting an integrated circuit package on a backpanel having at least one hole formed therethrough and for electrically connecting the integrated circuit package to the terminal pads of the backpanel, said connector comprising: (a) a carrier member of planar configuration for positioning adjacent one of the planar surfaces of the backpanel and movable toward the backpanel, said carrier member having at least one boss extending normally from one planar surface thereof for slidable positioning in the hole formed in the backpanel when said carrier member is positioned adjacent thereto; (b) at least one integrated circuit package positioned on the opposite planar surface of said carrier member and having leads extending from at least two of the opposed sides of a planar substrate; (c) means formed in said carrier member for receiving the leads of said integrated circuit package and allowing those leads to be positioned so that the extending ends thereof are disposed to lay on the one planar surface of said carrier member; (d) stud means extending axially from the boss of said carrier member so as to extend through the hole of the backpanel when said carrier is positioned adjacent thereto; and (e) a mounting plate positionable in contiguous contact with the opposite planar surface of the backpanel and laterally movable relative thereto, said mounting plate having at least one aperture means formed therethrough for receiving said stud means when said carrier member and said mounting plate are positioned adjacent the opposite planar surfaces of the backpanel, said stud means interacting with the aperture means upon lateral movement of said mounting plate to pull said carrier member toward the backpanel and move the extending ends of the leads of the integrated circuit package into pressurized conductive contact with the terminal pads of the backpanel.

Claim 14

A connector as claimed in claim 9 and further comprising a layer of resilient elastomeric material interposed between the one planar surface of said carrier member and the extending ends of the leads of said integrated circuit package.

Claim 15

A connector as claimed in claim 9 wherein the aperture means formed in said mounting plate comprises: (a) a lower surface formed on said mounting plate; (b) an upper surface formed on said mounting plate and laterally spaced from said lower surface; (c) an inclined plane surface extending angularly between said lower surface and said upper surface; and (d) said mounting plate having a keyhole shaped aperture formed therethrough, said aperture having an enlarged portion which opens downwardly onto said upper surface and having a narrowed slot which opens downwardly onto said inclined plane surface and onto said lower surface.

Claim 16

A connector as claimed in claim 9 wherein said stud means comprises: (a) a shank extending axially from said boss of said carrier member; and (b) an enlarged head on the extending end of said shank.

Claim 17

A connector as claimed in caim 9 and further comprising: (a) said stud means including, I. a shank portion extending axially from the boss of said carrier member, II. an enlarged head on the extending end of said shank; and (b) said aperture means formed in said mounting plate being of keyhole shaped configuration and extending between the opposite planar surfaces thereof, said keyhole shaped aperture having an enlarged portion for receiving said enlarged head of said stud means and having a narrowed slot which straddles said shank when said mounting plate is positioned in contiguous engagement with the opposite planar surface of the backpanel and moved laterally thereon.

Claim 18

A connector as claimed in claim 9 and further comprising: (a) said carrier member being of elongated rectangular configuration and having a plurality of the bosses extending therefrom; (b) a plurality of said integrated circuit packages mounted on the opposite planar surface of said carrier member in a side-by-side relationship along the length thereof; and (c) a plurality of said stud means each extending axially from a different one of the plurality of bosses of said carrier member.

Claim 19

A combination of an integrated circuit package and connector for removably mounting the integrated circuit package on a backpanel having at least one hole formed therethrough and for electrically connecting the integrated circuit package to the terminal pads of the backpanel, said combination comprising: (a) an integrated circuit package for positioning adjacent one of the planar surfaces of the backpanel and movable toward the backpanel, said circuit package moving electrical contact means thereon and having at least one boss extending therefrom for slidable positioning in the hole of the backpanel when said circuit package is positioned adjacent thereto; (b) stud means extending coaxially from the boss of said circuit package so as to extend through the hole of the backpanel when said circuit package is positioned adjacent the one surface of the backpanel; and (c) a mounting plate positionable in contiguous engagement with the opposite planar surface of the backpanel and laterally movable thereon, said mounting plate having at least one aperture means formed therethrough for receiving said stud means when said circuit package and said mounting plate are positioned adjacent the opposite surfaces of the backpanel, said stud means interacting with the aperture means of said mounting plate upon lateral movement thereof to pull said circuit package toward the backpanel and move the electrical contact means of said circuit package into pressurized conductive contact with the terminal pads of the backpanel.

Claim 20

A combination of an integrated circuit package and connector for removably mounting the integrated circuit package on a backpanel having at least one hole formed therethrough and for electrically connecting the integrated circuit package to the terminal pads of the backpanel, said combination comprising: (a) an integrated circuit package for positioning adjacent one of the planar surfaces of the backpanel and movable toward the backpanel, said circuit package moving electrical contact means thereon and having at least one boss extending therefrom for slidable positioning in the hole of the backpanel when said circuit package is positioned adjacent thereto; (b) stud means extending coaxially from the boss of said circuit package so as to extend through the hole of the backpanel when said circuit package is positioned adjacent the one surface of the backpanel; and (c) a mounting plate positionable in contiguous engagement with the opposite planar surface of the backpanel and laterally movable thereon, said mounting plate having at least one aperture means formed therethrough for receiving said stud means when said circuit package and said mounting plate are positioned adjacent the opposite surfaces of the backpanel, said stud means interacting with the aperture means of said mounting plate upon lateral movement thereof to pull said circuit package toward the backpanel and move the electrical contact means of said circuit package into pressurized conductive contact with the terminal pads of the backpanel.

Claim 21

The combination of claim 15 wherein the aperture means formed in said mounting plate comprises: (a) a lower surface formed on said mounting plate; (b) an upper surface formed on said mounting plate and laterally spaced from said lower surface; (c) an inclined plane surface extending angularly between said lower surface and said upper surface; and (d) said mounting plate having a keyhole shaped aperture formed therethrough, said aperture having an enlarged portion which opens downwardly onto said upper surface and having a narrowed slot which opens downwardly onto said inclined plane surface and onto said lower surface.

Claim 22

The combination of claim 15 wherein said stud means comprises: (a) a shank portion extending axially from the boss of said integrated circuit package; and (b) an enlarged head on the extending end of said shank.

Claim 23

The combination of claim 15 and further comprising: (a) said stud means including, I. a shank portion extending axially from the boss of said integrated circuit package, II. an enlarged head on the extending end of said shank; and (b) said aperture means formed in said mounting plate being of keyhole shaped configuration and extending between the opposite planar surfaces thereof, said keyhole shaped aperture having an enlarged portion for receiving said enlarged head of said stud means and having a narrowed slot which straddles said shank when said mounting plate is positioned in contiguous engagement with the opposite planar surface of the backpanel and moved laterally thereon.

Claim 24

The combination of claim 15 and further comprising: (a) said integrated circuit package being of square planar configuration and have four of the bosses with each of those bosses extending from a different corner of said integrated circuit package; and (b) four of said stud means each extending axially from a different one of the four of said bosses of said circuit package.

Claim 25

The combination of claim 15 and further comprising: (a) a cooling cover having a downwardly opening chamber formed therein; (b) said integrated circuit package sealingly mounted in the chamber of said cooling cover with the top of said circuit package spaced below the upper portion of the chamber to form a liquid tight compartment immediately above said circuit package; and (c) means in said cooling cover through which a liquid coolant is circulatingly suppliable to the liquid tight compartment formed by said cooling cover and said circuit package.

Claim 26

The combination of claim 20 and further comprising flow directing means in said liquid tight compartment formed by said cooling cover and said integrated circuit package, said flow directing means forming a tortuous path of flow for the liquid coolant when that coolant is circulatingly supplied thereto.

Claim 27

The combination of a connector for mounting an integrated circuit package on a multilayer backpanel and electrically coupling the integrated circuit package thereto and for exerting a compressive force on the backpanel for electrically interconnecting the multiple layers thereof, said combination comprising: (a) a multilayer backpanel having alternating rigid substrates and resilient elastomeric substrates each of which is provided with a conductive circuit having terminal pads, said backpanel having at least one hole aligningly formed through the multiple layers thereof; (b) a carrier member having at least one integrated circuit package mounted thereon and positioned adjacent one of the exposed surfaces of said backpanel and movable toward that surface, said carrier member having at least one boss extending therefrom into the hole of said backpanel; (c) stud means extending axially from the boss of said carrier member through the hole of said backpanel; and (d) a mounting plate in contiguous engagement with the opposite exposed surface of said backpanel and laterally movable thereon, said mounting plate having at least one aperture means formed therethrough for receiving said stud means, the aperture means interacting with said stud means upon lateral movement of said mounting plate to pull said carrier member toward said backpanel to provide pressurized conductive contact between the electrical contacts of the integrated circuit package and the exposed terminal pads of said backpanel and to exert a compressive force on said backpanel to provide pressurized conductive contact between the internal terminal pads of the multiple layers of said backpanel.

Claim 28

The combination of a connector for mounting an integrated circuit package on a multilayer backpanel and electrically coupling the integrated circuit package thereto and for exerting a compressive force on the backpanel for electrically interconnecting the multiple layers thereof, said combination comprising: (a) a multilayer backpanel having alternating rigid substrates and resilient elastomeric substrates each of which is provided with a conductive circuit having terminal pads, said backpanel having at least one hole aligningly formed through the multiple layers thereof; (b) a carrier member having at least one integrated circuit package mounted thereon and positioned adjacent one of the exposed surfaces of said backpanel and movable toward that surface, said carrier member having at least one boss extending therefrom into the hole of said backpanel; (c) stud means extending axially from the boss of said carrier member through the hole of said backpanel; and (d) a mounting plate in contiguous engagement with the opposite exposed surface of said backpanel and laterally movable thereon, said mounting plate having at least one aperture means formed therethrough for receiving said stud means, the aperture means interacting with said stud means upon lateral movement of said mounting plate to pull said carrier member toward said backpanel to provide pressurized conductive contact between the electrical contacts of the integrated circuit package and the exposed terminal pads of said backpanel and to exert a compressive force on said backpanel to provide pressurized conductive contact between the internal terminal pads of the multiple layers of said backpanel.

Claim 29

The combination of a connector for mounting an integrated circuit package on a multilayer backpanel and electrically coupling the integrated circuit package thereto and for exerting a compressive force on the backpanel for electrically interconnecting the multiple layers thereof, said combination comprising: (a) a multilayer packpanel having alternating rigid substrates and resilient elastomeric substrates each of which is provided with a conductive circuit having terminal pads, said backpanel having at least one hole aligningly formed through the multiple layers thereof; (b) an integrated circuit package positioned adjacent one of the exposed planar surfaces of said backpanel and movable toward that surface, said circuit package having electrical contact means thereon and having at least one boss extending therefrom into the hole of said backpanel; (c) stud means extending axially from the boss of said circuit package through the hole of said backpanel; and (d) a mounting plate in contiguous engagement with the opposite exposed surface of said backpanel and laterally movable thereon, said mounting plate having at least one aperture means formed therethrough for receiving said stud means, the aperture means interacting with said stud means upon lateral movement of said mounting plate to pull said circuit package toward said backpanel to provide pressurized conductive contact between the electrical contacts of said circuit package and the exposed terminal pads of said backpanel and to exert a compressive force on said backpanel to provide pressurized conductive contact between the internal terminal pads of the multiple layers of said backpanel.

Claim 30

The combination of a connector for mounting an integrated circuit package on a multilayer backpanel and electrically coupling the integrated circuit package thereto and for exerting a compressive force on the backpanel for electrically interconnecting the multiple layers thereof, said combination comprising: (a) a multilayer packpanel having alternating rigid substrates and resilient elastomeric substrates each of which is provided with a conductive circuit having terminal pads, said backpanel having at least one hole aligningly formed through the multiple layers thereof; (b) an integrated circuit package positioned adjacent one of the exposed planar surfaces of said backpanel and movable toward that surface, said circuit package having electrical contact means thereon and having at least one boss extending therefrom into the hole of said backpanel; (c) stud means extending axially from the boss of said circuit package through the hole of said backpanel; and (d) a mounting plate in contiguous engagement with the opposite exposed surface of said backpanel and laterally movable thereon, said mounting plate having at least one aperture means formed therethrough for receiving said stud means, the aperture means interacting with said stud means upon lateral movement of said mounting plate to pull said circuit package toward said backpanel to provide pressurized conductive contact between the electrical contacts of said circuit package and the exposed terminal pads of said backpanel and to exert a compressive force on said backpanel to provide pressurized conductive contact between the internal terminal pads of the multiple layers of said backpanel.