Patent US4290876A successfully refreshed from Google Patents.
US4290876A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Sputtering apparatus
Assignee: Murata Manufacturing Co Ltd
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Filing: 1980-06-05
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Granted: 1981-09-22
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Expires: 2000-06-05
Abstract
Abstract There is disclosed a combination of a target of a material other than metals and one of opposed electrodes of a sputtering apparatus for the deposition of thin films on substrates wherein the target is soldered on the electrodes by a low-melting alloy consisting essentially of a Pb-Sn-Zn alloy and at least one additive selected from the group consisting of Sb, Al, Ti, Si, Cd and Cu. This target installation enables to prevent porous or poor heat-conducting targets from the breakage resulting from the increase of the film-forming rate or physical properties of the target material such as ceramics, glasses, resins and the like.
Inventors
- 👤 Hiroshi Nishiyama
- 👤 Takeshi Nakamura
- 👤 Suehiro Kato
- 👤 Kenji Ando
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 03:24
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/22; C23C14/34; C23C14/3407; B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/268
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
110 words
A sputtering apparatus for the deposition of non-metallic thin-films on substrates, comprising: a pair of opposed electrodes; a substrate layer mounted on one of said electrodes; a target layer of a non-metallic material mounted on the other of said pair of electrodes, said target layer comprising Zn0; a low temperature melting alloy layer interposed between said target layer and the other of said pair of electrodes for soldering said target layer to said other of said pair of electrodes, said low temperature melting alloy layer including Pb, Sn, and Zn, and further including at least one additive selected from the group consisting of Sb, Al, Ti, Si, Cd and Cu.
Claim 2
Dependent Claim
110 words
A sputtering apparatus for the deposition of non-metallic thin-films on substrates, comprising: a pair of opposed electrodes; a substrate layer mounted on one of said electrodes; a target layer of a non-metallic material mounted on the other of said pair of electrodes, said target layer comprising Zn0; a low temperature melting alloy layer interposed between said target layer and the other of said pair of electrodes for soldering said target layer to said other of said pair of electrodes, said low temperature melting alloy layer including Pb, Sn, and Zn, and further including at least one additive selected from the group consisting of Sb, Al, Ti, Si, Cd and Cu.
Claim 3
Dependent Claim
39 words
The combination according to claim 1 wherein said low-melting alloy layer consists essentially of 5 to 98% of Pb, 1.8 to 94.4% of Sn, 0.05 to 10% of Zn and 0.05 to 10.0% of said at least one additive.
Claim 4
Dependent Claim
35 words
The combination according to claim 1 wherein said low-melting alloy layer consists essentially of 5 to 80% of Pb, 19.4 to 94.4% of Sn, 0.1 to 1.5% of Zn and 0.5 to 3.5% of Cu.
Claim 5
Dependent Claim
35 words
The combination according to claim 1 wherein said low-melting alloy layer consists essentially of 40 to 98% of Pb, 1.8 to 50% of Sn, 0.05 to 10% of Zn, and 0.05 to 10% of Sb.
Claim 6
Dependent Claim
40 words
The combination according to claim 1 wherein said low-melting alloy layer consists essentially of 40 to 98% of Pb, 1.8 to 50% of Sn, 0.05 to 10% of Zn, 0.05 to 10% of Sb, and 0.01 to 0.1% of Al.
References Cited (Backward Citations)
US4209375A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-09-21 | 1985-03-23 | 1985-09-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-09-21 | 1989-03-23 | 1989-09-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-09-21 | 1993-03-23 | 1993-09-22 | $7700.00 | Window Closed / Lapsed |