US4289573A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for forming microcircuits
Assignee: International Business Machines Corp
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Filing: 1980-03-03
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Granted: 1981-09-15
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Expires: 2000-03-03
Abstract
Abstract The resistance of a resist of plasma etching is enhanced by first cross-linking the resist and then contacting it with an aqueous solution of NaOH or KOH. The process is useful to form microcircuits having increased density of geometry.
Inventors
- 👤 James Economy
- 👤 James R. Lyerla
- 👤 Lester A. Pederson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 21:15
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/26; G03F7/40; G03F7/405
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
67 words
The process for forming a microcircuit comprising the steps of: (1) forming on a substrate a resist film of resin containing hydrogen replaceable by reaction with NaOH or KOH; (2) subjecting said resist film to lithographic processing; (3) cross-linking said resist film; (4) contacting the surface of said resist film with an aqueous solution of NaOH or KOH; and (5) exposing said resist film to plasma etching.
Claim 2
Dependent Claim
67 words
The process for forming a microcircuit comprising the steps of: (1) forming on a substrate a resist film of resin containing hydrogen replaceable by reaction with NaOH or KOH; (2) subjecting said resist film to lithographic processing; (3) cross-linking said resist film; (4) contacting the surface of said resist film with an aqueous solution of NaOH or KOH; and (5) exposing said resist film to plasma etching.
Claim 3
Dependent Claim
19 words
A process as claimed in claim 1 in which the resist comprises a phenol-formaldehyde resin or a derivative thereof.
Claim 4
Dependent Claim
19 words
A process as claimed in claim 1 in which the resist comprises methacrylic acid as a monomer or comonomer.
Claim 5
Dependent Claim
19 words
A process as claimed in claim 1 in which the resist comprises methacrylic anhydride as a monomer or co-monomer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-09-14 | 1985-03-16 | 1985-09-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-09-14 | 1989-03-16 | 1989-09-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-09-14 | 1993-03-16 | 1993-09-15 | $7700.00 | Window Closed / Lapsed |