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US4285003A Expired / Lapsed US ⏱️ 0.0 years remaining

Lower cost semiconductor package with good thermal properties

Assignee: Motorola Solutions Inc
•
Filing: 1979-03-19
•
Granted: 1981-08-18
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Expires: 1999-03-19
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Abstract

Abstract An improved mounting base is disclosed in which a semiconductor die is mounted on a thin pedestal within a large counter bore in the mounting base or header of the transistor package.

Inventors

  • 👤 Stanley Gaicki

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 16:50
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/132; H10W70/00; H10W70/20; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5449; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/753; H10W90/754

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 93 words
In a case for semiconductor devices having a mounting base having at least one aperture through which a lead passes, a pedestal to which semiconductor die are attached, and a cap for enclosing said die, the improvement comprising: a thinned region in said base for reducing the thickness of said base in a central area wherein said thinned region is greater than 5 mils (0.13 mm) thickness, said pedestal being 15-60 mils (0.38-1.5 mm) thick and smaller in area than said thinned region and being attached to said base in said central area.
Claim 2
Dependent Claim 93 words
In a case for semiconductor devices having a mounting base having at least one aperture through which a lead passes, a pedestal to which semiconductor die are attached, and a cap for enclosing said die, the improvement comprising: a thinned region in said base for reducing the thickness of said base in a central area wherein said thinned region is greater than 5 mils (0.13 mm) thickness, said pedestal being 15-60 mils (0.38-1.5 mm) thick and smaller in area than said thinned region and being attached to said base in said central area.
Claim 3
Dependent Claim 14 words
The case as set forth in claim 1 wherein said mounting base comprises steel.
Claim 4
Dependent Claim 13 words
The case as set forth in claim 2 wherein said pedestal comprises copper.
Claim 5
Dependent Claim 23 words
The case as set forth in claims 1 or 2 or 3 and further comprising raised annular splash ring surrounding said thinned region.
Claim 6
Dependent Claim 26 words
The case as set forth in claim 4 wherein said cap has an inside diameter greater than the outside diameter of said raised annular splash ring.
Claim 7
Dependent Claim 26 words
The case as set forth in claims 1 or 2 or 3 wherein said at least one aperture for a lead is within said central area.
Claim 8
Dependent Claim 36 words
The case as set forth in claim 6 wherein each aperture for a lead is surrounded by a raised annular ring and said pedestal fits within said thinned region and the annular ring surrounding each aperture.
Claim 9
Dependent Claim 23 words
The case as set forth in claim 7 wherein said pedestal has an area less than half the area of said thinned region.

References Cited (Backward Citations)

US3199000A Cited
US3097329A Cited
US3190954A Cited
US3399332A Cited
US3434018A Cited
US3512050A Cited
US3483444A Cited
US3745422A Cited
US4196444A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1984-08-17 1985-02-16 1985-08-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1988-08-17 1989-02-16 1989-08-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1992-08-17 1993-02-16 1993-08-18 $7700.00 Window Closed / Lapsed

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