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US4284712A Expired / Lapsed US ⏱️ 0.0 years remaining

Fabrication of video disc flyleads

Assignee: RCA Corp
•
Filing: 1980-07-11
•
Granted: 1981-08-18
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Expires: 2000-07-11
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Abstract

Abstract Method for preparing a flylead from beryllium copper alloy sheet having one side include a solder layer pattern. The method includes the steps of age hardening the beryllium copper alloy sheet, laminating both sides of the sheet with a dry film photoresist, exposing the first side of the laminated alloy sheet to actinic radiation through a mask to record a first pattern comprising the flylead pattern, exposing the second side of the laminated alloy sheet to actinic radiation through a mask to record a second pattern comprising the solder layer pattern, developing the second pattern to expose the alloy sheet surface, electroplating the exposed alloy sheet surface with a solder, relaminating the electroplated second side, developing the first pattern, etching the first pattern into the alloy sheet and removing the remaining photoresist from both sides of the etched alloy sheet.

Inventors

  • 👤 Edward A. James

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 07:37
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/26; G11; G11B; G11B9/00; G11B9/06; G11B9/07; G11B9/075

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 159 words
A method for preparing a flylead from a beryllium copper alloy sheet having one side include a solder layer pattern comprising the steps of: (a) age hardening the beryllium copper alloy sheet; (b) laminating both sides of the alloy sheet with a dry film photoresist; (c) exposing the first side of the laminated alloy sheet to actinic radiation to record a first pattern comprising the flylead pattern; (d) exposing the second side of the laminated alloy sheet to actinic radiation to record a second pattern comprising the solder layer pattern; (e) developing the second pattern to expose the alloy sheet surface; (f) electroplating the exposed alloy sheet surface with a solder; (g) relaminating the electroplated alloy sheet second side; (h) developing the first pattern; (i) etching the first pattern into the alloy sheet; and (j) removing the remaining photoresist from both sides of the etched alloy sheet to obtain a flylead having one side include a solder layer pattern.
Claim 2
Independent Claim 159 words
A method for preparing a flylead from a beryllium copper alloy sheet having one side include a solder layer pattern comprising the steps of: (a) age hardening the beryllium copper alloy sheet; (b) laminating both sides of the alloy sheet with a dry film photoresist; (c) exposing the first side of the laminated alloy sheet to actinic radiation to record a first pattern comprising the flylead pattern; (d) exposing the second side of the laminated alloy sheet to actinic radiation to record a second pattern comprising the solder layer pattern; (e) developing the second pattern to expose the alloy sheet surface; (f) electroplating the exposed alloy sheet surface with a solder; (g) relaminating the electroplated alloy sheet second side; (h) developing the first pattern; (i) etching the first pattern into the alloy sheet; and (j) removing the remaining photoresist from both sides of the etched alloy sheet to obtain a flylead having one side include a solder layer pattern.
Claim 3
Dependent Claim 19 words
The method in accordance with claim 1 wherein the electroplated second side is relaminated with a dry film photoresist.
Claim 4
Dependent Claim 19 words
A method in accordance with claim 1 wherein the electroplating step employs a lead tin fluoboric acid aqueous solution.
Claim 5
Dependent Claim 17 words
A method in accordance with claim 1 wherein the etching step employs an aqueous ferric chloride solution.
Claim 6
Dependent Claim 15 words
A method in accordance with claim 1 wherein the dry film photoresist is negative working.

References Cited (Backward Citations)

US3539259A Cited
US3469982A Cited
US3842194A Cited
US3767398A Cited
US3952147A Cited
US3960561A Cited
US4077050A Cited
US4162510A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1984-08-17 1985-02-16 1985-08-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1988-08-17 1989-02-16 1989-08-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1992-08-17 1993-02-16 1993-08-18 $7700.00 Window Closed / Lapsed

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