Abstract Method for preparing a flylead from beryllium copper alloy sheet having one side include a solder layer pattern. The method includes the steps of age hardening the beryllium copper alloy sheet, laminating both sides of the sheet with a dry film photoresist, exposing the first side of the laminated alloy sheet to actinic radiation through a mask to record a first pattern comprising the flylead pattern, exposing the second side of the laminated alloy sheet to actinic radiation through a mask to record a second pattern comprising the solder layer pattern, developing the second pattern to expose the alloy sheet surface, electroplating the exposed alloy sheet surface with a solder, relaminating the electroplated second side, developing the first pattern, etching the first pattern into the alloy sheet and removing the remaining photoresist from both sides of the etched alloy sheet.
A method for preparing a flylead from a beryllium copper alloy sheet having one side include a solder layer pattern comprising the steps of: (a) age hardening the beryllium copper alloy sheet; (b) laminating both sides of the alloy sheet with a dry film photoresist; (c) exposing the first side of the laminated alloy sheet to actinic radiation to record a first pattern comprising the flylead pattern; (d) exposing the second side of the laminated alloy sheet to actinic radiation to record a second pattern comprising the solder layer pattern; (e) developing the second pattern to expose the alloy sheet surface; (f) electroplating the exposed alloy sheet surface with a solder; (g) relaminating the electroplated alloy sheet second side; (h) developing the first pattern; (i) etching the first pattern into the alloy sheet; and (j) removing the remaining photoresist from both sides of the etched alloy sheet to obtain a flylead having one side include a solder layer pattern.
Claim 2
Independent Claim
159 words
A method for preparing a flylead from a beryllium copper alloy sheet having one side include a solder layer pattern comprising the steps of: (a) age hardening the beryllium copper alloy sheet; (b) laminating both sides of the alloy sheet with a dry film photoresist; (c) exposing the first side of the laminated alloy sheet to actinic radiation to record a first pattern comprising the flylead pattern; (d) exposing the second side of the laminated alloy sheet to actinic radiation to record a second pattern comprising the solder layer pattern; (e) developing the second pattern to expose the alloy sheet surface; (f) electroplating the exposed alloy sheet surface with a solder; (g) relaminating the electroplated alloy sheet second side; (h) developing the first pattern; (i) etching the first pattern into the alloy sheet; and (j) removing the remaining photoresist from both sides of the etched alloy sheet to obtain a flylead having one side include a solder layer pattern.
Claim 3
Dependent Claim
19 words
The method in accordance with claim 1 wherein the electroplated second side is relaminated with a dry film photoresist.
Claim 4
Dependent Claim
19 words
A method in accordance with claim 1 wherein the electroplating step employs a lead tin fluoboric acid aqueous solution.
Claim 5
Dependent Claim
17 words
A method in accordance with claim 1 wherein the etching step employs an aqueous ferric chloride solution.
Claim 6
Dependent Claim
15 words
A method in accordance with claim 1 wherein the dry film photoresist is negative working.