Process for the removal of low level (ppm) halogenated contaminants

Claim 1

A process for the dehalogenation of low level concentrations (PPM) of polychlorinated biphenyls (PCB's) dispersed within a contaminated substrate wherein said contaminated substrate is contacted with a reagent in the molar ratio of 25 to 500 moles of reagent per mole of halide contaminant contained within the fluid substrate; said reagent being prepared by: (1) dispersing molten alkali metal selected from the group consisting of lithium, sodium and potassium at a temperature of at least 150° C. in the contaminated substrate that is inert toward the alkali metal and has a boiling point above the melting point of the alkali metal in the ratio of 250 milliliters of contaminated substrate per mole of alkali metal; (2) cooling the dispersed molten alkali metal/contaminated inert fluid mixture to ambient temperature with vigorous agitation under an inert atmosphere then adding; (3) 1.3 moles of an aromatic radical anion forming compound selected from the group consisting of biphenyls, alkyl substituted biphenyls, naphthalene, alkyl substituted naphthalene, anthracene, alkyl substituted anthracenes, naphtacene, alkyl substituted naphtacene, ortho, meta and para terphenyl, and alkyl substituted terphenyls dissolved in 500 milliliters of a nonhydroxylic ether containing solvent selected from the group consisting of dimethyl ether, ethylene glycol dimethyl ether and tetrahydrofuran, with stirring.