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US4278707A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for coating the edge of a printed circuit board to improve its moisture resistance

Assignee: HP Inc
•
Filing: 1980-05-19
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Granted: 1981-07-14
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Expires: 2000-05-19
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Abstract

Abstract By sealing the periphery of a printed circuit board, the previously exposed edges of the board are substantially prevented from moisture wicking. This sealing of the periphery can be made concurrently with the plating of through-holes on the board. With this process, current leakage paths due to board moisture wicking within the board is significantly reduced.

Inventors

  • 👤 Joseph Biran

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 23:39
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/403; H05K1/00; H05K1/02; H05K3/0011; H05K3/0055; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0366; H05K2201/00; H05K2201/09; H05K2201/09145; H05K2201/09209; H05K2201/095; H05K2201/09581; H05K2203/00; H05K2203/11; H05K2203/1147; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 55 words
A method for manufacturing printed circuit boards having fibers therein comprising the steps of: defining conductive traces on a non-conductive board; sizing the non-conductive board to expose raw fibers at the periphery of the board; and then coating the periphery of the board to seal the periphery and to prevent moisture penetration into the board.
Claim 2
Independent Claim 55 words
A method for manufacturing printed circuit boards having fibers therein comprising the steps of: defining conductive traces on a non-conductive board; sizing the non-conductive board to expose raw fibers at the periphery of the board; and then coating the periphery of the board to seal the periphery and to prevent moisture penetration into the board.
Claim 3
Dependent Claim 30 words
The method as in claim 1 wherein the step of coating the periphery of the board comprises the step of plating the periphery of the board with a metal coating.

References Cited (Backward Citations)

CA664915A Cited
US4012307A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1984-07-13 1985-01-12 1985-07-14 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1988-07-13 1989-01-12 1989-07-14 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1992-07-13 1993-01-12 1993-07-14 $7700.00 Window Closed / Lapsed

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