Process for controlling of chemical copper plating solution

Claim 1

A process for controlling a composition of a chemical copper plating solution, which comprises: (a) continuously adding an acid solution to a definite volume of an alkaline chemical copper plating solution continuously sampled from a chemical plating tank, thereby making pH 4-9, measuring a potential of the resulting solution by a glass electrode-reference electrode, emitting a difference in potential as a signal, when the measured potential is lower than a set potential of a pH control unit, thereby supplying an alkali solution to the plating tank from an alkali supplementing solution tank, or when the measured potential is higher than the set potential, thereby discontinuing the supplying of the alkali solution thereto, and thereby keeping the pH of the plating solution in the plating tank continuously constant, (b) continuously adding to the solution leaving the pH measurement a definite volume of metal ions capable of forming a complex compound with a complexing agent in a little excess of the amount of free complexing agent in the solution, measuring a potential of the resulting solution by an insoluble electrode and a reference electrode, supplying a copper ion supplementing solution to the plating tank when the measured potential is lower than a set potential of a copper ion control unit, or discontinuing the supplying of the copper ion supplementing solution thereto when the measured potential is higher than the set potential, and thereby keeping a concentration of copper ions in the plating solution in the plating tank continuously constant, (c) continuously adding to the solution leaving the measurement of copper ion concentration a definite volume of metal ions capable of forming a complex compound with a complexing agent in a little excess of all the amount of complexing agent in the solution, measuring a potential of the solution by an insoluble electrode and a reference electrode, supplying a complexing agent supplementing solution to the plating tank when the measured potential is higher than a set potential of a complexing agent control unit, or discontinuing the supplying of the supplementing solution when the measured potential is lower than the set potential, and thereby keeping a concentrtion of the complexing agent in the plating tank continuously constant, and (d) continuously adding a definite volume of sulfite ions and iodine to a definite volume of a chemical copper plating solution continuously sampled from the chemical plating tank, measuring a potential of the resulting solution by an insoluble electrode and a reference electrode, supplying a reducing agent supplementing solution to the plating tank when the measured potential is lower than a set potential of a reducing agent control unit, or discontinuing the supplying of the supplementing solution thereto, when the measured potential is higher than the set potential, and thereby keeping a concentration of reducing agent in the plating solution in the plating tank continuously constant.