Patent US4266089A successfully refreshed from Google Patents.
US4266089A
Expired / Lapsed
US
⏱️ 0.0 years remaining
All metal flat package having excellent heat transfer characteristics
Assignee: ISOTRONICS Inc NEW BEDFORD MA A DE CORP
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Filing: 1978-09-14
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Granted: 1981-05-05
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Expires: 1998-09-14
Abstract
Abstract An all-metal flat package for microcircuits is described which has a copper bottom and a stainless steel frame. Beryllia substrates carrying power chips can readily be soldered into the package which has good heat transfer characteristics.
Inventors
- 👤 Jeremy D. Scherer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 14:59
CPC Classifications
H; H10; H10W; H10W95/00; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/134; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49204; Y10T29/49208; Y10T29/4921; Y10T29/49211; Y10T29/49213; Y10T29/49222
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
41 words
The method of manufacturing a flat package for electric microcircuits comprising: glass-sealing electrical leads in apertures in a type 316 stainless steel frame, and thereafter brazing the stainless steel frame at a temperature below about 460° C. to a copper bottom.
Claim 2
Independent Claim
41 words
The method of manufacturing a flat package for electric microcircuits comprising: glass-sealing electrical leads in apertures in a type 316 stainless steel frame, and thereafter brazing the stainless steel frame at a temperature below about 460° C. to a copper bottom.
Claim 3
Dependent Claim
26 words
The method of claim 1 wherein a beryllia substrate is soldered to the copper bottom after the stainless steel frame and the copper bottom are assembled.
Claim 4
Dependent Claim
83 words
A flat package for electric microcircuits comprising: (a) a type 316 stainless steel frame having electrical leads extending therethrough, said leads being glass-sealed therein: (b) a flat copper bottom; (c) said stainless steel frame forming the side walls of the package and being brazed to said copper bottom to form a continuous seal between said frame and said bottom; and (d) said brazing have been accomplished after the electrical leads were glass-sealed in said frame and at a temperature below about 460° C.
Claim 5
Dependent Claim
83 words
A flat package for electric microcircuits comprising: (a) a type 316 stainless steel frame having electrical leads extending therethrough, said leads being glass-sealed therein: (b) a flat copper bottom; (c) said stainless steel frame forming the side walls of the package and being brazed to said copper bottom to form a continuous seal between said frame and said bottom; and (d) said brazing have been accomplished after the electrical leads were glass-sealed in said frame and at a temperature below about 460° C.
Claim 6
Dependent Claim
18 words
The package of claim 3 containing a microcircuit on a beryllia substrate which is soldered to said bottom.
Claim 7
Dependent Claim
15 words
The package of claim 4 wherein a power chip is mounted on said beryllia substrate.
Claim 8
Dependent Claim
16 words
The microcircuit package of claim 3 containing a steel lid which is welded to said frame.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-05-04 | 1984-11-03 | 1985-05-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-05-04 | 1988-11-03 | 1989-05-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-05-04 | 1992-11-03 | 1993-05-05 | $7700.00 | Window Closed / Lapsed |