US4262085A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for preparation of metal patterns on insulating carrier materials
Assignee: Bayer Pharma AG
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Filing: 1979-10-26
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Granted: 1981-04-14
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Expires: 1999-10-26
Abstract
Abstract A process for the preparation of metal patterns on insulating carriers by photochemical means, in particular for the preparation of printed circuits, is described, in which the carrier is treated with a photo-sensitizer in the absence of wetting agents; the carrier is irradiated in a manner corresponding to the desired pattern with a radiation source; the metal seeds formed on the surface are augmented with an aqueous palladium-salt solution; a nickel layer is deposited with a nickel or nickel-cobalt bath; the metal layer is treated with an aqueous solution containing a complex-forming agent for copper-(I) ions; and a copper layer is deposited with a currentless coppering bath.
Inventors
- 👤 Hans-Jurgen Ehrich
- 👤 Hartmut Mahlkow
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 15:28
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/185; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1608; C23C18/1612
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
119 words
A process for the preparation of metal patterns on insulating carriers by photochemical means, in particular for the preparation of printed circuits, comprising treating the carrier after customary pretreatment with a photo-sensitizer free of wetting agents; irradiating the thus-treated carrier with a radiation source corresponding to the desired pattern; augmenting metal seeds formed on the carrier surface with an aqueous palladium-salt solution; forming a layer corresponding to the metal seeds with a currentless metal-depositing nickel or nickel-cobalt bath; treating the metal layer formed with an aqueous solution containing a complex forming agent for copper-(I) ions; and depositing a copper layer of the desired thickness with a currentless coppering bath, preferably stabilized with an inorganic cyanide and a selenium compound.
Claim 2
Dependent Claim
119 words
A process for the preparation of metal patterns on insulating carriers by photochemical means, in particular for the preparation of printed circuits, comprising treating the carrier after customary pretreatment with a photo-sensitizer free of wetting agents; irradiating the thus-treated carrier with a radiation source corresponding to the desired pattern; augmenting metal seeds formed on the carrier surface with an aqueous palladium-salt solution; forming a layer corresponding to the metal seeds with a currentless metal-depositing nickel or nickel-cobalt bath; treating the metal layer formed with an aqueous solution containing a complex forming agent for copper-(I) ions; and depositing a copper layer of the desired thickness with a currentless coppering bath, preferably stabilized with an inorganic cyanide and a selenium compound.
Claim 3
Dependent Claim
17 words
A process as defined in claim 1, wherein 2,6-anthraquinone disulfonic acid alkali salts are used as photo-sensitizer.
Claim 4
Dependent Claim
20 words
A process as defined in claim 1, wherein the photo-sensitizer is used in combination with a copper salt and sorbitol.
Claim 5
Dependent Claim
20 words
A process as defined in claim 1, wherein a mercury vapor lamp with beamed light is used as radiation source.
Claim 6
Dependent Claim
20 words
A process as defined in claim 1, wherein a sulfuric acid palladium sulfate solution is used as palladium salt solution.
Claim 7
Dependent Claim
25 words
A process as defined in claim 1, wherein a currentless, metal-depositing nickel bath containing a nickel salt, a citrate and an alkali hypophosphite is used.
Claim 8
Dependent Claim
28 words
A process as defined in claim 1, wherein a currentless, metal-depositing nickel-cobalt bath, containing a nickel salt, a cobalt salt, a citrate and an alkali hypophosphite is used.
Claim 9
Dependent Claim
23 words
A process as defined in claim 1, wherein an aqueous solution containing an alkali cyanide as complex-forming agent for copper-(I) ions is used.
Claim 10
Dependent Claim
24 words
A process as defined in claim 1, wherein a currentless coppering bath containing an alkali cyanide and an alkali selenocyanate as stabilizers is used.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-04-13 | 1984-10-13 | 1985-04-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-04-13 | 1988-10-13 | 1989-04-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-04-13 | 1992-10-13 | 1993-04-14 | $7700.00 | Window Closed / Lapsed |