US4096043A
Expired / Lapsed
US
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Method of selectively depositing a metal on a surface of a substrate
Assignee: AT&T Inc
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Filing: 1977-07-11
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Granted: 1978-06-20
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Expires: 1997-07-11
Abstract
Abstract A method of selectively depositing a metal on a surface of a substrate is disclosed. A suitable substrate is selected and a surface is treated with a desensitizer selected from the group consisting of (a) hydrazine, (b) a substituted hydrazine having the structural formula ##STR1## where R 1 is an organic radical selected from the group consisting of alkyl, cycloalkyl, aryl, alkaryl, aralkyl, alkoxy, aryloxy and heterocyclic radicals and R 2 , R 3 and R 4 are the hydrogen radical or are the same as R 1 , and (c) a mixture of the foregoing. The desensitizer-treated surface is selectively exposed to a source of ultraviolet radiation to render selected areas thereof incapable of desensitizing a sensitizing species. The radiation-exposed surface is treated with a sensitizing species to sensitize the selected areas.
Inventors
- 👤 Michael Anthony De Angelo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 14:18
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1612; C23C18/1608; C23C18/1633; C23C18/1646; C23C18/165; C23C18/1653; C23C18/18; C23C18/20; C23C18/28; C23C18/285; C23C18/30; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/185; Y; Y10; Y10S; Y10S205/00; Y10S205/918
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
63 words
A method of selectively depositing a metal on a surface of a substrate which comprises: (a) treating the surface with a desensitizer comprising hydrazine; (b) selectively exposing said desensitizer-treated surface to a source of ultraviolet radiation to render a selected area thereof incapable of desensitizing a sensitizing species; and (c) treating said radiation-exposed surface with a sensitizing species to sensitize said selected area.
Claim 2
Independent Claim
63 words
A method of selectively depositing a metal on a surface of a substrate which comprises: (a) treating the surface with a desensitizer comprising hydrazine; (b) selectively exposing said desensitizer-treated surface to a source of ultraviolet radiation to render a selected area thereof incapable of desensitizing a sensitizing species; and (c) treating said radiation-exposed surface with a sensitizing species to sensitize said selected area.
Claim 3
Dependent Claim
24 words
The method as defined in claim 1 which further comprises: exposing at least said sensitizing area to an activating solution to activate said area.
Claim 4
Dependent Claim
26 words
The method as defined in claim 2 which further comprises: exposing said activated area to an electroless metal deposition solution to deposit an electroless metal thereon.
Claim 5
Dependent Claim
15 words
The method as defined in claim 3 which further comprises electroplating said electroless metal deposit.
Claim 6
Dependent Claim
17 words
The method as defined in claim 1 wherein said sensitizing species comprises a Sn + 2 species.
Claim 7
Dependent Claim
14 words
The method as defined in claim 1 wherein said substrate surface comprises a polyimide.
Claim 8
Independent Claim
96 words
A method of forming an activated pattern on a surfaced of a substrate, the pattern being usable to catalyze and reduce thereon an electroless metal deposit from an electroless metal deposition solution, which comprises: (a) treating the surface with a desensitizer comprising hydrazine; (b) exposing a selected portion of said desensitizer-treated surface to a source of ultraviolet radiation to delineate an exposed pattern corresponding to the activated pattern, (c) treating said ultraviolet radiation-exposed surface to a sensitizer to sensitize said exposed pattern, and (d) exposing said sensitized pattern to an activator to form the activated pattern.
Claim 9
Independent Claim
96 words
A method of forming an activated pattern on a surfaced of a substrate, the pattern being usable to catalyze and reduce thereon an electroless metal deposit from an electroless metal deposition solution, which comprises: (a) treating the surface with a desensitizer comprising hydrazine; (b) exposing a selected portion of said desensitizer-treated surface to a source of ultraviolet radiation to delineate an exposed pattern corresponding to the activated pattern, (c) treating said ultraviolet radiation-exposed surface to a sensitizer to sensitize said exposed pattern, and (d) exposing said sensitized pattern to an activator to form the activated pattern.
Claim 10
Dependent Claim
22 words
The method as defined in claim 7 wherein: said sensitizer comprises a stannous species, and said activator comprises a Pd +2 species.
Claim 11
Dependent Claim
13 words
The method as defined in claim 7 wherein said surface comprises a polyamide.
Claim 12
Independent Claim
73 words
A method of producing an electrical circuit pattern on a non-conductive substrate, which comprises: (a) treating a surface of the substrate with a desensitizer comprising hydrazine; (b) selectively exposing said desensitizer-treated surface to a source of ultraviolet radiation to form an exposed pattern corresponding to the electrical circuit pattern; (c) treating said radiation-exposed surface with a sensitizer to sensitize said exposed pattern; and (d) activating the sensitized pattern to form an activated pattern.
Claim 13
Independent Claim
73 words
A method of producing an electrical circuit pattern on a non-conductive substrate, which comprises: (a) treating a surface of the substrate with a desensitizer comprising hydrazine; (b) selectively exposing said desensitizer-treated surface to a source of ultraviolet radiation to form an exposed pattern corresponding to the electrical circuit pattern; (c) treating said radiation-exposed surface with a sensitizer to sensitize said exposed pattern; and (d) activating the sensitized pattern to form an activated pattern.
Claim 14
Dependent Claim
27 words
The method as defined in claim 10 which further comprises: treating said activated pattern with an electroless metal deposition solution to deposit on electroless metal deposit thereon.
Claim 15
Dependent Claim
14 words
The method as defined in claim 10 wherein: said sensitizer comprises a tin species.
Claim 16
Dependent Claim
13 words
The method as defined in claim 10 wherein said surface comprises a polyimide.
Claim 17
Independent Claim
39 words
A method of selectively depositing a metal on a dielectric surface which comprises selectively treating the surface with a desensitizer comprising hydrazine to delineate an untreated surface pattern which is capable of participating in an electroless metal deposition process.
Claim 18
Independent Claim
39 words
A method of selectively depositing a metal on a dielectric surface which comprises selectively treating the surface with a desensitizer comprising hydrazine to delineate an untreated surface pattern which is capable of participating in an electroless metal deposition process.
Claim 19
Independent Claim
43 words
A method of selectively depositing a metal on a dielectric surface which comprises: treating the surface with an electroless metal deposition sensitizer to sensitize the surface, and selectively coating said sensitized surface with a desensitizer comprising hydrazine to delineate a sensitized pattern thereon.
Claim 20
Independent Claim
43 words
A method of selectively depositing a metal on a dielectric surface which comprises: treating the surface with an electroless metal deposition sensitizer to sensitize the surface, and selectively coating said sensitized surface with a desensitizer comprising hydrazine to delineate a sensitized pattern thereon.
Claim 21
Dependent Claim
24 words
The method as defined in claim 15 which further comprises exposing at least said sensitized pattern to an activating solution to activate said pattern.
Claim 22
Dependent Claim
26 words
The method as defined in claim 16 which further comprises treating said activated pattern with an electroless metal deposition solution to deposit an electroless metal thereon.
Claim 23
Dependent Claim
15 words
The method as defined in claim 17 which further comprises electroplating said electroless metal deposit.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-06-19 | 1981-12-19 | 1982-06-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-06-19 | 1985-12-19 | 1986-06-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-06-19 | 1989-12-19 | 1990-06-20 | $7700.00 | Window Closed / Lapsed |