US3775121A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of selectively depositing a metal on a surface of a substrate
Assignee: AT&T Inc
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Filing: 1972-08-09
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Granted: 1973-11-27
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Expires: 1992-08-09
Abstract
Abstract A method of selectively depositing a metal on a surface of a substrate is disclosed. A suitable substrate is selected and a catalytic species is deposited on a surface thereof. The catalytic species is one which is capable of catalyzing an electroless metal deposition. The catalytic species deposited surface is then poisoned by a suitable poison whereby the catalytic species is rendered non-catalytic. The poisoned surface is then selectively exposed to a source of ultraviolet radiation whereby those portions of the surface exposed thereto are again rendered catalytic, i.e., the portions contain thereon species capable of participating in an electroless metal deposition catalysis.
Inventors
- 👤 D Sharp
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 19:43
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/185; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1608; C23C18/1612; C23C18/1633; C23C18/1646; C23C18/165; C23C18/1653; G; G03; G03C; G03C5/00; G03C5/58; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0713
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
15 words
The method as defined in claim 1 wherein said catalytic species comprises an activating metal.
Claim 2
Dependent Claim
16 words
The method as defined in claim 2 wherein said suitable poison comprises a sulfur containing compound.
Claim 3
Dependent Claim
19 words
The method as defined in claim 1 which further comprises electroplating said electroless metal deposit to a desired thickness.
Claim 4
Dependent Claim
85 words
In an improved method of depositing a metal pattern on a surface of a substrate which comprises activating the surface, the improvement comprising: a. poisoning the activated surface with a sulfur containing poison thereof to achieve a deactivation; b. selectively exposing said poisoned surface to a source of ultraviolet radiation to reactivate selected areas of said poisoned surface corresponding to the metal pattern; c. exposing said selectively reactivated areas to an electroless metal bath, catalyzed by said reactivated areas, to deposit an electroless metal thereon.
Claim 5
Dependent Claim
17 words
The method as defined in claim 5 wherein said activating comprises depositing palladium metal on the surface.
Claim 6
Dependent Claim
13 words
The method as dEfined in claim 6 wherein said poison comprises sodium mercaptobenzothiazole.
Claim 7
Independent Claim
105 words
A method of producing an activating metal pattern on a substrate, the pattern being usable to catalyze and reduce thereon metal from an electroless bath, which method comprises: a. depositing on an area of said substrate a species capable of reducing an activating metal ion; b. exposing said area to an activating metal ion to reduce an activating metal deposit thereon; c. poisoning said activating metal depositing area with a suitable poison; and d. exposing selected portions of said poisoned area, corresponding to the pattern, to a source of ultraviolet radiation to render said selected portions capable of participating in an electroless metal deposition catalysis.
Claim 8
Dependent Claim
98 words
In an improved method of producing an electrical circuit pattern on a nonconductive substrate, which comprises depositing a catalytic species, capable of catalyzing an electroless metal bath, on a surface of the substrate, the improvement comprising: a. poisoning said catalytic species-deposited surface to attain deactivation thereof; b. selectively exposing said poisoned surface to a source of ultraviolet radiation to obtain a reactivated catalytic species containing pattern, corresponding to the electrical circuit pattern; and c. exposing said reactivated catalytic species containing pattern to an electroless plating bath, catalyzed by said reactivated catalytic species, to produce said electrical circuit pattern.
Claim 9
Dependent Claim
18 words
The method as defined in claim 9 which further comprises electroplating a metal on said electrical circuit pattern.
Claim 10
Dependent Claim
18 words
The method as defined in claim 10 which further comprises removing the substrate from said electroplated circuit pattern.
Claim 11
Independent Claim
119 words
A method of selectively depositing copper metal on a surface of a substrate, which comprises: a. depositing palladium metal on the surface, said palladium metal being capable of catalyzing an electroless copper plating bath; b. exposing said catalytic palladium metal-deposited surface to a poison comprising sodium mercaptobenzothiazole to render said catalytic palladium metal deposited thereon incapable of participating in an electroless copper deposition catalysis; c. selectively exposing said poison exposed surface to a source of ultraviolet radiation to render selected areas thereof capable of participating in an electroless copper deposition catalysis; and d. exposing said selected areas to an electroless copper bath, catalyzed by catalytic palladium metal contained on said selected areas, to deposit an electroless copper deposit thereon.
References Cited (Backward Citations)
US3632435A
Cited
US3711325A
Cited
US3698940A
Cited
US3674550A
Cited
US3676213A
Cited
US3672925A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-11-26 | 1977-05-28 | 1977-11-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-11-26 | 1981-05-28 | 1981-11-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-11-26 | 1985-05-28 | 1985-11-27 | $7700.00 | Window Closed / Lapsed |