Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
166 words
A semiconductor substrate or a mask substrate having coated thereon a coating of a radiation-sensitive positive resist polymer or copolymer, said polymer or copolymer being prepared from at least 50 mol % of one or more halogenated alkyl α-halogenated acrylate monomers expressed by the general structural formula: ##STR6## where: X=fluorine, chlorine or bromine, R=alkyl group, aryl group or alkoxy alkyl group which have 1 to 10 carbon atoms and in which one or more hydrogen atoms are substituted by the corresponding number of fluorine atoms; and wherein halogen atoms are contained in a number accounting for 32 percent or less of the total number of elements constituting said polymer or copolymer; said coating having been formed by a process comprising: (a) forming a resist layer from said polymer or copolymer on a semiconductor substrate or mask substrate; (b) prebaking said resist layer at an elevated temperature; (c) irradiating selected portions of said prebaked layer for patterning; and (d) removing said selected portions of said resist layer.
Claim 2
Dependent Claim
166 words
A semiconductor substrate or a mask substrate having coated thereon a coating of a radiation-sensitive positive resist polymer or copolymer, said polymer or copolymer being prepared from at least 50 mol % of one or more halogenated alkyl α-halogenated acrylate monomers expressed by the general structural formula: ##STR6## where: X=fluorine, chlorine or bromine, R=alkyl group, aryl group or alkoxy alkyl group which have 1 to 10 carbon atoms and in which one or more hydrogen atoms are substituted by the corresponding number of fluorine atoms; and wherein halogen atoms are contained in a number accounting for 32 percent or less of the total number of elements constituting said polymer or copolymer; said coating having been formed by a process comprising: (a) forming a resist layer from said polymer or copolymer on a semiconductor substrate or mask substrate; (b) prebaking said resist layer at an elevated temperature; (c) irradiating selected portions of said prebaked layer for patterning; and (d) removing said selected portions of said resist layer.
Claim 3
Dependent Claim
26 words
A manufacture according to claim 1, wherein said polymer or copolymer is a copolymer prepared from at least one vinyl monomer differing from said formula (I).
Claim 4
Dependent Claim
122 words
A manufacture according to claim 2, wherein said at least one vinyl monomer is at least one selected from the group consisting of (a) a monomer expressed by the general structural formula: ##STR7## where: R 1 =methyl group, halogenated methyl group, cyano group or halogen element, R 2 =hydrogen atom, or alkyl group, aryl group, halogenated alkyl group or halogenated aryl group, each group containing 1 to 10 carbon atoms; (b) a monomer expressed by the general structural formula: ##STR8## where: R 2 =the same as defined above, R 3 =methyl group, halogenated methyl group, halogen elements, or cyano group; and (c) a monomer expressed by the general structural formula: ##STR9## where: R 2 and R 3 =the same as defined above.
Claim 5
Dependent Claim
41 words
A manufacture according to claim 2, wherein said at least one vinyl monomer is at least one selected from the group consisting of isopropenyl alcohol, α-phenyl vinyl alcohol, vinyl ketones, vinyl ethers, methacrylonitrile, vinylidene fluoride, α-fluoroacrylonitrile, α-methyl styrene, and vinyl sulfones.
Claim 6
Dependent Claim
45 words
A manufacture according to claim 1, wherein said resist layer was formed on said semiconductor substrate or mask substrate by dissolving said polymer or copolymer in a solvent to prepare a resist solution and coating said resist solution over said semiconductor substrate or mask substrate.