Patent US4258382A successfully refreshed from Google Patents.
US4258382A
Expired / Lapsed
US
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Expanded pad structure
Assignee: National Semiconductor Corp
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Filing: 1978-07-03
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Granted: 1981-03-24
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Expires: 1998-07-03
Abstract
Abstract A pad for connecting electrical chips in microelectronic circuits includes a bump built up on the connecting pad that had a dimension of the base that is less than that of the pad to prevent the bump from overlapping the edges of the pad and damaging or cracking the underlying structure of the chip during thermocompression bonding of leads to the bump.
Inventors
- 👤 James M. Harris
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 12:19
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W72/251
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
10 words
A bump pad structure for electrical connections comprising in combination:
Claim 2
Dependent Claim
10 words
A bump pad structure for electrical connections comprising in combination:
Claim 3
Dependent Claim
99 words
1 a pad comprising a structure of conductive metal having a predetermined lateral dimension mounted on and connected to a portion of a conductive chip, at least a portion of said pad overlying a layer of oxide on said chip; a passive protection layer overlying a portion of the edges of the pad; and a bump of conductive metal mounted on said pad and having a base portion having a lateral dimension less than the predetermined lateral dimension of the pad and located on the pad so that no portion of the bump overlaps an edge of the pad.
Claim 4
Dependent Claim
99 words
1 a pad comprising a structure of conductive metal having a predetermined lateral dimension mounted on and connected to a portion of a conductive chip, at least a portion of said pad overlying a layer of oxide on said chip; a passive protection layer overlying a portion of the edges of the pad; and a bump of conductive metal mounted on said pad and having a base portion having a lateral dimension less than the predetermined lateral dimension of the pad and located on the pad so that no portion of the bump overlaps an edge of the pad.
Claim 5
Dependent Claim
51 words
The structure of claim 1, wherein the lateral dimension of said bump base portion of the bump is less than the predetermined lateral dimension of the pad by an amount equal to the sum of the dimensional tolerance of the base and the alignment tolerance of said bump on said pad.
Claim 6
Dependent Claim
47 words
The structure of claim 2 wherein the passive protection overlying the edges of the pad defined a window substantially coincident with the center of the pad, said base is substantially centered over said window and overlapping the edges of the passive protection layer on all sides thereof.
Claim 7
Dependent Claim
16 words
The structure of claim 3, wherein said predetermined lateral dimension is no greater than 5.0 mils.
Claim 8
Dependent Claim
17 words
The structure of claim 4, wherein the lateral dimensions of the base portion is approximately 3.8 mils.
Claim 9
Dependent Claim
18 words
The structure of claim 3 wherein the bump has a base with a minimum size of 3.2 mils.
Claim 10
Dependent Claim
20 words
The structure of claim 2 wherein said manufacturing tolerance and said alignment tolerances are each from 0.2 to 0.3 mils.
Claim 11
Dependent Claim
20 words
The structure of claim 6 wherein said manufacturing tolerances and said alignment tolerances are each from 0.2 to 0.3 mils.
References Cited (Backward Citations)
US4051508A
Cited
US4146413A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-03-23 | 1984-09-22 | 1985-03-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-03-23 | 1988-09-22 | 1989-03-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-03-23 | 1992-09-22 | 1993-03-24 | $7700.00 | Window Closed / Lapsed |