Heat bonding device

Claim 1

In apparatus for joining heat bondable materials by the application of heat and pressure along a predetermined seam area by means of a flexible diaphragm one side of which is pressed by fluid pressure which flexes its material engaging side convexly against the materials, said diaphragm comprising a web carrying permanently bonded thereto on its non-material pressing side a flexible heating element having a different coefficient of expansion from that of the web and adapted to apply heat through the web to said area while the diaphragm is so pressed, the improvement for minimizing separation forces between the heating element and the web during heating and for minimizing the mass of said element for quick heating and cooling wherein said flexible heating element comprises a thin ribbon bonded to said web along only a portion of its length so as to terminate in outwardly turned portions comprising flexible tabs extending away from the plane of the web for connection to a source of electrical power at locations remote from the area wherein said ribbon is bonded to said web whereby the mass of heating element in contact with said web remains unchanged throughout its length, said improvement further comprising spring-like leads connected to said tabs permitting said diaphragm to flex in operation in a direction normal to its plane while minimizing separation forces imparted to said ribbon by the leads.