US4246162A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Epoxy resin moulding compositions
Assignee: BASF Corp
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Filing: 1979-10-17
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Granted: 1981-01-20
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Expires: 1999-10-17
Abstract
Abstract A moulding composition consisting of an epoxy resin adduct of a low molecular diglycidyl ether of bisphenols and an aromatic diamine together with a filler, an accelerator, and an aromatic polyol as hardener. Mouldings having excellent resistance to cracking can be obtained from this moulding composition.
Inventors
- 👤 Bruno Schreiber
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 15:03
CPC Classifications
C; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/62; C08G59/621; C08G59/02; C08G59/10; C08G59/182; C08G59/184; C08L; C08L63/00; Y; Y10; Y10S; Y10S525/00; Y10S525/934
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
117 words
An epoxy resin moulding composition consisting of (a) a solid epoxy resin which is an adduct of a low molecular diglycidyl ether of bisphenols and an aromatic diamine and which has a melting point of at least 50° C. and contains at least 2.0 epoxy equivalents per kg of resin, (b) a hardener, (c) at least one accelerator, and (d) at least one filler, said epoxy resin composition containing, as hardener (b), at least one aromatic polyol containing more than 5 phenolic hydroxyl equivalents per kg of polyol and having a melting point of at least 50° C., and in an amount such that the content of phenolic hydroxyl groups per epoxy group is 0.5 to 1.5.
Claim 2
Dependent Claim
117 words
An epoxy resin moulding composition consisting of (a) a solid epoxy resin which is an adduct of a low molecular diglycidyl ether of bisphenols and an aromatic diamine and which has a melting point of at least 50° C. and contains at least 2.0 epoxy equivalents per kg of resin, (b) a hardener, (c) at least one accelerator, and (d) at least one filler, said epoxy resin composition containing, as hardener (b), at least one aromatic polyol containing more than 5 phenolic hydroxyl equivalents per kg of polyol and having a melting point of at least 50° C., and in an amount such that the content of phenolic hydroxyl groups per epoxy group is 0.5 to 1.5.
Claim 3
Dependent Claim
14 words
A moulding composition according to claim 1, wherein the aromatic polyol is a novolak.
Claim 4
Dependent Claim
24 words
A moulding composition according to claim 2, wherein the novolak is a phenol, resorcinol, cresol or xylenol novolak or a mixture of these phenols.
Claim 5
Dependent Claim
23 words
A moulding composition according to claim 1, wherein the aromatic polyol is a hydroxyphenylated hydrocarbon which preferably contains 2 to 10, carbon atoms.
Claim 6
Dependent Claim
16 words
A moulding composition according to claim 4, wherein the aromatic polyol is 1,1,2,2-tetrahydroxyphenylethane, 1,1,3-trihydroxyphenylpropane or poly-p-vinylphenol.
Claim 7
Dependent Claim
39 words
A moulding composition according to claim 1 which contains the fillers in an amount of 10 to 80% by weight, preferably 30 to 80% by weight and, most preferably, 50 to 80% by weight, based on said moulding composition.
Claim 8
Dependent Claim
27 words
A moulding composition according to claim 1, wherein at least two-thirds of the total amount of filler consists of wollastonite and the remainder consists of glass fibres.
Claim 9
Dependent Claim
26 words
A moulding composition according to claim 1 which contains the accelerator (c) in an amount of 0.1 to 5% by weight, based on the moulding composition.
Claim 10
Dependent Claim
23 words
A moulding composition according to claim 1, wherein the epoxy resin is an adduct of a low molecular bisphenol A-diglycidyl ether and 4,4'-diaminodiphenylmethane.
Claim 11
Dependent Claim
23 words
A moulding composition according to claim 1 which additionally contains up to 8% of a malamine formaldehyde resin, based on the moulding composition.
Claim 12
Dependent Claim
11 words
Mouldings made from a cured moulding composition according to claim 1.
Claim 13
Dependent Claim
123 words
A process for the manufacture of mouldings according to claim 11, which comprises curing an epoxy moulding composition consisting of (a) a solid epoxy resin with a melting point of at least 50° C. which is an adduct of a low molecular diglycidyl ether of bisphenols and an aromatic diamine and which contains at least 2.0 epoxy equivalents per kg of resin, (b) a hardener consisting of at least one aromatic polyol containing more than 5 phenolic hydroxyl group equivalents per kg of polyol and having a melting point of at least 50° C., in an amount such that the content of phenolic hydroxyl groups per epoxy group is 0.5 to 1.5, (c) at least one accelerator and (d) at least one filler.
Claim 14
Dependent Claim
11 words
The composition of claim 8 wherein the accelerator is an imidazole.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-01-20 | 1984-07-21 | 1985-01-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-01-20 | 1988-07-21 | 1989-01-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-01-20 | 1992-07-21 | 1993-01-20 | $7700.00 | Window Closed / Lapsed |