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Process for cleaving crystalline materials

Assignee: Siemens Solar Industries LP
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Filing: 1979-09-10
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Granted: 1981-01-13
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Expires: 1999-09-10
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Abstract

Abstract A process for cleaving boules of single crystal materials such as silicon or germanium into thin wafers. The process comprises creating an inward-directed radial stress concentration completely around a boule which intersects its crystallographic plane of minimum bond strength; and subsequently, triggering the cleavage of a thin wafer from the boule via a shock wave applied normal to its crystallographic plane of minimum bond strength.

Inventors

  • 👤 Donald F. Wilkes

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 10:30
CPC Classifications
B; B28; B28D; B28D5/00; Y; Y10; Y10T; Y10T225/00; Y10T225/10; Y10T225/12

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 65 words
A process for cleaving a thin wafer from a boule of single crystal material comprising the steps of a. creating an inward directed radial stress concentration 360° around said boule, which intersects its crystallographic plane of minimum bond strength, and b. triggering said cleavage of said boule via a shock wave applied normal to said plane whereby said thin wafer is cleaved from said boule.
Claim 2
Dependent Claim 65 words
A process for cleaving a thin wafer from a boule of single crystal material comprising the steps of a. creating an inward directed radial stress concentration 360° around said boule, which intersects its crystallographic plane of minimum bond strength, and b. triggering said cleavage of said boule via a shock wave applied normal to said plane whereby said thin wafer is cleaved from said boule.
Claim 3
Dependent Claim 12 words
The process of claim 1 wherein said stress concentration is created uniformly.
Claim 4
Dependent Claim 21 words
The process of claim 1 wherein said triggering wave is created by striking said boule with a high modulus, hard substance.
Claim 5
Dependent Claim 14 words
The process of claim 1 wherein said triggering wave is an axially-induced shock wave.
Claim 6
Dependent Claim 11 words
The process of claim 4 wherein said shock wave is planar.
Claim 7
Dependent Claim 11 words
The process of claim 1 wherein said crystal material is silicon.
Claim 8
Dependent Claim 11 words
The process of claim 1 wherein said crystal material is germanium.

References Cited (Backward Citations)

US2630174A Cited
US3727599A Cited
US3901423A Cited
US3918216A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1984-01-13 1984-07-14 1985-01-13 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1988-01-13 1988-07-14 1989-01-13 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1992-01-13 1992-07-14 1993-01-13 $7700.00 Window Closed / Lapsed

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