Heat activatable one-part liquid resin systems

Claim 2

A heat curable, one-part, liquid resin composition comprising I. A latent catalyst which comprises rupturable, impermeable microcapsules ranging in size from about 0.1 to 20 microns having (1) shell walls of a crosslinked interfacial polyurethane-polyether reaction product of an aromatic polyisocyanate having an equivalent weight of up to about 380 and a functionality of from about 2 to 6, glycerol and a cycloaliphatic polyepoxide having an equivalent weight of from about 70 to 220 and a functionality of from about 2 to 3, and (2) liquid fills comprising a Lewis acid-glycerol complex, II. a cationically curable monomer composition, and III. a Lewis base scavenger having a pK b of from about 6 to 11, there being from 1 to 20 parts of I and 80 to 99 parts of II in the one-part system, the sum of I and II being 100 parts, and there being 0.1 to 35 mole percent of III, based on the moles of Lewis acid in the microcapsules.

Claim 3

A heat curable, one-part, liquid resin composition comprising I. a latent catalyst which comprises a slurry of A. rupturable, impermeable microcapsules ranging in size from about 0.1 to 20 microns having (1) shell walls of a crosslinked interfacial polyurethane-polyether reaction product of an aromatic polyisocyanate having an equivalent weight of up to about 380 and a functionality of from about 2 to 6, glycerol and a cycloaliphatic polyepoxide having an equivalent weight of from about 70 to 220 and a functionality of from about 2 to 3, and (2) liquid fills comprising a Lewis acid-glycerol complex, and B. a liquid medium selected from aromatic polyisocyanates as defined above and esters of an aromatic carboxylic acid and an alkyl, aralkyl or aryl alcohol, the ester containing up to about 40 carbon atoms, II. a cationically curable monomer composition, and III. a Lewis base scavenger having a pK b of from about 6 to 11, there being from 1 to 40 parts of I and 60 to 99 parts of II in the one-part composition, the sum of I and II being 100 parts, and there being 0.1 to 35 mole percent of III, based on the moles of Lewis acid in the microcapsules.

Claim 4

A heat curable, one-part, liquid resin composition comprising I. a latent catalyst which comprises a slurry of A. rupturable, impermeable microcapsules ranging in size from about 0.1 to 20 microns having (1) shell walls of a crosslinked interfacial polyurethane-polyether reaction product of an aromatic polyisocyanate having an equivalent weight of up to about 380 and a functionality of from about 2 to 6, glycerol and a cycloaliphatic polyepoxide having an equivalent weight of from about 70 to 220 and a functionality of from about 2 to 3, and (2) liquid fills comprising a Lewis acid-glycerol complex, and B. a liquid medium selected from aromatic polyisocyanates as defined above and esters of an aromatic carboxylic acid and an alkyl, aralkyl or aryl alcohol, the ester containing up to about 40 carbon atoms, II. a cationically curable monomer composition, and III. a Lewis base scavenger having a pK b of from about 6 to 11, there being from 1 to 40 parts of I and 60 to 99 parts of II in the one-part composition, the sum of I and II being 100 parts, and there being 0.1 to 35 mole percent of III, based on the moles of Lewis acid in the microcapsules.

Claim 5

A resin composition according to claim 2 wherein the microcapsule fill material comprises a 20 percent boron trifluoride-glycerol complex and the overall boron trifluoride concentration in the catalyst (I) is 4 weight percent.

Claim 6

A resin composition according to claim 3 which contains 2.0-2.5 mole percent of dimethylformamide scavenger, based on the moles of boron trifluoride present.

Claim 7

A resin composition according to claim 1 wherein the cationically curable monomer composition is an epoxide resin composition.

Claim 8

A resin composition according to claim 5 wherein the epoxide resins have an average epoxide equivalent number of 2.0 or greater.

Claim 9

A resin composition according to claim 5 wherein the epoxide resin is a bisphenol A-based epoxy resin.

Claim 10

A resin composition according to claim 5 wherein the epoxide resin is a bisphenol A diglycidyl ether resin.

Claim 11

A resin composition according to claim 5 wherein the epoxide resin is an epoxy novolak resin.

Claim 12

A resin composition according to claim 5 wherein the epoxide resin is a bisphenol F diglycidyl ether resin.

Claim 13

A one-part, heat curable composition according to claim 2 containing I. a latent catalyst which comprises a slurry of A. microcapsules ranging in size from about 1 to 5 microns and B. an aromatic polyisocyanate liquid medium, II. an epoxy resin composition, and III. a Lewis base scavenger having a pK b of from about 6 to 11, there being from 5 to 40 parts of I and 60 to 95 parts of II, the sum of I and II being 100 parts, and there being 0.1 to 35 mole percent of III, based on the moles of Lewis acid in the microcapsules.

Claim 14

A resin composition according to claim 11 which contains additionally IV. 1 to 100 parts of one or more reactive diluents.

Claim 15

A resin composition according to claim 2 containing I. 10-30 parts of the catalyst slurry, II. 70-90 parts of a cationically curable monomer composition consisting of 40-80 parts of bisphenol S diglycidyl ether, 5-30 parts of a polyisocyanate reactive diluent and 5-30 parts of a second reactive diluent, and III. a Lewis base scavenger having a pK b of from about 6 to 11.