Flame resistant thermoplastic compositions with well balanced physical properties

Claim 2

A thermoplastic composition comprising: (a) a polyphenylene ether resin; (b) a styrene type resin; (c) an organophosphorus compound having a melting point below about 100° C. and which is stable and relatively non-volatile at temperatures up to at least about 300° C.; and (d) a finely particulate solid filler having a relatively high absorption capacity for organic liquids.

Claim 3

A composition as defined in claim 1 wherein the polyphenylene ether resin (a) contains repeating structural units conforming to the general formula ##STR3## wherein the ether oxygen atom of one unit is connected to the benzene nucleus of the next adjoining unit; n is a positive integer equal to at least 50 and each Q and Q 2 is a monovalent substituent selected from the group consisting of halogen, hydrogen, hydrocarbon radicals, halohydrocarbon radicals, hydrocarbonoxy radicals and halohydrocarbonoxy radicals provided that none of said radicals contains an alpha-carbon atom which is tertiary or bears a halogen substituent, and the styrene type resin (b) has at least 10 percent by weight polymer units derived from a compound corresponding to the formula: ##STR4## where R is hydrogen, lower alkyl or halogen; Z is a member of the group consisting of vinyl, halogen and lower alkyl; and p is a whole number equal to from 0 to 5.

Claim 4

A composition as defined in claim 1 wherein said organophosphorus compound (c) is an aryl derivative of phosphine or of one of the phosphorus acids, and said finely particulate solid filler (d) has an average primary particle size of less than about 250 mils and an oil absorption capacity at least about equal to its own weight.

Claim 5

A composition as defined in claim 1 wherein resin components (a) and (b) are present in relative proportions between about 1 to 4 and about 4 to 1 by weight and the weight ratio of additive (d) to additive (c) is between about 1 to 3 and 3 to 1.

Claim 6

A composition as defined in claim 4 wherein the proportion of additive (c) is between about 4 and about 25 parts by weight per 100 part of (a) and (b) combined and the proportion of additive (d) is between about 2 and about 30 parts by weight per 100 parts of (a) and (b) combined.

Claim 7

A thermoplastic composition comprising: (a) from about 20 to about 90 parts by weight of a poly(2,6-dimethyl-1, 4-phenylene) ether resin; (b) from about 10 to about 80 parts by weight of a high impact styrene type resin; (c) from about 4 to about 25 parts by weight per 100 parts of (a) and (b) combined of an aryl organophosphorus compound which is liquid at temperatures below about 100° C. and stable and relatively non-volatile at temperatures up to about 300° C.; and (d) from about 2 to about 30 parts by weight of a finely particulate solid filler having an openly porous or expanded network structure capable of absorbing organic liquids in amounts about equal to its own weight.

Claim 8

A thermoplastic composition comprising: (a) from about 20 to about 90 parts by weight of a poly(2,6-dimethyl-1, 4-phenylene) ether resin; (b) from about 10 to about 80 parts by weight of a high impact styrene type resin; (c) from about 4 to about 25 parts by weight per 100 parts of (a) and (b) combined of an aryl organophosphorus compound which is liquid at temperatures below about 100° C. and stable and relatively non-volatile at temperatures up to about 300° C.; and (d) from about 2 to about 30 parts by weight of a finely particulate solid filler having an openly porous or expanded network structure capable of absorbing organic liquids in amounts about equal to its own weight.

Claim 9

A composition as defined in claim 6 wherein said aryl organophosphorus compound (c) is from the group consisting of phosphine oxides, phosphonic or phosphinic acids and their esters, esters or partial esters of phosphoric or phosphorus acids and esters of condensed or complexed phosphorus polyacids.

Claim 10

A composition as defined in claim 7 wherein said aryl organophosphorus compound contains 1 to 3 organic substituents per molecule and at least two of said substituents contain an aryl structure.

Claim 11

A composition as defined in claim 8 wherein said compound contains 3 organic substituents each of which contains an aryl structure.

Claim 12

A composition as defined in claim 6 wherein said finely particulate solid filler (d) is from the group consisting of diatomaceous silicas, porous silicate minerals including zeolites, fumed oxides of metals or metalloids, wet process or precipitated oxides and porous, rigid polymeric fillers.

Claim 13

A composition as defined in claim 6 wherein said finely particulate solid filler is a natural or synthetic siliceous material with a particulate size of less than about 250 mils.

Claim 14

A composition as defined in claim 6 wherein said aryl organophosphorus compound (c) and said finely particulate solid filler (d) are premixed together at a temperature of at least 50° C. prior to being incorporated with resin components (a) and (b).

Claim 15

A composition as defined in claim 6 wherein said compound (c) and filler (d) are premixed for several minutes at a temperature in the range of about 50° C. to about 100° C. which is at least about the melting point of compound (c).