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Patent US4233103A successfully refreshed from Google Patents.
US4233103A
Expired / Lapsed
US
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High temperature-resistant conductive adhesive and method employing same
Assignee: United States Department of the Air Force
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Filing: 1978-12-20
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Granted: 1980-11-11
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Expires: 1998-12-20
Abstract
Abstract A high temperature-resistant, conductive adhesive composition for bonding a semiconductor die to a substrate comprising a mixture of (1) an alloy of gallium-tin eutectic and gold and (2) a polyimide resin.
Inventors
- 👤 Joseph M. Shaheen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 14:26
CPC Classifications
C; C08; C08K; C08K3/00; C08K3/02; C08K3/08; C09; C09J; C09J179/00; C09J179/04; C09J179/08; H; H01; H01B; H01B1/00; H01B1/20; H01B1/22; H10; H10W; H10W20/00; H10W20/40; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1089; Y10T156/1092; Y10T428/00; Y10T428/12; Y10T428/12014; Y10T428/12028; Y10T428/12063; Y10T428/12069; Y10T428/25; Y10T428/256; Y10T428/31504; Y10T428/31721
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
63 words
A method for bonding a semiconductor die to a substrate which comprises applying to the substrate a film of an adhesive formulation comprising an alloy of gallium-tin eutectic and gold dispersed in a solution of a polyimide resin; positioning a semiconductor die in contact with the film; pressing the die firmly in place; and curing the adhesive formulation to a solid bond material.
Claim 2
Independent Claim
63 words
A method for bonding a semiconductor die to a substrate which comprises applying to the substrate a film of an adhesive formulation comprising an alloy of gallium-tin eutectic and gold dispersed in a solution of a polyimide resin; positioning a semiconductor die in contact with the film; pressing the die firmly in place; and curing the adhesive formulation to a solid bond material.
Claim 3
Dependent Claim
56 words
The method according to claim 1 in which the adhesive formulation comprises (1) an alloy containing about 20 to 80 weight percent of gallium-tin alloy and 80 to 20 percent gold, based on a total of 100 weight percent, and (2) about 1 to 10 weight percent polyimide resin, based upon the weight of the alloy.
Claim 4
Dependent Claim
23 words
A high temperature-resistant, conductive adhesive composition comprising a mixture of (1) an alloy of gallium-tin eutectic and gold and (2) a polyimide resin.
Claim 5
Dependent Claim
23 words
A high temperature-resistant, conductive adhesive composition comprising a mixture of (1) an alloy of gallium-tin eutectic and gold and (2) a polyimide resin.
Claim 6
Dependent Claim
53 words
The compositionn according to claim 3 which comprises (1) an alloy containing about 20 to 80 weight percent of gallium-tin eutectic and 80 to 20 weight percent gold, based on a total of 100 weight percent, and (2) about 1 to 10 weight percent polyimide resin, based upon the weight of the alloy.
Claim 7
Dependent Claim
22 words
The composition according to claimm 4 which comprises 48.5 weight percent eutectic, 48.5 weight percent gold and 3 weight percent polyimide resin.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-11-11 | 1984-05-12 | 1984-11-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-11-11 | 1988-05-12 | 1988-11-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-11-11 | 1992-05-12 | 1992-11-11 | $7700.00 | Window Closed / Lapsed |