Abstract A process is disclosed for delineating a patterned electroconductive coating on a substantially nonconductive substrate. The process can be used on substrates having a thickness in excess of 50 microinches. The process involves forming a substantially continuous electroconductive film on a substrate. An air abrasive resistant continuous mask film of metallic material is applied to the electroconductive film and etched to form masked and unmasked portions of the electroconductive film corresponding to the desired patterned coating. The unmasked portions of the electroconductive film are removed to leave the masked portions of the electroconductive film remaining on the substrate. The mask film can then be removed from the electroconductive film resulting in the desired pattern delineated in the electroconductive film on the substrate or the mask can remain in place and be used to form an integral part of the device formed with the substrate.
A process for delineating a film pattern in an air abrasive electroconductive film coating material on a substantially nonconductive substrate comprising: forming a substantially continuous film coating of antimony doped tin oxide on the substrate, said film coating having a thickness between about 50 microinches and about 250 microinches; integrally applying to said film coating a mask film of metallic material which is air abrasive resistant relative to the antimony doped tin oxide; selectively etching said mask film to generate a mask to form masked and unmasked portions on said film coating corresponding to the desired pattern; and air abrading said film coating thereby leaving the masked portions of said film coating remaining on the substrate and removing the unmasked portions of said film coating.
Claim 2
Dependent Claim
125 words
A process for delineating a film pattern in an air abrasive electroconductive film coating material on a substantially nonconductive substrate comprising: forming a substantially continuous film coating of antimony doped tin oxide on the substrate, said film coating having a thickness between about 50 microinches and about 250 microinches; integrally applying to said film coating a mask film of metallic material which is air abrasive resistant relative to the antimony doped tin oxide; selectively etching said mask film to generate a mask to form masked and unmasked portions on said film coating corresponding to the desired pattern; and air abrading said film coating thereby leaving the masked portions of said film coating remaining on the substrate and removing the unmasked portions of said film coating.
Claim 3
Dependent Claim
29 words
The process as recited in claim 1 further comprising removing said mask from said film coating resulting in the desired pattern delineated in said film coating on the substrate.
Claim 4
Dependent Claim
153 words
A process for delineating a pattern in an air abrasive electroconductive film coating material on a substantially nonconductive substrate comprising: forming a substantially continuous film coating of antimony doped tin oxide on the substrate, said film coating having a thickness between about 50 microinches and about 250 microinches; integrally applying to said film coating a mask film of metallic material which is air abrasive resistant relative to said antimony doped tin oxide; selectively etching said mask film to generate a mask to form mask and unmasked portions on said film coating corresponding to the desired pattern; and air abrading the film coating with air abrading particles having a particle size of from about 10 microns to about 25 microns, said particles being propelled by an air pressure source of approximately 50 psi gauge, thereby leaving the masked portions of said film remaining on the substrate and removing the unmasked portions of said film.
Claim 5
Dependent Claim
153 words
A process for delineating a pattern in an air abrasive electroconductive film coating material on a substantially nonconductive substrate comprising: forming a substantially continuous film coating of antimony doped tin oxide on the substrate, said film coating having a thickness between about 50 microinches and about 250 microinches; integrally applying to said film coating a mask film of metallic material which is air abrasive resistant relative to said antimony doped tin oxide; selectively etching said mask film to generate a mask to form mask and unmasked portions on said film coating corresponding to the desired pattern; and air abrading the film coating with air abrading particles having a particle size of from about 10 microns to about 25 microns, said particles being propelled by an air pressure source of approximately 50 psi gauge, thereby leaving the masked portions of said film remaining on the substrate and removing the unmasked portions of said film.
Claim 6
Dependent Claim
129 words
A process for delineating a pattern in an air abrasive electroconductive film coating material on a substantially nonconductive substrate comprising: forming a substantially continuous film coating of antimony doped tin oxide on the substrate; integrally applying to said film coating a mask film of metallic material which is air abrasive resistant relative to said antimony doped tin oxide; selectively etching said mask film to generate a mask to form masked and unmasked portions on said film coating corresponding to the desired pattern; air abrading the film coating, thereby leaving the masked portions of said film coating remaining on the substrate and removing the unmasked portions of said film; and selectively removing said mask from said film coating to form areas of conduction within said mask on said film coating.
Claim 7
Dependent Claim
129 words
A process for delineating a pattern in an air abrasive electroconductive film coating material on a substantially nonconductive substrate comprising: forming a substantially continuous film coating of antimony doped tin oxide on the substrate; integrally applying to said film coating a mask film of metallic material which is air abrasive resistant relative to said antimony doped tin oxide; selectively etching said mask film to generate a mask to form masked and unmasked portions on said film coating corresponding to the desired pattern; air abrading the film coating, thereby leaving the masked portions of said film coating remaining on the substrate and removing the unmasked portions of said film; and selectively removing said mask from said film coating to form areas of conduction within said mask on said film coating.
Claim 8
Dependent Claim
20 words
The process as recited in claim 4 wherein said mask is selectively removed from said film coating by chemical etching.