Patent US4230754A successfully refreshed from Google Patents.
US4230754A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bonding electronic component to molded package
Assignee: Sprague Electric Co
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Filing: 1978-11-07
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Granted: 1980-10-28
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Expires: 1998-11-07
Abstract
Abstract An electronic component with leads attached is cleaned, a layer of an epoxy or epoxy-reactive silane is applied and cured, and then the package material is molded on. The silane layer bonds the component to the package and provides a fluid-tight seal therebetween. The silane is gamma-glycidoxypropyl- or gamma-aminopropyltrimethoxy or triethoxy silane.
Inventors
- 👤 John P. Maher
- 👤 Elsa Kam-Lum
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 15:09
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W74/476; H10D; H10D84/00; H10D84/01; H10D86/00; H10D86/01; H10W74/01; H10W74/10; H10W74/111; H10W74/121; H10W74/131; H10W74/137; Y; Y10; Y10T; Y10T428/00; Y10T428/23; Y10T428/239; Y10T428/29; Y10T428/2913; Y10T428/2933; Y10T428/2962; Y10T428/31504; Y10T428/31511; Y10T428/31525; Y10T428/31652; Y10T428/31663
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
124 words
In the manufacture of a fully-molded electronic component having leads attached thereto, the steps of: applying a thin seal layer of an epoxy-reactive silane directly onto said component including that portion of said attached leads adjacent said component, then curing said layer to co-react said silane with said component and leads and form said seal, then subjecting said component with attached leads and said seal to a transfer molding operation to surround said component and said portion of attached leads in an epoxy package, said silane being chosen from the group consisting of gamma-aminopropyl trimethoxy silane, gamma-aminopropyl triethoxy silane, gamma-glycidoxypropyl trimethoxy silane, and gamma-glycidoxypropyl triethoxy silane and bonding said sealed component and leads to said epoxy package by reaction during said transfer molding operation.
Claim 2
Dependent Claim
124 words
In the manufacture of a fully-molded electronic component having leads attached thereto, the steps of: applying a thin seal layer of an epoxy-reactive silane directly onto said component including that portion of said attached leads adjacent said component, then curing said layer to co-react said silane with said component and leads and form said seal, then subjecting said component with attached leads and said seal to a transfer molding operation to surround said component and said portion of attached leads in an epoxy package, said silane being chosen from the group consisting of gamma-aminopropyl trimethoxy silane, gamma-aminopropyl triethoxy silane, gamma-glycidoxypropyl trimethoxy silane, and gamma-glycidoxypropyl triethoxy silane and bonding said sealed component and leads to said epoxy package by reaction during said transfer molding operation.
Claim 3
Dependent Claim
61 words
A molded electronic component comprising an electronic network on a substrate with lead wires forming a unit, a sealing layer of epoxy silane or epoxy-reactive silane surrounding said unit and bonded thereto, and a molded epoxy package surrounding said unit and layer and bonded to said unit via said layer wherein said layer is cured prior to molding said epoxy package.
Claim 4
Dependent Claim
61 words
A molded electronic component comprising an electronic network on a substrate with lead wires forming a unit, a sealing layer of epoxy silane or epoxy-reactive silane surrounding said unit and bonded thereto, and a molded epoxy package surrounding said unit and layer and bonded to said unit via said layer wherein said layer is cured prior to molding said epoxy package.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-10-28 | 1984-04-28 | 1984-10-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-10-28 | 1988-04-28 | 1988-10-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-10-28 | 1992-04-28 | 1992-10-28 | $7700.00 | Window Closed / Lapsed |