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US4228338A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for implanting radioactive metal on a substrate

Assignee: Massachusetts Institute of Technology
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Filing: 1978-06-08
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Granted: 1980-10-14
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Expires: 1998-06-08
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Abstract

Abstract A process for implanting a precise quantity of radioactive metal on a metal substrate such as a cutting tool or other metal part subject to wear at the area or areas where the part is expected to wear during its operation. The presence of the radioactive spot can be sensed to determine the extent of wear during use. The radioactive metal is deposited from a wire formed of a core of the radioactive metal surrounded by a sheath of metal having a high thermal and electrical conductivity relative to the core. In operation, the wire contacts the metal surface under pressure and electric current is passed through the wire in order to (1) form a pit on the tool surface, (2) weld the radioactive metal in the pit and (3) evaporate a small portion of the conductive sheath adjacent the pit. A second current then is passed through the wire to break it near the bottom of the pit, leaving a small quantity of radioactive material welded to the bottom of the pit.

Inventors

  • 👤 Nathan H. Cook
  • 👤 Krishnamoorthy Subramanian

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 20:08
CPC Classifications
B; B23; B23K; B23K11/00; B23K11/10; B23K11/0013; B23K11/22

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 142 words
The process for implanting a metal in a desired amount on the surface of a metal substrate subject to wear during use which comprises contacting to said substrate a wire comprising a metal core surrounded by a sheath of a conductive metal, said sheath of conductive metal having a thickness between about 0.0001 and 0.002 inch and a conductivity greater than that of said core, applying an electrical voltage across said wire and substrate to generate an electrical discharge in order to (a) form a pit on said substrate, (b) to weld the wire in said pit and (c) to evaporate a small portion of the conductive sheath adjacent said pit thereby to leave a portion of said core uncoated, and generating a second discharge through said wire in order to sever only a portion of the uncoated core adjacent said substrate.
Claim 2
Dependent Claim 142 words
The process for implanting a metal in a desired amount on the surface of a metal substrate subject to wear during use which comprises contacting to said substrate a wire comprising a metal core surrounded by a sheath of a conductive metal, said sheath of conductive metal having a thickness between about 0.0001 and 0.002 inch and a conductivity greater than that of said core, applying an electrical voltage across said wire and substrate to generate an electrical discharge in order to (a) form a pit on said substrate, (b) to weld the wire in said pit and (c) to evaporate a small portion of the conductive sheath adjacent said pit thereby to leave a portion of said core uncoated, and generating a second discharge through said wire in order to sever only a portion of the uncoated core adjacent said substrate.
Claim 3
Dependent Claim 18 words
The process of claim 1 wherein the wire comprises tungsten with tungsten 185 surrounded by a copper sheath.
Claim 4
Dependent Claim 20 words
The process of claim 1 wherein the voltage used to generate each spark is between about 20 and 80 volts.
Claim 5
Dependent Claim 11 words
The process of claim 1 wherein said metal core is radioactive.

References Cited (Backward Citations)

US2612583A Cited
US2806128A Cited
US3061712A Cited
US3098150A Cited
US3415970A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1983-10-14 1984-04-14 1984-10-14 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1987-10-14 1988-04-14 1988-10-14 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1991-10-14 1992-04-14 1992-10-14 $7700.00 Window Closed / Lapsed

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