Micromodular electronic package

Claim 1

A micromodular electronic component package comprising: an electrically insulative base member; a pair of electrically conductive members carried on said base member in fixed spaced apart relationship so as to define a gap between adjacent ends of said conductive members; a rigid spacer of electrically insulative material fixly carried on said conductive members and provided with a central cavity exposing portions of said conductive members and said gap therebetween; a first electrical component secured to said rigid spacer within said cavity so as to totally occupy said cavity and having connective terminal ends in electrical and mechanical securement with the respective exposed portions of said conductive members; said conductive members include lugs carried on the edges thereof outwardly projecting from the perimeter of said component package and being fully exposed for external connection therewith; said electronic component package further incudes a second electrical component and a heat sink means substantially surrounding said second electrical component and arranged in heat transference relationship therewith; said heat sink means is a clip-like element of U-shaped configuration in side elevation; said heat sink element is releasably arranged about said second electrical component in snap-lock relationship; said heat sink element includes a plurality of fins outwardly projecting from an exposed surface thereof in heat dissipating transference with surrounding environment; said conductive member lugs are arranged at opposite ends of said package and outwardly project from opposite sides of said package.