Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
270 words
A method for producing a multistylus head device which comprises: (1) disposing on an insulating substrate a plurality of insulated wires at preprogrammed positions, and affixing each of said wires at its end portions to an adhesive material layer formed on said substrate, leaving the intermediate portions of the wires freely spaced from the surface of the adhesive material layer on the substrate, and applying a tension to said wires in their respective longitudinal directions to arrange said wires in parallel at predetermined equal intervals in close proximity to each other; (2) affixing said wires at their respective central portions to said adhesive material layer on the substrate, followed by fixedly securing the entire wires to the substrate by means of an overlay attached onto the surface of the adhesive material on the substrate; (3) forming, in said substrate at its positions in which said end portions of the insulated wires are located, through-holes traversing crosswise the insulated wires, to thereby expose the resulting cut sections of the insulated wires respectively on the inner walls of the through-holes; (4) electrolessly depositing metal layers respectively on the inner walls of the through-holes to collectively effect connection of said end portions of the insulated wires to the inner walls of the through-holes; and (5) cutting the substrate along a line in which the insulated wires are disposed in parallel at their respective central portions to expose free terminals of the insulated wires on the edge of the substrate formed by the cutting, thus forming a plurality of electrodes disposed in parallel at the predetermined equal intervals in close proximity to each other.
Claim 2
Independent Claim
270 words
A method for producing a multistylus head device which comprises: (1) disposing on an insulating substrate a plurality of insulated wires at preprogrammed positions, and affixing each of said wires at its end portions to an adhesive material layer formed on said substrate, leaving the intermediate portions of the wires freely spaced from the surface of the adhesive material layer on the substrate, and applying a tension to said wires in their respective longitudinal directions to arrange said wires in parallel at predetermined equal intervals in close proximity to each other; (2) affixing said wires at their respective central portions to said adhesive material layer on the substrate, followed by fixedly securing the entire wires to the substrate by means of an overlay attached onto the surface of the adhesive material on the substrate; (3) forming, in said substrate at its positions in which said end portions of the insulated wires are located, through-holes traversing crosswise the insulated wires, to thereby expose the resulting cut sections of the insulated wires respectively on the inner walls of the through-holes; (4) electrolessly depositing metal layers respectively on the inner walls of the through-holes to collectively effect connection of said end portions of the insulated wires to the inner walls of the through-holes; and (5) cutting the substrate along a line in which the insulated wires are disposed in parallel at their respective central portions to expose free terminals of the insulated wires on the edge of the substrate formed by the cutting, thus forming a plurality of electrodes disposed in parallel at the predetermined equal intervals in close proximity to each other.
Claim 3
Dependent Claim
175 words
A method according to claim 1 wherein: in the step (1); (a) said wires are grouped into a predetermined number of units and preselected units of wires are disposed, leaving, on both adjacent sides of the respective disposed units, spacings respectively for receiving additional units of wires; (b) the disposed wires are applied with tension in the respective longitudinal directions, to forcibly arrange the wires in parallel and in contact with each other and are secured to each other by means of an adhesive material; (c) the spacings left in the step (a) are disposed with other units of wires, the disposition of other units of wires being conducted without interference with adjacent units of wires disposed; and (d) the wires disposed in the step (c) are applied with tension in the respective longitudinal directions to forcibly arrange the wires in parallel and in contact with each other and are secured to each other by means of an adhesive material; whereby the plurality of insulated wires are disposed in parallel in contact with each other.
Claim 4
Dependent Claim
53 words
A method according to claim 2 wherein: in the step (a) the wires are disposed on a release film securely laid on the adhesive material layer; and in the step (c) the wires of other units are disposed on an additional release film securely laid over the wires disposed in the step (a).
Claim 5
Dependent Claim
35 words
A method according to claim 1 wherein: in the step 1 the tension is applied to the wires by bending the substrate, with the wired surface of the substrate being disposed in a convex state.